1. FPCCD VTX Overview Yasuhiro Sugimoto KEK 2014/12/18 @JSPS Tokubetsu-Suisin annual meeting 11

2. Outline FPCCD sensor R&D Beam test Readout electronics CO2 cooling FY2015 plan 2

3. Vertex detector for ILD Structure –Barrel part only: |z|=62.5/125 mm –Double-sided layer x3 –R=16~60mm –|cos  |<0.97 Minimization of material budget of ladders is a big challenge –0.3%X0/ladder = 0.15%X0/layer 3

4. FPCCD sensor R&D FYSenor 2004Fully depleted CCD, 24um pixel 2005Fully depleted CCD, 24um pixel 2006Fully depleted CCD, 24um pixel 20071 st FPCCD: small size (6mm 2 ),12um pixel 20082 nd FPCCD: small size, 12um pixel (modified output amp) 20093 rd FPCCD: small size, 12, 9.6, 8, 6um pixel 20104 th FPCCD: small size, 12, 9.6, 8, 6um pixel (modified process) Thin wafer:50um 2011Small size, 12, 9.6, 8, 6um pixel (modified process), thin wafer 2012Small size, 6um pixel, 4ch, different H-register size, high-R 15um epi Large size (12x64mm2), 6,8,12um pixel, 8ch, high-R 15um epi Small size, 6um pixel, thin wafer (for beam test), high-R 15um epi 2013Small size, 6um pixel, high-R 15um epi 4

5. FPCCD sensor R&D Original plan for sensor R&D in FY2014 –Small size 5um pixel Achievement –It was found that developing 5um pixel CCD is difficult for HPK Too big technical challenge which requires cost and manpower –Packaged prototypes with mixed size pixel (12, 9.6, 8, 6 um) and high-R 15um epi: Same format as FY2011 small prototype but with different epitaxial layer 5

6. FPCCD sensor R&D Test of sensors using beta/X-ray source –Systematic study of FPCCD property is mandatory Dark current as a function of temperature / pixel- size / irradiation Energy resolution for 5.9 keV X-ray Charge transfer inefficiency as a function of various parameters etc. –Some of the achievements will be reported by Tino and Ito-san 6

7. Beam test Neutron damage test at CYRIC –Two CCD sample were irradiated by neutron beam at CYRIC of Tohoku University –Detail will be reported by Ishikawa-san and Ito-san MIP beam test with ~1 GeV/c pion at J-PARC has not been done because the hadron-hall is not available yet Design of electron test beam line at KEK AR (South experimental hall) up to ~4.5 GeV is being carried out 7

8. Readout electronics Development of new clock driver and interface board –3-level clock to reduce power consumption –Interface board for the new clock drivers –Detail will be reported later 8

9. Cooling system for VTX R&D of 2-phase CO2 cooling is being carried out for FPCCD VTX (and TPC) using another funding A prototype of circulating cooling system using a gas compressor has been constructed –Cooling temperature: between −40 ℃ and +15 ℃ –The system has been tested, and we demonstrated that it can achieve the design cooling temperature 9

10. Cooling system for VTX Prototype of 2-phase CO2 cooling system 10 Cooling line at -40 ℃

11. FY2015 plan (tentative) FPCCD sensors –Small prototypes with same format as before –Systematic study of FPCCD property should be continued Ladder R&D –Mechanical ladder structure Original idea: Carbon foam (RVC) core sandwiched by CFRP sheets  Risk of carbon powder All CFRP structure seems better Electronics R&D –Readout speed of 10Mpix/s So far, stable readout of 2.5Mpix/s (25MHz clock) has been achieved Our goal is 10Mpix/s We have to find out the problem, and make improved readout system –Bare chip test board with similar structure to ladder CFRP base + Kapton FPC + bare chips 11

12. Backup slides 12

13. R&D goal FPCCD sensors –Pixel size; 6um –Chip size;1cmx6.5cm –Speed >10Mpix/s –F.W.C. > 10000 e(?) –Power <10mW/ch –Rad. Tolerance >1x10 13 e/cm 2 (=1x10 12 /cm 2 /y x 3y x safety factor 3) Readout ASIC –Speed > 10Mpix/s –Power < 6mW/ch –Noise < 30 electrons Peripheral circuit –Clock driver –Data suppression –Etc. Engineering R&D –Over-all design –Low-mass ladder –Cooling system (~-40 ℃ ) –Support structure  Engineering prototype 13  5um (?)

14. Ladder Structure Layer-1Layer-2,3 14