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Dirk Beernaert, European Commission Brussels, 16 December 2010 Advanced MM, MtM and Beyond CMOS Manufacturing Workshop Challenges, Strategies, R&D Topics.

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Presentation on theme: "Dirk Beernaert, European Commission Brussels, 16 December 2010 Advanced MM, MtM and Beyond CMOS Manufacturing Workshop Challenges, Strategies, R&D Topics."— Presentation transcript:

1 Dirk Beernaert, European Commission Brussels, 16 December 2010 Advanced MM, MtM and Beyond CMOS Manufacturing Workshop Challenges, Strategies, R&D Topics

2 Outline A look at the higher policy level Micro- and Nanoelectronics – A changing landscape Micro- and Nano-electronics – EU policy and funding Objectives of the Workshop Summary

3 Smart Growth: knowledge and innovation economy Sustainable growth: greener and competitive economy Inclusive growth: high employment, knowledge people and social and territorial cohesion COMMUNICATION FROM THE COMMISSION COM(2010) 2020 %20EN%20version.pdf %20EN%20version.pdf EUROPE 2020: A EU strategy for smart, sustainable and inclusive growth 5 EU Targets – translated into national ones 7 Flagship initiatives – EU & national action From 10 year Lisbon Strategy … to EUROPE 2020 UPDATE VISION TO POST-CRISIS WORLD IMPROVE DELIVERY

4 Europe 2020: 5 EU Headline Targets (translated in national and regional ones) By 2020: 75 % (now 69) employment rate (% of population aged 20-64 years) 3% (now 1,8) Investment in R&D (% of EUs GDP) 20/20/20 climate/energy targets met (incl. 30% emissions reduction if conditions are right) < 10% (now 15) early school leavers & min. 40% (now 31) hold tertiary degree 20 million less people (now 80) should be at risk of poverty

5 Europe 2020 3 priorities, 7 flagship initiatives Communication COM(2010)2020 of 3.3.2010 A strategy for smart, sustainable and inclusive growth Resource efficient Europe An industrial policy for the globalisation era An Agenda for new skills and jobs European Platform against Poverty Innovation Union Youth on the move A Digital Agenda for Europe

6 Innovation Union will advance scientific boundaries, increase European competitiveness and help solve societal challenges such as climate change, energy and food security, health and an ageing population. Around 16,000 participants from research organisations, universities and industry, including about 3,000 SMEs, will receive funding. It is expected to create more than 165.000 jobs. TOWARDS AN INNOVATION UNION Excellent Knowledge BaseAccess to financeInnovation Market From idea to the market European innovation partnerships & international cooperation Communication COM(2010)546 of 6.10.2010 EU2020 Flagship

7 Strengthen knowledge base, complete ERA –joint programming, education, skills, mobility researchers, cross border cooperation, research infrastructures, … Improving framework conditions for business to innovate –single EU Patent, access to capital (VC), risk sharing, standards setting, pre-commercial innovation procurement, … Set up 'European Innovation Partnerships' –Societal priorities and competiveness ! Development and deployment of the technologies. Link research and innovation Better use of financial EU instruments to support innovation –structural and social funds, rural development funds, R&D framework programme, CIP … EIB … and streamline administrative procedures … Strengthen partnerships in knowledge triangle (education, business, research and innovation) and between knowledge clusters –people, institutions, infrastructures, regions, … The Innovation Union: targets EU2020 Flagship

8 Industrial Policy for the Globalisation Era Putting Competitiveness and Sustainability at Centre Stage. Ensuring timely modernisation of industry –Innovation, knowledge and capital intensive industries Master Globalisation: –emerging market competition, international value chains, raw materials, energy, new Framework conditions for global competitiveness incl. SMEs Strengthen the single market and access to finance Achieving a low-carbon resource efficient economy Respond to emerging societal challenges: –security, health, aging, mobility Strengthen industrial innovation performance Key Sector initiatives –Transport, energy, environment Exploit cooperation between (regional) innovation clusters Communication COM(2010)614 of 28.10.2010 EU2020 Flagship

9 A Digital Agenda for Europe Every European Digital ! A vibrant digital single market Interoperability and standards Trust and security Fast and ultra fast internet access Research and innovation Enhancing digital literacy, skills and inclusion ICT-enabled benefits for EU society EU2020 Flagship Communication COM(2010)245 of 19.05.2010

