1. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 CHAPTER 5

2. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Master Figure

3. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 5.1 Smart Personal Assistant Smart Miniaturized Bio Implant Cell Phone TODAY Cell Phone NEAR FUTURE Fully Embedded FUTURE DISCRETE LIMITED COMPONENT INTEGRATION FULL INTEGRATION (Courtesy: Chosun) Camcorder Audio Game Digital Camera Cell Phone TV MP3 GPS Computer

4. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 5.2 Board IC Package Discrete Nanoscale 10 - - 20% System 80-90% System Milli-scale Low functional density Bulky Costly Low reliability Connectors Board IC Package Discrete Nano-scale 10-20 % System 80-90 % System Milli-scale Low functional density Bulky Costly Low reliability Connectors

5. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 5.3 TRANS- CEIVER/ PHY TRANS- CEIVER/ PHY BASE- BAND/ MAC BASE- BAND/ MAC CMOS RF-CMOS or SiGe Simple RF Maybe SoC PA LNA Switch Active Passive RF Front End No Moore’s LawMoore’s Law Works

6. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 5.4 Package LNA Mixer VCO PA Antenna Filter Balun High-Q L/C Inductors Driver Amp Duplexer Switch Power Combiner Resistors Capacitors Duplexer Fluidics Duplexer MEMS MMIC CMOS

7. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 5.5 5 micron lithography PAST Ceramic thick film 200 microns Lithography CURRENT 100 components/cm 2 50 micron Lithography FUTURE (10X reduction in X, Y and Z) MEMSBAW GaAs RFCMOS 1000 components/cm 2

8. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 5.6 Modeling Simulation Miniaturized Multifunction RF Systems Substrate Technologies Reliability Antennas RFIDs Switches Passive/ Active Passive Components Passive Circuits  Ceramic  Glass  Organic  Silicon  Capacitors  Resistors  Inductors  Filters  Duplexers  Baluns  Couplers  Combiners  Dividers

9. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Figs. 5.7 a, b (a) (b)

10. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Figs. 5.8 a, b, c

11. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 5.9

12. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 5.10

13. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 5.11

14. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Figs. 5.12 a, b Shielding metal case Folded flexible LCP layer Thru holes Signal line on M1 (a)(b)

15. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Figs. 5.13 a, b (a)(b)

16. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Figs. 5.14 a, b (a)(b)

17. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Figs. 5.15 a, b (a)(b)

18. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 5.16

19. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 5.17

20. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 5.18

21. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 5.19

22. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 5.20 Air Cavity Ground plane Inductor Dielectric

23. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 5.21 Ground plane via h d

24. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 5.22

25. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 5.23

26. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 5.24

27. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Figs. 5.25 a, b 0 2 4 6 8 10 12 14 16 Frequency (GHZ) 60 50 40 30 20 10 0 Resistance (Ohm) (a)(b)

28. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 5.26

29. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Figs. 5.27 a, b, c Freq (2.00 GHz to 40.00 GHz) S(2,2) S(1,1) (a)(b)(c)

30. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Figs. 5.28 a, b

31. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 5.29

32. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 5.30 Return loss Insertion loss 8 10 12 14 16 18 20 Frequency (GHz) 0 -2 -3 -4 -5 -6 -7 -8 -9 -10 Magnitude (dB) Simulated Measured

33. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 5.31

34. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 5.32

35. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Figs. 5.33 a, b, c (a) (b) (c)

36. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Figs. 5.34 a, b, c (a)(b) (c)

37. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 5.35 0 -5 -10 -15 -20 -25 -30 -35 -40 12 13 14 15 16 17 18 Frequency (GHz) Magnitude (dB) S21 S11

38. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Figs. 5.36 a, b (a) (b)

39. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Figs. 5.37 a, b (a) (b)

40. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 5.38

41. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Figs. 5.39 a, b (a) (b)

42. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 5.40

43. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Figs. 5.41 a, b (a) (b)

44. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 5.42

45. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Figs. 5.43 a, b (a) (b)

46. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Figs. 5.44 a, b, c (a) (b) (c)

47. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Figs. 5.45 a, b (a) (b)