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SPD Mechanics and Cooling Status of the activity in Padova Rosario Turrisi Contents: Calibration of Johansson measuring machine Cooling components Half-stave.

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Presentation on theme: "SPD Mechanics and Cooling Status of the activity in Padova Rosario Turrisi Contents: Calibration of Johansson measuring machine Cooling components Half-stave."— Presentation transcript:

1 SPD Mechanics and Cooling Status of the activity in Padova Rosario Turrisi Contents: Calibration of Johansson measuring machine Cooling components Half-stave test

2 February 18, 2004Rosario Turrisi - SPD Meeting - CERN2 Strong efforts for: Learning and testing the new software PCDMIS 3.2 (DEA, Italy) Learning and testing the new software PCDMIS 3.2 (DEA, Italy) Software development for semi-automatic measurements; Software development for semi-automatic measurements; Analysis procedure for CFSS, mandrels, supports Analysis procedure for CFSS, mandrels, supports (reference frame, checking points…) Non-trivial results interpretation; Non-trivial results interpretation; First results: New mandrel (l=140 mm) PLANARITY less than 30  m Old mandrel (l=280 mm) PLANARITY less than 50  m What’s going on/next: Mandrels being produced at EuroMeccanica Mandrels being produced at EuroMeccanica CFSS: prototype existing, new ones waiting for molds CFSS: prototype existing, new ones waiting for molds Status of Johansson machine

3 February 18, 2004Rosario Turrisi - SPD Meeting - CERN3 Status of cooling components Received from Medelec: Received from Medelec: –Phynox tubes –CuNi capillaries Processing started: Processing started: –Squeezing –Ni+Cu layer on tubes ends –Fittings procurement

4 February 18, 2004Rosario Turrisi - SPD Meeting - CERN4 Half-stave test: assembly Support: carbon fiber + rohacell Support: carbon fiber + rohacell Interface card as support Interface card as support AOS 54012 thermal grease, 50 to 100  m thickness (borders to center of the half- stave) AOS 54012 thermal grease, 50 to 100  m thickness (borders to center of the half- stave) Ladder fixed by u.v. gluing Ladder fixed by u.v. gluing Hydraulic connectivity as of final project: phynox tube + capillaries (55 cm in - 22 cm out) Hydraulic connectivity as of final project: phynox tube + capillaries (55 cm in - 22 cm out) p,T pick-up points along the cooling line + 2 pt1000 on ladders p,T pick-up points along the cooling line + 2 pt1000 on ladders IR camera for temperature map recording IR camera for temperature map recording

5 February 18, 2004Rosario Turrisi - SPD Meeting - CERN5

6 February 18, 2004Rosario Turrisi - SPD Meeting - CERN6 Cooling prototype scheme

7 February 18, 2004Rosario Turrisi - SPD Meeting - CERN7 Points A 25.00°C B 25.68°C C 28.74°C D 33.11°C E 38.16°C F 38.16°C P=1.17 W, no cooling T AVE =32 o C chip number

8 February 18, 2004Rosario Turrisi - SPD Meeting - CERN8 P=1.11W, cooling on T OUT =12 o C Points A 15.91°C B 15.31°C C 15.91°C D 20.13°C E 19.56°C T AVE =17 o C chip number

9 February 18, 2004Rosario Turrisi - SPD Meeting - CERN9 P=8.92 W Points A 21.69°C B 22.11°C C 22.80°C D 34.86°C E 40.20°C T OUT =12 o C T AVE =28 o C chip number

10 February 18, 2004Rosario Turrisi - SPD Meeting - CERN10 Wires cut…

11 February 18, 2004Rosario Turrisi - SPD Meeting - CERN11 Disconnected chips Bus extender chip 1 chip 2 Many thanks to M. Tessaro (CMS) INFN Padova When/where damage happened? No defects noticed at a visual inspection (by magnifing glasses) Always protected by plastic cover, except: during mount during measurement for chip disconnection main drawbacks: temporary jig used and no automated movement

12 February 18, 2004Rosario Turrisi - SPD Meeting - CERN12 Half-stave V vs. A

13 February 18, 2004Rosario Turrisi - SPD Meeting - CERN13 P=1.35W, cooling on T OUT =18 o C Points A 14.25°C B 14.55°C 1 st chip C 14.25°C D 14.86°C E 16.35°C F 16.35°C G 15.31°C H 15.31°C I 14.86°C J 14.71°C K 14.71°C 10 th chip T AVE =15 o C chip number

14 February 18, 2004Rosario Turrisi - SPD Meeting - CERN14 P=4.75 W (cooling on!) Points A 18.98°C B 20.98°C 1 st chip C 21.41°C D 22.25°C E 24.18°C F 25.27°C G 22.53°C H 21.83°C I 20.13°C J 18.70°C K 18.41°C 10 th chip T OUT =18 o C T AVE =21 o C chip number

15 February 18, 2004Rosario Turrisi - SPD Meeting - CERN15 Temperature vs. Power – before cut

16 February 18, 2004Rosario Turrisi - SPD Meeting - CERN16 Temperature vs. Power – 2 chips cut

17 February 18, 2004Rosario Turrisi - SPD Meeting - CERN17 Transverse T profiles 3.5 w – last 2 chips disconnected 2 1 before disconnection

18 February 18, 2004Rosario Turrisi - SPD Meeting - CERN18 Summary and conclusions Mechanics and Cooling – –Mandrel production started – –Cooling components produced, processing started Half-stave test – –Cooling principle verified with real chips – –Origin of wire bonding damage under investigation


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