1. Estimated schedule, costs and number of ABC130 needed Tony Affolder

2. ASIC schedules ABC130- joint submission with NA62 – FDR: Feb 8 th – Submission end of Feb/March – Receive 2 wafers (312 ASICs) In 6 weeks with accelerated turn-around (costs ~30k$) (May) In ~3 months with normal schedule (June/July) – Then probing, dicing, thinning adds X weeks/months For first wafers, might go straight to dicing and distribution HCC-MPW – Submission in May – Receive 1 wafer (40 or 80 ASICs) ~3 months later (Sept) ABC will arrive 3-6 months before the HCC. Need to plan size of HCC first order, work-plan for HCC-less objects.

3. Scope of Project Asked the communities plan for the next 3 years. Assume this submission will have to serve that time period – Final ASIC will be designed in 2015/2016 for pre- production exercise in 2016/2017 End Cap: 20 RX + 20 R0 + 40 R5 modules + 10 petalets Staves: 120 SS short-strip modules Super-modules: ~21 DS short-strip modules We will not need all chips at the beginning of the program – I would guess roughly 10%:40%:50% for 2013/14/15

4. Chip estimated needs Assuming a probing yield of 90%, 20% spares for studies/failures in EC and staves and 10% for failures in SM: – 7000 ABC130: 3200 stave, 2400 EC, 1400 SM For HCC, with 10% yields, 10% spares, and additional 60 for the stave and for the 30 EC needed for multi-drop LVDS cable studies – 920 HCC: 420 stave, 360 EC, 140 staves

5. ABC130 purchasing (1) At a minimum, need 48 wafers – 2 engineering runs + 1 production run – Good ASIC cost of $38 This assumes we pay for 100% of wafer cost; some fraction of 1 st engineering run will be split with NA62 – Will need to add dicing costs and any thinning costs per wafer Won’t know this detail until wafer layout done and thickness chosen – We again will not have to pay for the thinning and a fraction of dicing for the 1 st engineering run CERN had agreed to front money for purchase and have groups buy good ASICs – I think we should close the books at the end of each submisison with the 3 communities paying a fraction of current estimated need (45% stave/35% EC/ 20% SM)

6. ABC130 purchasing (2) I’m not sure if 2 nd engineering run is possible. We might have to purchase 1 engineering run + 2 production runs – Might give enough devices that we don’t have to share wafers after 1 st 2 with NA62. Means we can pick thickness to be more sensible for our needs – Good ASIC costs increases to $41+wafer dicing+thinning I would also expect if first ASICs look good, we will need to order more wafers quickly for the scale of the HCC-less work envisaged – At least 4 more wafers needed – Or we need to make the first order bigger For first run that would be: 47.25 k$ staves 36.75 k$ end cap 21 k$ super modules With dicing costs to be added For engineering run: 15.75 k$ staves 12.25 k$ end cap 7 k$ super modules

7. HCC purchasing This is much more tricky – Here’s the lowest cost path I could come up with using standard MOSIS MPW costing It would be good to confirm numbers I used – 1 st standard MPW (40 ASICS) – If good, 2 nd MPW with 3 die per reticual (120 ASICs) – If good, buy 7 extra wafers This clearly doesn’t work and we’ll have to find another shared engineering run or negotiate a lower cost solution with CERN MPW or MOSIS For now, we need to figure out if we need 40 or 80 HCC in the standard MOSIS route to get us started and start negotiations

8. Addition Needs As a programme, we will also need mechanical ABC130 and HCC for assembly and bonding trialling – If yield was as good as last time, bad die is really insufficient to meet this need I think we also need to launch a run of dummy ASICs (AL on glass) as soon as the ASIC bond pad location and size is set. – The AL should have all bond pads and fidicuals. We will also need single chip cards for DAQ loads and sensor studies. Would guess 15-20 for the community.