1. Techniques and Tools for Product-Specific Analysis Templates Towards Enhanced CAD-CAE Interoperability for Simulation-Based Design and Related Topics Russell Peak Senior Researcher Manufacturing Research Center Georgia Tech 2002 International Conference on Electronics Packaging (ICEP) JIEP/ IMAPS Japan, IEEE CPMT Japan Chapter Dai-ichi Hotel Seafort, Tokyo, Japan April 17-19, 2002 http://eislab.gatech.edu/pubs/conferences/2002-jiep-icep-peak/

2. 2 Abstract http://eislab.gatech.edu/pubs/conferences/2002-jiep-icep-peak/ Techniques and Tools for Product-Specific Analysis Templates Towards Enhanced CAD-CAE Interoperability for Simulation-Based Design and Related Topics Design engineers are becoming increasingly aware of “analysis template” pockets that exist in their product domain. For example, thermal resistance and interconnect reliability analysis are common templates for electronic chip packages, while tire-roadway templates exist to verify handling, durability, and slip requirements. Such templates may be captured as paper-based notes and design standards, as well as loosely structured spreadsheets and electronic workbooks. Often, however, they are not articulated in any persistent form. Some CAD/E software vendors are offering pre-packaged analysis template catalogs like the above; however, they are typically dependent on a specific toolset and do not present design-analysis idealization associativity to the user. Thus, it is difficult to adapt, extend, or transfer analysis template knowledge. As noted in places like the 2001 International Technology Roadmap for Semiconductors (ITRS), domain- and tool-independent techniques and related standards are necessary. This paper overviews infrastructure needs and emerging analysis template theory and methodology that addresses such issues. Patterns that naturally exist in between traditional CAD and CAE models are summarized, along with their embodiment in a knowledge representation known as constrained objects. Industrial applications for airframe structural analysis, circuit board thermomechanical analysis, and chip package thermal resistance analysis are noted. This approach enhances knowledge capture, modularity, and reusability, as well as improves automation (e.g., decreasing total simulation cycle time by 75%). The object patterns also identify where best to apply information technologies like STEP, XML, CORBA/SOAP, and web services. We believe further benefits are possible if these patterns are combined with other efforts to enable ubiquitous analysis template technology. Trends and needs towards this end are discussed, including analogies with electronics like JEDEC package standards and mechanical subsystems.

3. 3 Nomenclature

4. 4 Contents u Motivation u Introduction to Information Modeling and Knowledge Representation u Analysis Template Applications u International Collaboration on Engineering Frameworks u Recommended Solution Approach

5. 5 Motivation: Product Challenges Trend towards complex multi-disciplinary systems Source: www.ansys.com MEMS devices 3D interconnects http://www.zuken.com/solutions_board.asp Demanding End User Applications

6. 6 Motivation: Engineering Tool Challenges 2001 International Technology Roadmap for Semiconductors (ITRS) http://public.itrs.net/Files/2001ITRS/Home.htm u Design Sharing and Reuse –Tool interoperability –Standard IC information model –Integration of multi-vendor and internal design technology –Reduction of integration cost u Simulation module integration –Seamless integration of simulation modules –Interplay of modules to enhance design effectiveness

7. 7 Advances Needed in Engineering Frameworks 2001 International Technology Roadmap for Semiconductors (ITRS) http://public.itrs.net/Files/2001ITRS/Home.htm

8. 8 Analogy Physical Integration Modules  Model Integration Frameworks Multidisciplinary challenges require innovative solution approaches RF, Digital, Analog, Optical, MEMS Wafer Level Packaging System-On-a-Package (SOP) Stacked Fine-Pitch BGA www.shinko.co.jp www.prc.gatech.edu 2001 ITRS Design System Architecture

9. 9 Interoperability u Requires techniques beyond traditional engineering –Information models »Abstract data types »Object-oriented languages (UML, STEP Express, …) –Knowledge representation »Constraint graphs, rules, … –Web/Internet computing »Middleware, agents, mobility, … u Emerging field: engineering information methods –Analogous to CAD and FEA methods Seamless communication between people, their models, and their tools.

