1. 4/8/2002, Monday Scientists

2. Interfacial Fracture

3. Interfacial Fracture (Scientists) J.W. Hutchinson J.R. Rice Z. Suo

4. Complex Singular Stress Field

5. Stress Oscillation Mode Mixty

6. Electronic Packaging

7. MEMS Packaging MicroElectroMechanical Systems

8. Processing Very Small Peripheral Array (VSPA)

9. Thin Film Nix

10. Thin Film Technology

11. Thin Film Processing

12. Film Growth Zuqiang Qi Bo Shi

13. Electroceramics Z. Suo

14. Damage Mechanics Jean-Louis Chaboche Voyiadjis, G.Z. and Robert Dorgan Gradient formulation in coupled damage-plasticity Archives of Mechanics, 53, 565-597

15. Composite Toughness EFFECTS OF PULL-OUT ON THE MECHANICAL- PROPERTIES OF CERAMIC-MATRIX COMPOSITES THOULESS MD, EVANS AG ACTA METALLURGICA, 36 (3): 517-522, 1988

16. Fiber Pull-out Amol Jadhav