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Work in progress – do not publish RF&A/MS 1-page update Analog - carrier Frequency bands LF Analog (0-0.4GHz)RF (0.4-30GHz)mm-wave (30-300GHz)THz (>300GHz)

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Presentation on theme: "Work in progress – do not publish RF&A/MS 1-page update Analog - carrier Frequency bands LF Analog (0-0.4GHz)RF (0.4-30GHz)mm-wave (30-300GHz)THz (>300GHz)"— Presentation transcript:

1 Work in progress – do not publish RF&A/MS 1-page update Analog - carrier Frequency bands LF Analog (0-0.4GHz)RF (0.4-30GHz)mm-wave (30-300GHz)THz (>300GHz) Example applications Automotive controlsCellular60 GHz point-to-pointNo products yet On-chip regulatorsWLANImagingCoordinate with ERD Power managementSerDesAutomotive radar ADC,DACWireless backhaul Chapter scope illustrated above Subgroup updates: CMOS, Bipolar, III-V, HVMOS, Passive devices Common to all: Very few adjustments for productive X-TWG meetings: A&P, Interconnect, MEMS,ERD, PIDS, Test, Design Industry survey 1

2 Work in progress – do not publish CMOS Adopt TCAD based models following PIDS More consistent values of analog device parameters Reflect impact of local wiring on device parameters Use interconnect roadmap information Review FOMs to better reflect application requirements Apply consistently across technologies: CMOS, bipolar, III-V 2 Bipolar Build the roadmap by simulation Consider performance plateaus of 3-4 years duration Improve the tie to application requirements in defining bipolar timing – Survey? iNEMI?

3 Work in progress – do not publish III-V technologies Review FOMs vs Technology, introduce enhancement mode FETs Heterogeneous 3D integration 3 Passive devices Review FOMs vs application Consider mm-wave applications Consider new materials for voltage regulation applications HVMOS Add Coff, Leakage current, Ambient /Junction Temperature Expand scope to include 60V for automotive, 100V for MEMS actuation,…

4 Work in progress – do not publish X-TWG Discussions Assy & Pkg Die-to-Die I/O, Substrate thickness & TSV, Redistribution layers, mm-wave antennae Interconnect thin metal parasitics, Thick metals, TSV, Current densities & E-M MEMS resonators, varactors, switches. –help develop RF FOMs. ERD Create table of Emerging Device X Functional Elements & FOMs Perhaps a micro-workshop in Monterey 4

5 Work in progress – do not publish X-TWG Discussions(2) PIDS Work to make nanoHub simulator be consistent with RFAMS needs Test Create a table of product test and device characterization needs by frequency band Design Review RFAMS Drivers & FOMS, Include Automotive & Smart-grid drivers SIP vs SOC discussion 5

6 Work in progress – do not publish 6


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