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ITRS Summer Conference 2012 San Francisco, CA Work in Progress: Not for Distribution 1 2012 ITRS Emerging Research Materials [ERM] July 12, 2012 C. Michael.

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Presentation on theme: "ITRS Summer Conference 2012 San Francisco, CA Work in Progress: Not for Distribution 1 2012 ITRS Emerging Research Materials [ERM] July 12, 2012 C. Michael."— Presentation transcript:

1 ITRS Summer Conference 2012 San Francisco, CA Work in Progress: Not for Distribution 1 2012 ITRS Emerging Research Materials [ERM] July 12, 2012 C. Michael Garner Hiro Akinaga, AIST

2 ITRS Summer Conference 2012 San Francisco, CA Work in Progress: Not for Distribution 2 2012 ERM Participants Hiro AkinagaAIST Tsuneya Ando Tokyo Inst. Tech Nobuo Aoi Panasonic Koyu Asai Renesas Yuji AwanoKeio Univ Daniel-Camille Bensahel ST Micro Bill Bottoms Nanonexus George Bourianoff Intel Bernard CapraroIntel John Carruthers Port. State Univ. An Chen Global Foundry Zhihong ChenIBM Joy ChengIBM Byung Jin Cho KAIST Luigi Colombo TI G. Dubois IBM Catherine Dubourdieu Inst. Nanotech. de Lyon. Michael Garner GNS Michael Goldstein Intel Dan HerrUNCG Jim HutchbySRC Berry JonkerNRL Ted KaminsStanford U. Leo KennyIntel Choong-Un Kim UT Arlington Sean King Intel Atsuhiro Kinoshita Toshiba Liew Yun Fook A-Star Blanka Magyari-Kope Stanford U. Prashant Majhi Intel Francois Martin LETI Fumihiro Matsukura Tohoku U. Nobuyuki Matsuzawa Sony Jennifer Mckenna Intel Yoshiyuki Miyamoto NEC Kei Noda Kyoto University Yaw ObengNIST Chris OberCornell Univ Matsuto Ogawa Kobe University Katsumi Ohmori. TOK Yutaka Ohno Nagoya University Er-Xaun Ping AMAT Joel Plawsky RPI Dave Roberts Nantero Tadashi Sakai Toshiba Gurtej Sandhu Micron Hideyki Sasaki Toshiba Nanoanalysis Shintaro Sato AIST Akihito Sawa AIST Barry Schechtman INSEC Sadasivan Shankar Intel Mizuki Sekiya AIST Matt Shaw Intel Takahiro Shinada AIST Michelle Simmons UNSW Kaushal Singh AMAT Naoyuki Sugiyama Toray Shin-ichi Takagi U. of Tokyo Masahiro Takemura NIMS Koki Tamura TOK America Yoshihiro Todokoro NAIST Yasuhide Tomioka AIST Peter Trefonas Dow Wilman Tsai Intel Ken Uchida Tokyo Tech Yasuo Wada Toyo U Kang Wang UCLA H.S. Philip Wong Stanford U. Dirk Wouters IMEC Wen-Li Wu NIST Shigeru Yamada Ibiden Hiroshi Yamaguchi NTT Toru Yamaguchi NTT Hiroaki Yoda Toshiba Jiro Yugami Renasas Victor Zhirnov SRC Paul Zimmerman Intel

3 ITRS Summer Conference 2012 San Francisco, CA Work in Progress: Not for Distribution 3 2012 Key Messages 2011 ERM Chapter will not be updated in 2012 ERM is preparing for 2013 ITRS Rewrite Aligning with iTWG New Requirements Planning e-Workshops Identifying potential material transitions Identifying support capabilities needed Significant Challenges for all Materials

4 ITRS Summer Conference 2012 San Francisco, CA Work in Progress: Not for Distribution 4 Memory Materials Ferroelectric Memory Nanoelectromechanical (NEMM) Redox RAM Mott Memory Macromolecular Molecular