10. 10 Contents u Motivation u Introduction to Information Modeling and Knowledge Representation u Analysis Template Applications u International Collaboration on Engineering Frameworks u Recommended Solution Approach

11. 11 “Collaborative Modeling” vs. “Tool Usage” Existing Tools Tool A 1 Tool A n... Content Coverage Gaps Integration Gaps Product Model - integrated information model - knowledge representation

12. 12 Example Information Model in Express (ISO 10303-11) spring system tutorial SCHEMA spring_systems; ENTITY spring; undeformed_length : REAL; spring_constant : REAL; start : REAL; end0 : REAL; length0 : REAL; total_elongation : REAL; force : REAL; END_ENTITY; ENTITY two_spring_system; spring1 : spring; spring2 : spring; deformation1 : REAL; deformation2 : REAL; load : REAL; END_ENTITY; END_SCHEMA;

13. 13 Instance Model and Example Application spring system tutorial Fragment from an instance model - (a.k.a. Part 21 “STEP File” - ISO 10303-21) #1=TWO_SPRING_SYSTEM(#2,#3,1.81,3.48,10.0); #2=SPRING(8.0,5.5,0.0,9.81,9.81,1.81,10.0); #3=SPRING(8.0,6.0,9.8,19.48,9.66,1.66,10.0);

14. 14 PWB Stackup Design & Analysis Tool

15. 15 Application-Oriented Information Model - Express-G notation PWB Stackup Design & Analysis Tool

16. 16 Contents u Motivation u Introduction to Information Modeling and Knowledge Representation u Analysis Template Applications u International Collaboration on Engineering Frameworks u Recommended Solution Approach

17. 17 Analysis Template Catalog: Chip Package Simulation thermal, hydro(moisture), fluid dynamics(molding), mechanical and electrical behaviors u PakSi-TM and PakSi-E tools http://www.icepak.com/prod/paksi/ as of 10/2001 u Chip package-specific behaviors: thermal resistance, popcorning, die cracking, delaminating, warpage & coplanarity, solder joint fatigue, molding, parasitic parameters extraction, and signal integrity

18. 18 Analysis Template Methodology & X-Analysis Integration Objectives (X=Design, Mfg., etc.) u Goal: Improve engineering processes via analysis templates with enhanced CAx-CAE interoperability u Challenges (Gaps): –Idealizations & Heterogeneous Transformations –Diversity: Information, Behaviors, Disciplines, Fidelity, Feature Levels, CAD/CAE Methods & Tools, … –Multi-Directional Associativity: Design  Analysis, Analysis  Analysis u Focus: Capture analysis template knowledge for modular, regular design usage u Approach: Multi-Representation Architecture (MRA) using Constrained Objects (COBs)

19. 19 X-Analysis Integration Techniques for CAD-CAE Interoperability http://eislab.gatech.edu/tools/XaiTools/ a. Multi-Representation Architecture (MRA)b. Explicit Design-Analysis Associativity c. Analysis Module Creation Methodology

20. 20 COB-based Constraint Schematic for Multi-Fidelity CAD-CAE Interoperability Flap Link Benchmark Example

21. 21 An Introduction to X-Analysis Integration (XAI) Short Course Outline Part 1: Constrained Objects (COBs) Primer –Nomenclature Part 2: Multi-Representation Architecture (MRA) Primer –Analysis Integration Challenges –Overview of COB-based XAI Part 3: Example Applications »Airframe Structural Analysis (Boeing) »Circuit Board Thermomechanical Analysis (DoD, JPL/NASA) »Chip Package Thermal Analysis (Shinko) –Summary Part 4: Advanced Topics & Current Research

22. 22 Chip Package Products Shinko Plastic Ball Grid Array (PBGA) Packages Quad Flat Packs (QFPs)

23. 23 Flexible High Diversity Design-Analysis Integration Electronic Packaging Examples: Chip Packages/Mounting Shinko Electric Project: Phase 1 (completed 9/00) EBGA, PBGA, QFP Analysis Modules (CBAMs) of Diverse Behavior & Fidelity FEA Ansys General Math Mathematica Analyzable Product Model XaiTools ChipPackage Thermal Resistance 3D3D Modular, Reusable Template Libraries Analysis Tools Design Tools PWB DB Materials DB* Prelim/APM Design Tool XaiTools ChipPackage Thermal Stress Basic 3D** ** = Demonstration module Basic Documentation Automation Authoring MS Excel

