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Timepix at NIKHEFMedipix meeting, CERN – 13.09.20071 Some recents results at NIKHEF M. Chefdeville, E. Bilevych, H. van de Graaf, J. Timmermans D. Attié,

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Presentation on theme: "Timepix at NIKHEFMedipix meeting, CERN – 13.09.20071 Some recents results at NIKHEF M. Chefdeville, E. Bilevych, H. van de Graaf, J. Timmermans D. Attié,"— Presentation transcript:

1 Timepix at NIKHEFMedipix meeting, CERN – 13.09.20071 Some recents results at NIKHEF M. Chefdeville, E. Bilevych, H. van de Graaf, J. Timmermans D. Attié, P. Colas Medipix meeting, CERN – 13 September 2007

2 Timepix at NIKHEFMedipix meeting, CERN – 13.09.20072 Overview Pixel readout of gaseous detectors using Micromegas-like structures Adding functionalities to pixel readout chips by wafer post-processing –Gas gain grids: Ingrid –Discharge protection: Siprot Results with some Timepix chambers, 65k channel μTPC – 55 Fe source –Cosmic rays data – 90 Sr source in TOT and Time modes

3 Timepix at NIKHEFMedipix meeting, CERN – 13.09.20073 Processing Ingrids (MESA+, Univ. Twente) Substrate can be: –Si wafer with a patterned anode –Pixel readout chip Photo-resist coating & exposure –Define the amplification gap (tens of μm) –Define the supports (pillars/walls) Metal film deposition & patterning –Define the grid geometry Dissolve the un-exposed resist –+ some cleaning substrate photo-resist 20 μm pitch 50 μm pitch

4 Timepix at NIKHEFMedipix meeting, CERN – 13.09.20074 New Ingrid developments and results Process improvement: grids much flatter –Extremely good energy resolution: 13.6 % FWHM with 55 Fe in P10 –Removal of K β 6.5 keV line: 11.7 % @ 5.9 keV in P10 –With F=0.17 and N e = 229  gain fluctuation ~ 0.5 New wafer masks: hole pitches down to 20 μm with various diameters and gaps –Investigate Micromegas geometry –Test of the ion backflow theory feasible Until now: 1 μm thin Al but can now be increased to 5 μm by electrolysis Expect less damaged from sparks K α escape K β escape 13.6 % FWHM K β -filtered spectrum with Cr foil 11.7% FWHM Max Chefdeville (NIKHEF/Saclay) + Twente Univ. Gap: 50 μm; Hole picth: 32 μm,Ø: 14 μm

5 Timepix at NIKHEFMedipix meeting, CERN – 13.09.20075 Status of Timepix usage at NIKHEF 1 st Timepix (+ 3 μm Siprot): “under HV” Dec-Jan 2006 for 40 days He/isoButane 80/20 then died after ONE day with Ar/isoButane “Old” detector: (Timepix C08-W0014 + 3 μm Siprot): was “under HV” with He/isoButane 80/20 since 24 April (for 3 months!) Detector Next-1: (Timepix E09-W0014 + 20 μm Siprot + Ingrid): under HV for > one month with He/isoButane Detector Next-2: (Timepix + 20 μm Siprot + Ingrid): just started on Ar/isoButane Detector Next-3: (Medipix2.1 + 30 μm Siprot + Ingrid): gain 200k reached

6 Timepix at NIKHEFMedipix meeting, CERN – 13.09.20076 NIKHEF setup (on 24 Aug. 2007) Next-3 Next-1,2 “old”

7 Timepix at NIKHEFMedipix meeting, CERN – 13.09.20077 Irradiation: 55 Fe source Timepix chip + Micromegas mesh: Timepix chip + SiProt + Ingrid: Moiré effects “Uniform” MESA+ IMT Neuchatel CERN Medipix mode

8 Timepix at NIKHEFMedipix meeting, CERN – 13.09.20078 Cosmic rays A “long” cosmic track Timepix + 20 μm thick Siprot + Ingrid time He/Iso (80:20)

9 Timepix at NIKHEFMedipix meeting, CERN – 13.09.20079 Irradiation: 90 Sr source TOT mode Timepix + 20 μm Siprot + Ingrid in Next-1 5 ms/frame He/Iso (80:20)

10 Timepix at NIKHEFMedipix meeting, CERN – 13.09.200710 Irradiation: 90 Sr source Time mode 118 μs/frame Timepix + 20 μm Siprot + Ingrid in Next-1 He/Iso (80:20)

11 Timepix at NIKHEFMedipix meeting, CERN – 13.09.200711 Chip tiling: large(r) detector surfaces (2x2, 2x4 chips) Through Si connectivity: avoiding bonding wires Fast readout technology: ~5 Gb/s RELAXD project (Dutch/Belgian) NIKHEF, Panalytical, IMEC, Canberra: Hope for “through Si vias” (with Medipix chips) later this year! Further Developments


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