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Pressure sensor 2.008-spring-2003. Surface Micromachining 2.008-spring-2003 Deposit sacrificial layer Pattern anchors Deposit/pattern structural layerEtch.

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Presentation on theme: "Pressure sensor 2.008-spring-2003. Surface Micromachining 2.008-spring-2003 Deposit sacrificial layer Pattern anchors Deposit/pattern structural layerEtch."— Presentation transcript:

1 Pressure sensor spring-2003

2 Surface Micromachining spring-2003 Deposit sacrificial layer Pattern anchors Deposit/pattern structural layerEtch sacrificial layer

3 Surface micromachining Structure sacrificial etchant Polysilicon Silicon dioxide HF SiNx PSG HF Silicon dioxide polysilicon XeF2 SiNx polysilicon XeF2 Aluminum photoresist oxygen plasma spring-2003

4 Residual stress gradients spring-2003 More tensile on top More compressive on top Just right!

5 Clean Room Gowning with bunny suit Class 1, 10, 100 A salt grain on a chip spring-2003

6 Class of clean rooms Class 1 means one speckle of 0.5 μ partical in one ft 3. Class 10, 100, 1000 HEPA filter, AHU spring-2003

7 Air Filters HEPA (High Efficiency Particulate Air) filters High efficiency, low Δp, good loading characteristics Glass fibers in a paper like medium 97% retainment of incident particles of 0.3 μm or larger spring-2003

8 Class of clean rooms spring-2003 Class Temp tolerance

9 Particles spring-2003 Class Federal Standard 209; Number of particles per cubic foot

10 Toxicity TLV (Threshold Limit Value) Upper limit material concentration that an average healthy person can be exposed without adverse effects, ppm or mg/m 3 Notorious Poisons CO (100 ppm), CO 2 (5000 ppm), HCN (110 ppm), H 2 S (10 ppm) SO 2 (5 ppm), NH 3 (50 ppm) Arsenic trioxide AS 2 O 3 (0.1g fatal) Hg (0.1 ppm via skin contact) All material are toxic in sufficient quantity, 5g caffein is fatal spring-2003

11 MEMS Applications spring-2003

12 Display Technologies Market Leader R.& D. Issues Screen Size spring-2003 HDTV for 60 ~ 80 Home Theater Digital Presentation for 100 ~ 300 Projector Key Factor : Brightness

13 Brightness of Projection Displays lux = lumen / m 2

14 CORPORATE RESEARCH & DEVELOPMENT 1 st Optical MEMS device PHOTONICS AND MICROMACHINING DIGITAL MICROMIRROR DEVICE & DLP TM PROJECTOR

15 DMD Optical Switching Principle DMD Mirror on/off ± 10o Texas Instrumentss Technical Journal: Vol. 15, No. 3, July-Sept spring-2003

16 DMD Cell Structure Texas Instrumentss Technical Journal: Vol. 15, No. 3, July-Sept spring-2003

17 TMA spring-2003

18 Light Modulation of TMA Thinfilm Micromirror Array spring-2003

19 Pixel Architecture Via contact to MOS Common Electrode Drain PadGate LineSource Line Anchor Post contact to actuator Mirror Top Electrode PZT Bottom Electrode Supporting Layer spring-2003

20 TMA vs DMD Actuation Tilting Angle Gray Scale Control Drawbacks DMD TM (Texas Instrument) Electrostatic -10o, 0o, +10o On/Off Complex Fatigue Sticking High Cost TMA TM (Daewoo Electronics) Piezoelectric 0o ~ 3o (continuous) Linear Simple Uniformity spring-2003

21 Micromirror Arrays VGA 640 X ,200 pixels XGA 1024 X ,432 pixels spring-2003

22 Mirror Flatness (VGA) spring-2003

23 Coupled Natures of Thin Film Processes Forward coupling Step coverage, confromality Backward coupling Temperature dependent microstructural degradation Over/under etch, etch stop control Side attack, Passivation breakage spring-2003

24 Evolution of TMA Pixels spring-2003

25 MIT Bow-actuator Nick Conway, MS spring-2003 Piezoelectric Amplifiers 4-bar linkage design End effector Released Fixed substrate

26 Design of nanopipette (2): In-line array of nanopipettes Massive Parallel Nanopipette Array by In- plane Scanning Probe Systems Integration with Microfluidic channels Integration of nanopipettes in AFM in an 100 x 100 array Single nanopipette spring-2003

27 Photonic crystal modeling Microcavity waveguide finite-difference time-domain 1 mesh spring-2003

28 Photonic band gap microcavity waveguide processing design matrix of various geometries: defect lengths, waveguide width, d/a, number of holes Nanofabrication: SiN x mask 1 /w electron-beam Proximity pattern transfer to resist 130 nm minimum features Hard mask from Cr lift-off 2 Optimized Si RIE 1 J. Ferrera, NanoStructures Laboratory, MIT.2 J. Foresi, Kimerling group, MIT spring-2003

29 Design Domains Design is a mapping process From What to How Small scale systems design WhatHow N. P. Suh, Axiomatic Design, Oxford spring-2003


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