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Module Metrology Peter Sutcliffe. Peter Sutcliffe – Module Metrology Wenzel CMM Module Metrology carried out on Wenzel CMM with module jig aligned along.

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Presentation on theme: "Module Metrology Peter Sutcliffe. Peter Sutcliffe – Module Metrology Wenzel CMM Module Metrology carried out on Wenzel CMM with module jig aligned along."— Presentation transcript:

1 Module Metrology Peter Sutcliffe

2 Peter Sutcliffe – Module Metrology Wenzel CMM Module Metrology carried out on Wenzel CMM with module jig aligned along the X axis

3 Peter Sutcliffe – Module Metrology Touch Probe Each touch probe measurement starts with measuring the base and pin to establish datums. There are 3 touch probe measurements: Pedestal before grinding cooling face Pedestal after grinding cooling face Module measurement of hybrid and cooling face

4 Peter Sutcliffe – Module Metrology Optical Measurement of Silicon planes Optical Measurement carried out using Renishaw VPN 625 and X250 lens. First measure horizontal base and vertical post to establish datums. 10 point R and Phi planes to measure 5 fiducial points and 5 other points on silicon 9 point measurement of gold + and o to establish planarity of hybrid.

5 Peter Sutcliffe – Module Metrology Optical Measurement of Silicon Edges. First measure 2 holes to establish module CL Take 6 point line to measure Phi and R edge.

6 Peter Sutcliffe – Module Metrology Data Added to Database Data outputted to a txt file and updated onto database. Pedestal: Before Grinding: Add base paddle metrology summary file. After Grinding: Add base paddle metrology summary file. Module: First Full Metrology: Phi Summary Phi Silicon Plane Phi Hybrid Plane R Summary R Silicon Plane R Hybrid Plane Top Summary Top Phi Edge Top R edge Second Metrology after Cable Attachment: Top Summary Top Phi Edge Top R edge Final Metrology after Burn in: Top Summary Top Phi Edge Top R edge


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