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SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl Innovative products Innovative technologies.

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Presentation on theme: "SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl Innovative products Innovative technologies."— Presentation transcript:

1 SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, Warszawa; tel , ; Innovative products Innovative technologies Innovative products Innovative technologies

2 SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, Warszawa; tel , ; –foundation of SEMICON Sp. z o.o – first signed distribution agreement: LEM NORMA 1993 – 1996 – next distribution agreement: Kontakt Chemie, Schurter, Multi- Contact 1997 – SMT assembly line launch 1998 – launch of an electronics store in Warsaw (Wolumen) 2003 – implementation of the ISO 9001:2008 quality system 2009 – starting stencils laser cutting service SEMICON Sp. z o.o. History: History:

3 SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, Warszawa; tel , ; – project: GreenRose (FP6) – project: Tele-Ekg (FP6) – project: Radi-Cal (FP7) – project: ChipCheck (FP7) – project: µBGA (FP7) SEMICON Sp. z o.o. Participation in EU Framework Programmes Participation in EU Framework Programmes:

4 SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, Warszawa; tel , ; Currently, the company employs over 50 people including headquarter, production and shop. Starting from 1st January 2013 we are participating in a new national project - Innovative advanced surface mount technology (SMT) printed circuit boards. SEMICON Sp. z o.o. Source: STATS ChipPAC Source: PCB-togo.com Source: code.google.com Today: Today:

5 Certificates ISO 9001:2008 ISO 9001:2008 ISO ISO AQAP 2110 AQAP 2110 We only work with companies which have UL certificates SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, Warszawa; tel , ;

6 Distribution: Electronic components Electronic components Electronic materials Electronic materials Measuring equipment and accesories Measuring equipment and accesories SEMICON Sp. z o.o. - business areas

7 SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, Warszawa; tel , ; Subcontracting: PCB assembly (THT, SMT) PCB assembly (THT, SMT) Laser cut SMT stencils manufacturing Laser cut SMT stencils manufacturing Own production of laser modules SEMICON Sp. z o.o. - business areas

8 SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, Warszawa; tel , ; THT and SMT assembly More than 15 years experience in electronics More than 15 years experience in electronics Customer support from design to production Customer support from design to production Engineering consultancy Engineering consultancy Direct contact to supply chain Direct contact to supply chain ESD control ESD control IPC-A-610 trained employees IPC-A-610 trained employees Compliance with RoHS Compliance with RoHS PCB Design possibilities PCB Design possibilities Component supply possibilities Component supply possibilities

9 SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, Warszawa; tel , ; Production capacity - SMT assembly 4 SMT lines 4 SMT lines prototypes, small, medium series prototypes, small, medium series PCB size: max. 800 x 510 mm PCB size: max. 800 x 510 mm Components: x 74 mm, PoP Components: x 74 mm, PoP PCB thickness: 0.2 mm - 4.0mm, flex PCB assembly PCB thickness: 0.2 mm - 4.0mm, flex PCB assembly Pitch: 0.20 mm Pitch: 0.20 mm Selective conformal coating possibilities Selective conformal coating possibilities Glue, solder paste possibilities Glue, solder paste possibilities AOI inspection, functional tests, test probes, BGA – X-ray measurements AOI inspection, functional tests, test probes, BGA – X-ray measurements Hot Bar technologies (flex, LCD) Hot Bar technologies (flex, LCD) Źródło: JUKI Co.

10 SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, Warszawa; tel , ; Manual soldering Manual soldering Lead wave soldering Lead wave soldering PB-free wave soldering in nitrogen PB-free wave soldering in nitrogen 1.2 mln THT components monthly/1 shift 1.2 mln THT components monthly/1 shift Production capacity - THT assembly

11 SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, Warszawa; tel , ; Main customers Medical Medical Defence Defence Automotive Automotive Energoelectronic Energoelectronic Lighting Lighting Telecomm Telecomm R&D R&D

12 SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, Warszawa; tel , ; Stencils laser cutting High-speed cutting machine LPKF Stencil Laser G6060 High-speed cutting machine LPKF Stencil Laser G6060 Frame or frameless stencils Frame or frameless stencils Accuracy and repeatability: ±2µ Accuracy and repeatability: ±2µ Material: stainless steel, nickel Material: stainless steel, nickel Thickness: up to 600µm (oxygen cutting) Thickness: up to 600µm (oxygen cutting) Engineering, modifications, e.g. glue stencils Engineering, modifications, e.g. glue stencils Aperture inspection – high resolution scanner Aperture inspection – high resolution scanner Tension inspection Tension inspection Źródło: LPKF Laser & Electronics AG

