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Preparation of Module Assembly and Stringtest Haridas, Heinz, Marge One possibility for an assembly and test line? Preparation of a full string test –aim.

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Presentation on theme: "Preparation of Module Assembly and Stringtest Haridas, Heinz, Marge One possibility for an assembly and test line? Preparation of a full string test –aim."— Presentation transcript:

1 Preparation of Module Assembly and Stringtest Haridas, Heinz, Marge One possibility for an assembly and test line? Preparation of a full string test –aim of the tests –what are the parameters of DS, MS and Module Setup for String test and Laser test Next future Phobos Coll. Meeting @MIT April 97

2 One possibility for an assembly line Test of - PA chip - PL chip - DS DS assembl y DS function test DS pool MS assembly MS bonding Test of MS MS rework Sensor pool Module glueing Module bonding (fast) Module function test Module “long time” stability test Module calibration Module alignment measurement Module rework now soon

3 What do the tests aim for? Learn parameters of DS, MS and module –production (get selection critierias for DS+MS+sensors) –later operation (influence of Supply voltages, threshold,...) Module function and reliability –minimize effect of single component failure (eg. high leakage current on one sensor, defect DS on module) –test reliability of connections Stability –of noise, detector current, signal Signal response –signal calibration (gain, linearity) –dead channels

4 What are the parameters? tested on every componenton few components DS –dead channels –threshold –noise and signal gain MS –digital part and readout –voltages on DS Module –dead pads, noise, Idet, signal gain (-> Database) –optimal threshold DS –influence of supply voltages on signal gain, noise, linearity... MS – clock transmission –crosstalk, output signals Module –signal response and noise of different module types (correlation dE/dx vs Signal)

5 Test Setups in preparation - The Stringtest verify that the module works “Stringtest” Setup –now: for tests of DS –soon: test of MS –final: fast test of modules after glueing, rework Use of test pulses for –test function –noise measurement –gain & linearity Add a sensor to one DS Csource ENC vs load capacitance Q=Ct*V Ct V test gain & linearity in 0-5MIP range (e.g. Ct=1.0pF V=3.8mV ->Q= 1MIP PA16PL8Amod

6 Test Setups in preparation - The Lasertest understand the signal response Calibrate the signal response –measure each pad for 1, 2, 5, 10 MIP –find dead channels –create Database Stability test by source –noise –MIP signal (12h@2Hz = 28 hits/pad for 2 T1 = 84 hits/pad for 4 T5 –detector current 1064nm laser Sr90 source Idet Problems: absolute laser calibration, time stability, very precise X-Y stage support - optics, cooling, test time,...


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