10 Outline presentation A look at the higher policy level Micro- & Nano-electronics – the global situation Micro- & Nano-electronics – EU policy plus FP & ENIAC Objectives of the Workshop

11 Semiconductors as key enabling industry Electronics WW$1500B / Europa $315B Automotive - Industrial - Defense Medical - Space Semiconductors $256B / Europa $41B Service Providers WW$6300B / Europa $1600B 2007 World GDP=65200BUS$ (ppp based) - Internet Services Providers - Games - Broadcast - Telecom Operators Semiconductors provide the knowledge & technologies that generate some 10% of global GDP. Source: IMF, ESIA, WSTS, Decision

12 The Supply Chain Today Automotive Industrial and Medical Military, Civil Aerospace, Security Consumer Communications Data Processing

13 Source: IC-Insights, 01/2008 But Fab Cost Entry Barrier Explodes !

14 Global Consolidation: Number of Logic IDMs with Fabs. European Chip makers are moving up the value chain: From the hardware supply side into the final application IBS 2009, ST 2010 Semi equipment Semi materials Wafer foundry Software System mgmt Chip maker Application Content protection Infrastructure System integrator Service provider Content provider Delivery network Gateway mgmt Legislator regulations Changing business models

15 The evolving SC value chain / landscape Academia, Scientific Research Institu- tions Eq.& Materials IDM DISTI (branded) OEM Service providers (virtual) Network op. (Consumer) Retail Businesses, Consumers, Authorities From a linear chain... S/C Mfg Services: Foundry SATS Fabless IP Providers: IP blocks Software (firmware, stacks, middleware, OS ) Design houses EDA DISTI ODM EMS (branded) OEM Module makers Service providers/ (virtual) network op. (Consumer) Retail Distrib. Content Industry: Providers Aggregators Service prov. Businesses, Consumers, Authorities Academia, Scientific Research Institu- tions Eq.& Materials IDM Logistics service providers... to a networked model Source: ESIA

16 Intel Dublin

17 Recommendations & Actions Mastering Innovation Develop a European industrial innovation policy - with nano- / microelectronics at its core Shaping the Future R&D Give priority to the European-wide micro- / nanoelectronics R&D in framework programmes, public- private partnerships (EUREKA, ETPs, JTIs), national programmes Lead markets Stimulate market pull across Europe in chosen lead markets Health and wellness; transport and mobility; security and safety; energy and environment; communication; infotainment Manufacturing Launch a strategic European industry plan that aims at revitalising sc manufacturing capabilities in Europe. Upgrading /converting of existing fabs. Developing technology and manufacturing capabilities for devices in areas where Europe has strengths. Education Make micro- and nanoelectronics in education an objective Stimulate science and technology; awareness of the micro-/nano- electronics innovation potential; foreign talent; research infrastructure as invention incubators Source: ESIA

18 Nanoelectronics: Challenges Small, smaller, smarter - Keep research, manufacturing, integration & system competence in Europe? IPR, lead markets, user-supplier relationships, regional innovation clusters. Our part of global value chain: equipment, manufacturing (incl. 450mm), SMEs Policy & more efforts to keep Europe attractive for investments in semiconductor research & manufacturing and for its application in key lead markets. High on EU 2020 Agenda

19 Outline presentation A look at the higher policy level Micro- & Nano-electronics – the global situation Micro- & Nano-electronics – EU policy plus FP & ENIAC Micro- & Nano-electronics – EU policy plus FP & ENIAC Objectives of the Workshop

20 What can the European Commission do ? policy funding EU levers for sustainable growth and jobs

21 - financial & economic crises (B losses – lack of capital for risk taking!) - globalisation (loss of jobs, loss of value added, loss of government income!) - fierce and growing competition from industry clusters in other regions driven by increased political and financial support. If Europe wants to achieve global competitiveness it has to have direct access to state of the art processing technology and manufacturing competencies. Therefore the European Community should extend their Industrial Policy Framework by similar programs as in the Rest of the World in order to keep Europes Innovation driven Industry sustainably and globally competitive. Dr. J. Knorr Urgent need for a competitive industrial policy, a project plan with detailed Objectives and estimated amount of resources ! Why an industrial policy for Nanoelectronics NOW?