24. 24 COB-based Analysis Template Typical Highly Automated Results FEA Temperature Distribution Thermal Resistance vs. Air Flow Velocity Auto-Created FEA Inputs (for Mesh Model) Analysis Module Tool COB = constrained object

25. 25 Pilot & Initial Production Usage Results Product Model-Driven Analysis u Reduced FEA modeling time > 10:1 (days/hours  minutes) u Reduced simulation cycle > 75% u Enables greater analysis intensity  Better designs u Leverages XAI / CAD-CAE interoperability techniques –Objects, Internet/web services, ubiquitization methodology, … References [1] Shinko 5/00 (in Koo, 2000) [2] Shinko evaluation 10/12/00 VTMB = variable topology multi-body technique [Koo, 2000]

26. 26 Analysis Template Merits u Provides methodology for bridging associativity gap u Multi-representation architecture (MRA) & constrained objects (COBs): –Address fundamental issues »Explicit CAD-CAE associativity: multi-fidelity, multi-directional, fine-grained –Enable analysis template methodology  Flexibility & broad application u Increase quality, reduce costs, decrease time (ex. 75%) : »Capture engineering knowledge in a reusable form »Reduce information inconsistencies »Increase analysis intensity & effectiveness

27. 27 Contents u Motivation u Introduction to Information Modeling and Knowledge Representation u Analysis Template Applications u International Collaboration on Engineering Frameworks u Recommended Solution Approach

28. 28 u Today:- Monolithic software applications; Few interchangeable “parts” u Next Steps: - Identify other formal patterns and use cases (natural subsystems / levels of “packaging”) - Define standard architectures and interfaces among subsystems Towards Greater Standards-Based Interoperability Target Analogy with Electronics Systems Generic Geometric Modeling Tools, Math Tools, FEA Tools, Requirements & Function Tools, … Product-Specific Simulation-Based Design Tools Linkages to Other Life Cycle Models Extended MRA SMMs ABBs CBAMs APMs Middleware

29. Russell Peak - Georgia Tech, Atlanta GA, USA Mike Dickerson - JPL/NASA, Pasadena CA, USA Lothar Klein - LKSoft, Kuenzell, Germany Steve Waterbury - NASA-Goddard, Greenbelt MD, USA Greg Smith - Boeing, Seattle WA, USA Tom Thurman - Rockwell Collins, Cedar Rapids IA, USA Jim U'Ren - JPL/NASA, Pasadena CA, USA Ken Buchanan - ATI/PDES Inc., Charleston SC, USA Progress on Standards-Based Engineering Frameworks that include STEP AP210 (Electronics), PDM Schema, and AP233 (Systems) An Engineering Framework Interest Group (EFWIG) Overview 2002 NASA-ESA Workshop on Aerospace Product Data Exchange ESA/ESTEC, Noordwijk (ZH), The Netherlands April 9-12, 2002 ISO 10303 series

30. 30 Scope of Engineering Framework Interest Group A PDES Inc. Systems Engineering Subproject http://eislab.gatech.edu/efwig/ u Interoperability in multi-disciplinary engineering development environments –Emphasis dimensions: »Organizational Level: engineering group/department »Domains: systems & s/w engineering, electromechanical, analysis »Design stages: WIP designs at concept, preliminary, and detailed stages –Awareness of design interfaces to other life cycle phases: »pursuit & order capture, mfg., operation/service, and disposal An international consortium for standards-based collaborative engineering http://pdesinc.aticorp.org/

31. 31 User/Owner/Operator Acquisition Authority Systems Engineering ManagementMarketing User/Owner/Operator Business Strategy Concept RFPProposalContractManagement Info Mechanical Electrical Chemical Digital Civil Controls Communications Logistics Maintenance Manufacture STEP ISO SC4 Specifications Software UML ISO SC7 Engineering Disciplines What is the context of Systems Engineering? 2002-04 - Mike Dickerson, NASA-JPL