13 SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, Warszawa; tel , ; Laser modules Laser modules Wavelenghts: nm Wavelenghts: nm Power input: 0,2 – 500mW Power input: 0,2 – 500mW Pointers Pointers Line and cross generators Line and cross generators Customization Customization Laser displacement sensors: Laser displacement sensors: Resolution: up to 10µm Resolution: up to 10µm Measurement range: up to 200mm Measurement range: up to 200mm Measurement distance: up to 50m Measurement distance: up to 50m System includes: laser module and position detector System includes: laser module and position detector Optoelectronic equipment manufacturing

14 SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, Warszawa; tel , ; Pointers Pointers Cross-hair pointers Cross-hair pointers Alarm systems, laser barriers Alarm systems, laser barriers Sensors Sensors Positioning systems Positioning systems Textile industry Textile industry Wood processing: Wood processing: Wood cutting Wood cutting Stone cutting Stone cutting Metal cutting Metal cutting Tire industry Tire industry Mining industry Mining industry Laser modules applications

15 SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, Warszawa; tel , ; Miniaturization in electronics Source: pl.wikipedia.org Passive Components

16 SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, Warszawa; tel , ; Miniaturization in electronics - ICs Source: Amkor Technology, Inc

17 SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, Warszawa; tel , ; SMT challenges components – paste screenprinting components – paste screenprinting QFN, DFN components – lifting effect, voids QFN, DFN components – lifting effect, voids Large and fine pitch BGAs – thermal balance, voids, head in pillow effect Large and fine pitch BGAs – thermal balance, voids, head in pillow effect PoP components – warpage, placing, BGAs errors PoP components – warpage, placing, BGAs errors Large PCB assembly – bow and twist Large PCB assembly – bow and twist

18 SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, Warszawa; tel , ; First generation: multi-level structures First generation: multi-level structures Second generation: PoPs Second generation: PoPs Next generation: TMV PoPs, BVA PoPs Next generation: TMV PoPs, BVA PoPs 3D package development Source: Invensas Co Source: Amkor Technology, Inc. World trends: higher density PoP

19 SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, Warszawa; tel , ; Why PoP? Higher speed, lower energy consumption Higher speed, lower energy consumption Memory chips from different vendors Memory chips from different vendors Different types of memory chips: speed, capacity, etc Different types of memory chips: speed, capacity, etc Separate inspection of processor and memory chips Separate inspection of processor and memory chips Lower junction temperatures (at least compared to stacked die) Lower junction temperatures (at least compared to stacked die) PoP – Package on Package Source: ElectroIQ

20 SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, Warszawa; tel , ; PoP stacking assembly options: PoP stacking assembly options: PoP – Package on Package Source: Panasonic Co

21 SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, Warszawa; tel , ; TMV PoP – Thru Mold Via Package on Package ® Source: Amkor Technology, Inc. Dimension control vias reduces the distance between the system memory and the TMV after their assembly.

22 SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, Warszawa; tel , ; Why TMV PoP? Improved warpage control and bottom package thickness. High density stacked (memory) interface. Increased die to package size ratio. TMV can provide over a 30% increase in maximum die size. Improved board level reliability. Improved fine pitch SMT process window. Supports Wirebond, flip chip devices (both area array solder and fine pitch CuPillar), stacked die and passive components integration.TMV could also be applied to FlipStack® (combo FC+WB) and FC w/ TSV stacks. TMV PoP – Thru Mold Via Package on Package ® Source: IMAPS.

23 SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, Warszawa; tel , ; BVA PoP – Bond Via Array Package on Package Why BVA PoP? The increase in the number of connections to the logic circuits from 300 to over The increase in the number of connections to the logic circuits from 300 to over Reduction of PoP total thickness (lower than TMV PoP). Reduction of PoP total thickness (lower than TMV PoP). Source: Invensas Co Reducing the pitch (up to 0.2mm) of the processor through wire leads increases the number of possible connections in the POP system.

24 SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, Warszawa; tel , ; BVA PoP – Bond Via Array Package on Package Source: Invensas Co Copper wires, height of 400µm pitch of 240µm.

25 SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, Warszawa; tel , ; Perspectives for PoP solutions Source: Gartner, Inc What next?

26 SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, Warszawa; tel , ; Thank you for attention! Piotr Ciszewski


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