22 Industrial Policy Key Enabling Technologies Nanotechnology Micro- and nanoelectronics, including semiconductors Photonics Advanced materials Biotechnology Communication COM(2009)512 of 30.9.2009 Preparing for our future: Developing a common strategy for key enabling technologies in the EU Advanced manufacturing Systems

23 Identified Key Enabling Technologies (KET) Nanotech, Micro- and Nanoelectronics, Photonics, Advanced Materials, Biotech Knowledge intensive R&D intensive Capital intensive (Multi-)Skill intensive Enable innovation, Multipliers Systemic relevance Defining KETsImportance of KETs Driving our competitiveness, our innovation potential and knowledge-based economy delivering new goods and services Modernization of the industrial and research base Creating regional knowledge eco-systems incl. clusters of SMEs. High Level Group (25#): industries, incl. SMEs, research community member states EIB Make policy recommendations using existing instruments existing state aid rules, improve access to finance Make policy recommendation for EU2020, flagships and FP 8 Shared long term vision and A sense of partnership Communication COM(2009)512 of 30.9.2009

24 Key enabling technologies and their contribution to Europes grand societal challenges

25 FP7-CIP/ICT Budget Profile: 70% increase in period 2011-13 M 2007200820092010201120122013TOTAL PF7 ICT1.1891.2171.2271.2411.3821.5821.7609.597 CIP 5852105113120135149732 Financial support –FP7: master & shape research & development –CIP: ensure wider uptake & better use of research –+ Regional and Structural Funds,…

26 Nanoelectronics Small, smaller, smarter - Advanced communication & computing components enabling pervasive applications - Lower cost, higher performance and more functionality performance Smart design and Smart manufacturing of Smart Components Enabled by Power consumption - Moores Law: Miniaturization Baseline CMOS: CPU, Memory, Logic 130nm 90nm 65nm 45nm 32nm 22nm Beyond Moore Analog/RFPassivesHV Power Sensors Actuators Biochips Information Processing Digital content SoC Interacting with people and environment Non-digital SoC & SiP Combining SoC and SiP: Higher Value Systems More than Moore: Diversification Digital Society

27 Advanced Nanoelectronics Technology To stimulate interaction of system and technology to better explore European system competences. To address energy efficiency needs for mobile applications Nanoelectronics products as system enablers and solution providers for global challenges as aging society, global warming, growing population or sustainable manufacturing. To prepare for beyond traditional shrinking (ITRS roadmap) 35 nm Gate Length

28 Manufacturing and Equipment assessment and Access –Access to nano-manufacturing and to advanced technologies to be assured in Europe. –Access to world wide equipment market for European suppliers, especially SMEs, need to be stimulated. –Access to design tools and multi-project wafers fabrication for education, PhD and SMEs. Semiconductor Equipment for Wafer Bonding with Plasma Activation EV Group, CEA-LETI, Soitec 3D Integration of Bulk Si Wafers EV Group, CEA-LETI, STMicroelectronics Crolles II Low Energy and Dose Implant Test SEMILAB, Fraunhofer IISB, ST Microelectronics Crolles II, NXP Crolles R&D Ruthenium Atomic Vapor Deposition Competitiveness in Nanoelectronic Device Generations AIXTRON, Fraunhofer IISB, Infineon Munich Metrology Using X-Ray Techniques Jordan Valley, CEA-LETI, STMicroelectronics Crolles II, NXP Crolles R&D

29 Topics and Target Outcome: a) - Very advanced Si and non-Si switches, memories and interconnects (perf/ee) - Co-integration of non-Si, charge, spin, photon based devices on Si b) - Combined modelling, technology+ design work at circuit, device, material level for monolith and 3D integr of BeyondC + very adv. MtM on Si backbone c) - Mfg solutions for integration/interfacing of Beyond CMOS + MtM with NanoCMOS - E&M solutions to manufacture and measure 1D + 3D Si, E&M assessment including 450 mm d) - CSAs to support 450 mm coordination, develop strategies, attract young ones and link up globally to support IP creation and manufacture in Europe Very Advanced NanoE Components 2011-12 (Call 8: 26/07/11 - 17/01/12) 201160MSTREPs, IPs, CSAs