32. 32 Spacecraft Development Using ISO 10303 and Other Standards Mechanical Engineering Standard: AP203, AP214 Software Pro-E, Cadds, SolidWorks, AutoCad, SDRC IDEAS, Unigraphics, others Status: In Production Aerospace Industry Wide, Automotive Industry Electrical Engineering Standard: AP210 Software Mentor Graphics Status: Prototyped Rockwell, Boeing Cabling Standard: AP212 Software MentorGraphics Status: Prototyped Daimler-Chrysler, ProSTEP Structural Analysis Standard: AP209 Software: MSC Patran, Thermal Desktop Status: In Production Lockheed Martin, Electric Boat Thermal Radiation Analysis Standard: STEP-TAS Software: Thermal Desktop, TRASYS Status: In Production ESA/ESTEC, NASA/JPL & Langely Software Engineering Standard:: UML - (AP233 interface In Development) Software: Rational Rose, Argo, All-Together Status: In Production Industry-wide Machining Standard:: STEP-NC/AP224 Software:: Gibbs, Status:: In Development / Prototyped STEP-Tools, Boeing Inspection Standard: AP219 Software: Technomatics, Brown, eSharp Status : In Development NIST, CATIA, Boeing, Chrysler, AIAG Systems Engineering Standard: AP233 Software: Statemate, Doors, Matrix-X, Slate, Core, RTM Status : In development / Prototyped BAE SYSTEMS, EADS, NASA PDM Standard: STEP PDM Schema/AP232 Software: MetaPhase, Windchill, Insync Status: In Production Lockheed Martin, EADS, BAE SYSTEMS, Raytheon Life-Cycle Management Standard: PLCS Software: SAP Status: In Development BAE SYSTEMS, Boeing, Eurostep File: SLIDE_STEP-in-Spacecraft-Development-Ver4.ppt Fluid Dynamics Standard: CFD Software - Status: In Development Boeing, Optics Standard: NODIF Software - TBD Minolta, Olympus Propulsion Standard: STEP-PRP Software:- Status: In Development ESA, EADS 2001-12-16 - Jim U’Ren, NASA-JPL

33. 33 Product Enclosure External Interfaces Printed Circuit Assemblies (PCAs/PWAs) Die/ChipPackage Packaged Part Interconnect Assembly Printed Circuit Substrate (PCBs/PWBs) Die/Chip STEP AP 210 (ISO 10303-210) Domain: Electronics Design R ~800 standardized concepts (many applicable to other domains) Development investment: O(100 man-years) over ~10 years Adapted from 2002-04 - Tom Thurman, Rockwell-Collins

34. 34 Rich Features in AP210: PWB traces AP210 STEP-Book Viewer - www.lksoft.com

35. 35 Rich Features in AP210: Via/Plated Through Hole Z-dimension details …

36. 36 Rich Features in AP210: Electrical Component The 3D shape is generated from these “smart features” which have electrical functional knowledge. Thus, the AP210-based model is much richer than a typical 3D MCAD package model. 210 can also support the detailed design of a package itself (its insides, including electrical functions and physical behaviors).

37. 37 Rich Features in AP210: 3D PCB Assembly

38. 38 PWA/PWB Assembly Simulation using AP210 Rules (From Definition Facility) Generic Manufacturing Equipment Definitions Specific Manufacturing Equipment Used User Alerted on Exceptions to Producibility Guidelines 2002-03 - Tom Thurman, Rockwell-Collins

39. 39 Analogy Physical Integration Modules  Model Integration Frameworks Challenge: Integrating Diverse Technologies RF, Digital, Analog, Optical, MEMS Wafer Level Packaging System-On-a-Package (SOP) Stacked Fine-Pitch BGA www.shinko.co.jp www.prc.gatech.edu 2001 ITRS Design System Architecture

40. 40 Recommended Solution Approach u Philosophy: Consider engineering design environments as analogous to electronic packaging systems u Leverage international collaboration with other industries u Follow systems engineering approach –Decompose problem into subsystems »Architectures, components (standards, tools, …), and techniques –Identify & define gaps –Identify existing solutions where feasible –Define solution paths »Identify who will “supply”/develop these “components” –Develop & prototype solutions –Advocate solution standardization and vendor support –Test in pilots –Deploy in production usage