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Copyright © 2004 Toshiba Corporation. All rights reserved. Confidential Konrad Szombara April 2006 TS608 Hardware Presentation
2 / Hardware Presentation 2 Hardware Specification / Chipset GSM ProcessorAD6527B Codec IC (Power Controller)AD6238B Backend ICAIT811 Melody ICWM8976 RF (PA & transceiver)SKY77328 & SKY74117
3 / Hardware Presentation 3 Handset Block Diagram - Baseband
4 / Hardware Presentation 4 Baseband Component Layout GSM Processor U101 (AD6527B) Memory IC U mb Backend IC U403 (AIT811) FM Radio IC U502 (SI4701) Power Controller/Codec IC U201 (AD6538B)
5 / Hardware Presentation 5 Baseband Component Layout Continued Melody IC U503 (WM8976)
6 / Hardware Presentation 6 Handset Block Diagram - RF
7 / Hardware Presentation 7 RF Component Layout PA U1101 (SKY77328) Transceiver U1201 (SKY74117) Blue Tooth IC U1002 (BC313141A03)
8 / Hardware Presentation 8 Mechanical Connectors Location USB – J500 RTC – BAT101 BATT – J201 Antenna – J1002 Carkit – J1101
9 / Hardware Presentation 9 Mechanical Connectors Location - Continued Flash Card Holder J1 Sim Holder – J600
10 / Hardware Presentation 10 ACF – Anisotropic Conductive Film A cheap and reliable way of Bonding Can be done two ways -Using ACF Tape -Using ACP (Anisotropic Conductive Paste)
11 / Hardware Presentation 11 ACF – What do you need to repair? Dust Free Enviroment ACF Tape ACP - Anisotropic Conduct Paste Correct Equipment -Heating equipment -PCB Fixtures Complete ESD environment
12 / Hardware Presentation 12 ACF – Acceptable Equipment ACF Hot Bar machine Spot Heater PCB Jig Paste
13 / Hardware Presentation 13 ACF – Unacceptable Equipment Simple Hot Bar Machine -No Guidelines -Human Error -Non ESD. -Susceptible to Dust -No Reliability
14 / Hardware Presentation 14 Power On Procedure
15 / Hardware Presentation 15 Power Management
16 / Hardware Presentation 16 Keypad Matrix
17 / Hardware Presentation 17 Audio System
18 / Hardware Presentation 18 Thank You By Konrad Szombara
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