30 ENIAC Joint Undertaking as Public-Private Partnership Industry and R&D actors Commission and Public Authorities Executive Dir. and secretariat Health & the Aging Society Energy Efficiency Safety & Security Automotive & Transport Communication & Digital Lifestyles Design Technologies Equipment, Materials & Manufacturing Semiconductor Process & Integration

31 Contracted public funding for cooperative projects in Nanoelectronics First half of FP7 & first 3 calls of Eniac (2007-10): More than 500 M invested by EC in Semiconductors cooperative R&D ! Photonics and Micro-/Nano- systems excluded

32 Outline presentation A look at the higher policy level Micro- & Nano-electronics – the global situation Micro- & Nano-electronics – EU policy plus FP & ENIAC Micro- & Nano-electronics – EU policy plus FP & ENIAC Objectives of the Workshop

33 Potential issues in the Manufacturing Workshop Next generation of manufacturing plants (MM) automation clean room, green, energy, water, waste, … 450 mm – upgrade in 300mm fabs - … introduction next generation technology (equipment, materials, EUV-e-beam,…..) Next generation manufacturing plants ( MtM, smart components - SoC) 300 mm, upgrade of existing fabs 3 D flexibility, product mix,… introduction next generation technologies ( dimension, …) product specific issues Next generation manufacturing plants (MtM, SiP, integrated smart systems) packaging 3D packaging test, system integration Prototyping issues, foundry issues, … Not exhaustive, just to sharpen the minds

34 Objectives of the Workshop Discuss Mfg Strategies of the SC Industry under changing R&D and business models Learn about specific (adv. MtM, adv. MM/BC) challenges for all parts of the value chain Discuss possible derived R&D topics Define collaboration schemes (multi-disciplinarity, system level integration) Produce, distribute Workshop report describing discussions and results Use results as input for FP7 ICT WP2013, for FP8 and also for Eniac

35 Summary At Policy level understanding is developed that R&D and Innovation are the basis for prospering economies and societies The SC industry has changed its R&D and business models The public research programmes need use the opening opportunities by linking new policy and new industrial challenges Specifics in the area of nanoelectronics manufacturing: Find a balance between advancement of MM and diversification and development of new MtM technologies. This workshop should discuss the different strategies of industry and Research and related challenges and R&D topics.

36 THANK YOU Information Society and Media: European research on the web:

37 Innovation Union European Innovation Partnerships Strenghten the knowledge base –Education & Skills- Completing ERA –Mobility of researchers –Cross-border operation –Research Infrastructure A better equilibrium between Research & Innovation –Strong societal priorities –Reinforce industrial competitiveness A good usage of financial instruments –Venture capital, risk sharing –Pre-commercial procurement for innovation –Structural funds & social funds to promote R&I –Framework, CIP EU2020 Flagship Communication COM(2010)546 of 6.10.2010

38 Innovation Union European Innovation Partnerships European Innovation Partnerships (EIPs) –challenge driven, stakeholder commitment, EU added value –Across the whole research and innovation chain –Strong focus on results, outcomes and impacts 1 pilot –Active and healthy ageing Potential others: –Smart Cities –Water-Efficient Europe –Supply of raw materials –Smart mobility –Agriculture EU2020 Flagship

39 An industrial policy for the globalisation era EU2020 Flagship A new approach: –Policies directly targeting cost, price and innovative competitiveness of industry & sectors –Specific focus on key sectors (transport, energy, environment,…) –Promoting industrial innovation, closer linkage to industrial research Communication COM(2010)614 of 28.10.2010

40 40 A Digital Agenda for Europe The Research & Innovation Pillar The Commission will leverage more private investment through –pre-commercial procurement and public-private partnerships –structural funds –20% yearly increase of ICT R&D budget (at least for FP7) The Commission will also –reinforce coordination and pooling of resources with Member States and industry –focus on demand- and user-driven partnerships –put measures for 'light and fast' access to EU funds –support joint ICT research infrastructures and innovation clusters, eInfrastructures and cloud computing strategy –develop new generation of web-based applications and services by supporting standards and open platforms The Member States should –double annual public spending on ICT R&D in ways that leverage an equivalent increase in private spending –engage in large scale pilots in areas of public interest

