5 Memory Materials Workshop Redox RAM: How can we experimentally verify that the Redox RAM operating mechanism?MTJ: What materials or interface research should be performed to enable reduction of write energy by 10X?Even with the combination of MgO-CoFeB (normally in-plane), interface control enables Perpendicular MTJ.
7 Beyond CMOS Logic Materials & Interfaces Charge BasedStates Other Than Charge OnlyFerroelectricPolarizationSpin StateIndividual orCollectiveNegative Capacitance FETAssessFerromagnetic Materials, Dilute Magnetic SemiconductorsComplex Metal OxidesStrongly Correlated Electron State Materials (FE, FM, FE & FM)MoleculesInterfaces
8 Lithography Evolutionary Resist Design Directed Self Assembly (DSA) -Positive ResistDirected Self Assembly (DSA)New Applications of Old ResistNon-Chem Amp (193nm)Negative Resist (EUV)Novel Moleculesfor Double ExposureRuiz, et. al. Science 2008DSAAssemble smaller features in higher densityDefect density reduced <25cm-2Critical Assessment underwayTethered AnthraceneBristol, IntelIntermediate State
9 Front End Processing Deterministic Doping Progress Bosworth,Ober, ACS NANO 2008Patterning & dopingvia DSAHo, Javey,Nature Materials 2008Monolayer Doping3D atom probe3D simulationDSA Produces OrderImplant Delivers DopantsInoue,Ultramicroscopy 2009Roy, AsenovScience 2005Massive Parallel Dopant ControlMetrology and Modeling ProgressIdentified potential high volume mfg. techniquesExpected to be Multigate compatiblePotential for low temperature and damage process
11 3D Interconnects Chip Attach Materials With Thermal Hierarchy Electrical InterconnectsNanosoldersPolymersStress and Thermal Management MaterialsSelf Aligning Material TechnologiesBeyond surface tension…
12 Assembly & Package 1D Interconnects Nanosolder, CNT & NWPolymers with Mechanical, Electrical & Thermal PropertiesPolymers With Zero Moisture AbsorptionIon Free or Immune Mold CompoundManagement of III-V & Ge Device Stress
13 Hexagon of Assembly Material Requirements ExamplesThermal Interface Mat.Mold CompoundUnderfillAdhesivesEpoxyFunctionalPropertiesMoistureResistanceAdhesionFractureToughnessModulusCTECTE depends on volume fractionHighly coupled Material PropertiesApply novel materials to achieve optimal performance
14 ESH ChallengesMaterials needed to overcome significant technical challengesLow energy processes and new materials for low energy integrated circuitsFew materials can meet requirementsSome materials have known hazards or uncharacterized ESH propertiesStimulate ESH research in uncharacterized materialsGood risk management methods for materials ESH in Research, Development & ManufacturingLifecycle Assessment & ManagementEfficient use of materials
15 Summary Updating Materials Progress Highlighting Critical Challenges Identified New ITWG Requirements for ERMTransitioning Mature Materials to ITWGsCritical Assessments of Select ERM
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