5 ITRS Summer Conference 2012 San Francisco, CA Work in Progress: Not for Distribution 5 Extending CMOS Logic Alternate Channel Materials Alternate Channel Materials -n-Ge & p-III-V -Nanowires -Graphene -Carbon Nanotubes III-V Heterostructures (L. Samuelson, Lund Univ.) A. Geim, Manchester U. Assess Materials Performance Gate materials Contacts Interfaces MOS -Identify Novel Metrology & Modeling Needs D. Zhou, USC

6 ITRS Summer Conference 2012 San Francisco, CA Work in Progress: Not for Distribution 6 Beyond CMOS Logic Materials & Interfaces Assess Ferromagnetic Materials, Dilute Magnetic Semiconductors Complex Metal Oxides Strongly Correlated Electron State Materials (FE, FM, FE & FM) Molecules Interfaces Spin StateFerroelectric Polarization Negative Capacitance FET Individual or Collective Charge Based States Other Than Charge Only

7 ITRS Summer Conference 2012 San Francisco, CA Work in Progress: Not for Distribution 7 ERM Device Material e-Workshops Redox RAM Materials Deterministic and Conformal Doping Nanoscale Contact Resistivity Carbon Electronics (Nanotubes and Graphene) Spin Materials & Out of Plane MTJ Materials Strongly Correlated Electron Materials Modeling of Complex Transition Metal Oxide Dielectric Constant

8 ITRS Summer Conference 2012 San Francisco, CA Work in Progress: Not for Distribution 8 Lithography Materials Continuing evaluation of novel resist for 193i and EUV LER Rectification to reduce LER and improve line CD control Contact/Via Rectification to reduce size and improve CD control Pattern Density Multiplication for high density smaller features Ruiz, et. al. Science, 2008 Contact/Via Rectification Density Multiplication LER Rectification Stoykovich, et. al. Macromolecules, 2010

9 ITRS Summer Conference 2012 San Francisco, CA Work in Progress: Not for Distribution 9 Survey on DSA Contact rectification and pattern density multiplication had the highest support Most industry responders had plans to evaluate DSA

10 ITRS Summer Conference 2012 San Francisco, CA Work in Progress: Not for Distribution 10 Interconnect Materials Interconnects - Graphene, Carbon Nanotubes, Nanocomposites Ultra-thin Barrier Layers Novel sub 2nm materials Self Assembled Monolayers (SAM) Ultra low κ ILD Novel Interconnects & Vias Native Interconnect Workshops Ultralow k ILD: Completed Ultrathin Cu Barrier Layers

11 ITRS Summer Conference 2012 San Francisco, CA Work in Progress: Not for Distribution 11 Assembly & Package e-Workshops Residue Free Adhesives 1D Interconnects –Nanosolder, Nanocomposites, CNT & NW Polymers with Controlled Mechanical, Electrical & Thermal Properties Insulating polymers with high in plane thermal conductivity <200C Process temperature Dielectric Interposer Low k, High k & Wiring

12 ITRS Summer Conference 2012 San Francisco, CA Work in Progress: Not for Distribution 12 Hexagon of Assembly Material Requirements Highly coupled Material Properties Apply novel materials to achieve optimal performance CTE Modulus Fracture Toughness Functional Properties Moisture Resistance Adhesion Examples Thermal Interface Mat. Mold Compound Underfill Adhesives Epoxy CTE depends on volume fraction

13 ITRS Summer Conference 2012 San Francisco, CA Work in Progress: Not for Distribution 13 ESH Challenges Materials needed to overcome significant technical challenges –Low energy processes and new materials for low energy integrated circuits –Few materials can meet requirements –Some materials have known hazards or uncharacterized ESH properties –Stimulate ESH research in uncharacterized materials –Good risk management methods for materials ESH in Research, Development & Manufacturing –Lifecycle Assessment & Management –Efficient use of materials

14 ITRS Summer Conference 2012 San Francisco, CA Work in Progress: Not for Distribution 14 Summary 2011 ERM Chapter will not be updated in 2012 ERM is preparing for 2013 ITRS Rewrite Aligning with iTWG New Requirements Planning e-Workshops Significant Challenges for all Materials

15 ITRS Summer Conference 2012 San Francisco, CA Work in Progress: Not for Distribution 15 Back-up


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