2 Assembly and Packaging Technical Working Group – 2010 (93 Participants) Joseph Adam, Sai Ankireddi, Bernd Appelt, Richard Arnold, Muhannad S. Bakir, Souvik Banerjee, Rozalia Beica, Steve Bezuk, Mario Bolanos-Avila, W.R. Bottoms, Yi-jen Chan, Chi-Shih Chang, Clinton Chao, Carl, Chen, William Chen, Sonjin Cho, Yulkyo Chung, Bob Chylak, Mark De Samber, Krishor Desai, Dan Evans, Bradford Factor, Tatsuhiro Fujiki, Michael Gaitan, Michel Garnier, Steve Greathouse, Tom Gregorich, Richard Grzybowski, George Harman, Shuhya Haruguchi, Ryo Haruta, Tomoo Hayashi, Harold Hosack, Willem Hoving, Mike Hung, John Hunt, Kazuyuki Imamura, Hisao Kasuga, Dan Kilper, Mitchitaka Kimura, Shoji Kitamura, Takanori Kubo, Choon Heung Lee, Ricky S W Lee, Rong-Shen Lee, Russell Lewis, Sebastian Liau, Weichung Lo, David D. Lu, Abhay Maheshwan, Debendra Mallik, Kaneto Matsushita, Masao Matsuura, Lei Mercado, Hirofumi Nakajima, Keith Newman, Luu Nguyen, John Osenbach, Masashi Otsuka, Richard F. Otte, Gilles Poupon, Klaus Pressel, Gamal Refai-Ahmed, Charles Richardson, Peter Robinson, Bernd Roemer, Gurtej Sandu, Naoto Sasaki, Paul Siblerud, Vern Solberg, Simon Stacey, Yoshiaki Sugizaki, Teresa Sze, Coen Tak, Takashi Takata, Patrick Thompson, Claudio Truzzi, Andy Tseng, Shigeyuki Ueda, Shoji Uegaki, Ryosuke Usui, Henry Utsunomiya, Kripesh Vaidyanathan, Freek Van Straten, Julien Vittu, James Wilcox, Max Juergen Wolf, Jie Xue, Zhiping Yang, Hiroshi, Yokota, Eiji Yoshida, Hiroyoshi Yoshida.
3 Assembly and Packaging Technical Working Group - 2010 87 Members Participated in 2010 ActivitiesFocus of activities for 2010The only change to tables will be AP1: Difficult ChallengesPreparation for 2011 with expanded coverage for:Medical electronics,3D integrationInterposersAutomotive electronicsOptoelectronicsPrinted electronicsHandling of thinned wafers and dieEmbedded componentsMEMS integrationRewrite of the System in Package paperCross TWG coordinationMajor collaborations include ERM, ERD, ESH, Interconnect, Design, TestCoordination with other RoadmapsiNEMICTR/MPCJISSO
4 The Pace of Innovation is Accelerating Today packaging has become a crucial enabler for both “More Moore” as the industry enters the deep submicron regime and the functional diversification and heterogeneous integration which has been titled “More than Moore”. In response to these dual challenges we have an unprecedented pace of innovation in assembly and packaging technologies.
5 Innovation in Wafer level Packaging WLCSP and Wafer Level Fan-Out technologies have become main stream. Future directions will be include multi-die (side by side and stacking) fanout. They are becoming an enabling part of the SiP technology portfolio providing:Miniaturizationlower powercost reductionheterogeneous integrationExamples include complex PoPs, embedded components, integrated passives, and others.
7 Progress Continues in Wire Bond Technology The rising cost of gold is driving copper wire bonding to replace gold. Conversion from gold wirebond packages to copper requires:Changes in almost all materials and wirebond equipmentNew process engineeringNew reliability science to addressing new failure mechanismsFine Pitch Copper wire bonds are now in volume production
8 3D Stacking with Wirebonds 3D wirebond stacking with 50um thick wafer
9 Lead Free Requirements Demands New Interconnect Technology Copper pillar has become the lead free bump metallurgy of choice for the fine bond pad pitch at deep submicron nodes. The technical challenges include:New underfill materialsNew processes for cu pillar and under bump metallurgy (UBM)Design tools for copper pillar interconnectThis must be accomplished while maintaining adequate margins of safety for dielectric damage and package integrity.
11 Expanded Coverage of Emerging Requirements for 2011: Medical Electronics Medical electronics Categories to be addressed:Portable medical electronicsImplantable medical electronics (Parkinson’s disease symptom control)Selected Issues for Medical electronicsPower requirements: energy scavenging; wireless radiated power; batteriesSafety issues (voltage, biocompatibility, power delivery)FDA certificationReliability requirementsEnvironmental issuesConnectivity (wireless)Optical components (cameras)MicrofluidicsImplantable micro-roboticsSensorsMEMS
12 Expanded Coverage of Emerging Requirements for 2011: 3D Integration Selected Issues for 3D IntegrationDie stacking methodsHomogeneous stackingHeterogeneous stackingTest challenges for 3DTest accessTest costThrough silicon ViasThermal management for 3D structuredPower integrity3D SiPBonding methodsCodesign and simulation
13 Expanded Coverage of Emerging Requirements for 2011: Interposers Selected Issues for Interposers:Systems integration for 2D and 3DInterposer featuresRedistribution wiringPassive networksThermal managementStress managementMaterials selectionSiCeramicGlassOrganics
14 Expanded Coverage of Emerging Requirements for 2011: Automotive Electronics Automotive electronics Categories to be addressed:Internal combustionHybridAll electricSelected IssuesCommunications (including optical networks)Thermal managementIn cabinHostile environmentsSafetySensorsControls for improved efficiencyCostOne side air coolingCooling on both sidesLiquid immersion cooling
15 Expanded Coverage of Emerging Requirements for 2011: Thin Wafer and Die Handling Selected Issues for Thin Wafer and Die HandlingTesting: contactors with ohmic contact without damageHolding mechanismsElectrostatic chucksBernouilli chuckTemporary bonding (sacrificial layer)Vacuum chucks (porous ceramic chucks)Dicing of thin waferWarpage
16 Expanded Coverage of Emerging Requirements for 2011: Embedded Components Embedded Component Categories to be addressed:Active devicesPassive devicesSelected Issues for Embedded ComponentsPerformance enhancement due to reduced distance between die and passivesIncorporation of additional functionality (heat pipes; wave guides)Keep out area around embedded componentsCharge source close to the die for current surgeReduced size by placement of passives under diePlacement accuracy for small thinned die3D alignment tolerance for assemblyImproved resistance to shockThermal management
17 Expanded Coverage of Emerging Requirements for 2011: MEMS Integration MEMS Integration Categories to be addressed:SensorsAccelerometersRF Switches, Oscillators, and filtersMicrofluidicsOpticalSelected Issues for MEMS IntegrationLow stress interconnect between MEMS device and package cavitiesLow cost, high reliability mechanical mountingElectrical and environmental connectionslow electrical parasitic interconnectLow cost hermetic cavitiesStress managementMicrofluidic pump
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