1. GLD DOD to do list and plan for IR section What to write in DOD What do be done before Jan-19 meeting (and after up to Bangalore meeting) - length : (guideline from H.Y.) ~ 5 pages - contents: FCAL/BCAL and pair monitor (anything else?)

2. What to write (FCAL/BCAL) An optimized detector technology/geometry for FCAL/BCAL Currently, we have FCAL (mask) BCAL H.B.Park (2005) We also have inputs from Y.Sugimoto but similar to this (FCAL z was 230 cm) Any change against 2 mRad/20 mRad options? Proposed technology : W-Si CAL (note: other concepts consider W-Si/W-diamond/PBWO4 crystal)  FCAL: 13 < r < 44 mRad  BCAL: 1.4 < r < 13 mRad  FCAL: 260 cm ~ 285 cm in z-direction 12 cm ~ 36 cm in r-direction  BCAL: 430 cm ~ 450 cm in z-direction 2 cm ~ 18 cm in r-direction

3. What to write (FCAL/BCAL) Segmentation (I took the liberty of extracting parameters from H.B.Park’s idea originated from SLD experience) FCALBCAL # of layers1023 Interaction length (X 0 ) 1.74/layer0.86/layer Any change against 2 mRad/20 mRad options? How do they interface with the pair background core… Luminosity measurement performance: people are talking about  L/L ~10 -4 in other concepts. We need study on this if to be included

4. What to write (pair monitor) Beam profile monitor using pixel detector (H.Yamamoto, snowmass2005) - hit locations for zero crossing angle and 20 mrad angle - expected  y for various B fields and crossing angles - pixel size : 0.4 x 0.4 mm - sensor size : 2.54 x 1.27 cm 2 - 27 by 54 pixels/sensor - readout electronics defined (preamp/discriminator/counter/latch) - readout circuit design and layout done (true?) - readout electronics submitted to fab (MOSIS, end of 2005. again true?)

5. What to be done (in general) FCAL/BCAL: Choice of technology and reason should be addressed - W-Si is baseline and W-diamond/PBWO4 as backup? (Need inputs from relevant people) FCAL/ECAL: Optimizing thickness/segmentation parameters - H.B.Park working on FCAL/ECAL: Performance - missing (simulation in progress, by H.B.Park) FCAL/ECAL: Readout electronics - completely missing (both technology and cost) FCAL/ECAL: Costing to Maki-san - communication with the company in progress for a rough estimation (H.B.Park) Pair monitor - realistic B field in sim., measurements on others (  x,horizontal shifts, azimuthal tilt of bunch, etc), updates on electronics R&D

6. What to be done (before Jan 19) Identify missing items to be included (need help from all of you) Rough cost estimate for FCAL/BCAL/pair monitor? - could it be delayed? - should it be easy? (It looks easy for FCAL/BCAL at least) Update on your R&D if not listed in this talk - I’ll be at KEK on Jan 19 so please use that slot (or email to eunil@hep.korea.ac.kr for communication before 19 th ) eunil@hep.korea.ac.kr

7. What to be done (longer term) Fill missing items FCAL/BCAL - Segmentation optimization - impact on background - electronics - simulation with physics Pair monitor - update on the readout electronics R&D - study with realistic B field - other parameters such as  x, horizontal shift, etc  Well defined technology choice (and reason) by the end of 2006