41 ITRS-ERD vision of the role of Beyond CMOS and More than Moore elements to form future extended CMOS platforms. Future developments in Beyond CMOS and More than Moore as an extended-CMOS vision. No disconnection from the advanced silicon CMOS in order to keep impact of its results on the applications and markets. Needs of hybridizing silicon with molecular switches, ferromagnetic logic, spin devices and sensors in order to enable heterogeneous and morphic system architectures. Integrate-ability of novel technology with CMOS and their reliability become key factors. Advanced Nanoelectronics Technology

42 Communications – wired and wireless, mobile, RF connectivity solutions (Bluetooth, GPRS..), telecommunications, traditional telecom equipment, home networking equipment Consumer - entertainment, radio, TV, VCR, personal or home appliance, cameras, games, etc. Automotive – powertrain, safety management, body and convenience, engine controls entertainment... Computer & Office - mainframe, peripheral office equipment and personal computers Industrial & Instrument - lab, test, control and measurements Source WSTS Semiconductors as key enabling industry Semiconductors are for the Information Society what grain was for the agrarian, and iron & steel were for the industrial society… Shanghai Museum of Urban Development, 2004

43 Europe 2020 – Innovation Challenge (European Commission (2010); Communication from the Commission: EUROPE 2020 - A strategy for smart, sustainable and inclusive growth; COM(2010) 2020; Brussels, 03/03/2010) For effective deployment of KETs, it is, amongst other aspects, important to: (a)focus on an increased technology transfer and EU-wide supply chains; (b)focus on increased joint strategic programming and demonstration projects; (c)combine the deployment of KETs and climate change policy; (d)promote demand through public procurement and via the Lead Market Initiative (e.g. protective textiles); (e)exchange experiences and best practices between Member States and at international level; (f)stimulate increased financial investment via EIBs loan policy and venture capital financing; and (g)upgrade skills and provide appropriate training and education. (h)equal and global playing fields (i)cooperation between knowledge clusters

44 The changing global landscape for the SC industry Rapidly changing global landscape for the Semiconductor industry –Since 10 years, Europe is steadily loosing market shares –Slowing down of market growth in value terms –Increasing demand from consumer applications creates market potential while generating SC price decrease –Increased pace of innovation & electronic product penetration –Skyrocketing cost increases are forcing alliances: CAPEX 20% sales –Deverticalisation of the value chain and financial markets –The landscape is driving the industry to 3 different manufacturing models, while maintaining and enhancing its process expertise is key Memories and microprocessors manufacturing Logic products manufacturing More than Moore manufacturing

45 Summary of Trends & Convergence of Interests

46 Alternative scenarios based on an assessment of selected competitiveness factors EU Legislative Environment Environment, safety & health, customs & security, IP rights Free & Fair Trade Policy Reciprocal world free trade Environment, elimination of tariffs Strength of European Internal Market End-user / consumer demand in Enlarged 25 EU Internal Market Global Strength of European End-User Industry Global industry leadership, Electronics value added driven Target Investment Support / Incentives Levels Tax havens, access to capital, property incentives R&D Spending R&D & innovation policies, research investment targets Pre-competitive Co-operation / Partnership Effectiveness Joint research and design centres, framework programmes, technology Educational System Reinforcement Curricula, industry-university research, exchange programmes, brain retention European Labour Policies Sectoral flexibility of working hours and employment conditions Globally Effective EU Monetary Policies Stability of exchange rates relative to other currencies

47 Source: CT IC ICTs require raw materials: computer chip The dynamics of two decades of computer chip technology development and their mineral and element impacts. In the 1980s, computer chips were made with a palette of twelve minerals or their elemental components. A decade later, sixteen elements were employed. Today, as many as sixty different minerals (or their constituent elements) are used in fabricating the high-speed, high-capacity integrated circuits that are crucial to this technology.

48 Key enabling technologies and their contribution to Europes grand societal challenges

49 Get involved ! Europe 2020 A strategy for smart, sustainable and inclusive growth FP8 / CIP II Regional Policy for Smart Growth (Structural Funds) Trade / External Policies/ Single Market Key Enabling Technologies Multi-Annual Financial Framework 2014+ in 2011!

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