1. ITRS Design ITWG 2012 1 ITRS Design + System Drivers July 9-10, 2012 Design ITWG Masaru Kakimoto (Japan) Juan-Antonio Carballo (USA) Gary Smith (USA) David Yeh (USA) Andrew Kahng (USA)

2. ITRS Design ITWG 2012 2 Design and System Drivers – Messages 1.Design technology continues to add low power roadmap techniques 2.Design technology, still unclear how new devices affected it (FinFET) 3.Design technology for 3D continues to spread across chapter 4.Design technology for resilience a fundamental portion of DFM 5.Non-Moore fabrics will require increasingly specialized DT 6.Memory an increasingly important factor for design technology 7.Push to integrate AMS/RF on SoC/SiP despite positive 3D prospects 8.Soaring applications may overhaul driver list: DTV, microservers…

3. ITRS Design ITWG 2012 3 Highlights of 2012-2013 Plans 1.Design Chapter Review/next ver of Power-Aware DT roadmap (2012-13) - DONE Special DT for non-Moore fabrics (SW, AMS/RF, MEMS) (2013) - PENDING Updates on LCP, DFT, Design Verification; v2 of 3D section (2013) - PENDING Additional content on (design for) resilience, memory (2012) - PENDING 2012 (September) – need to have updated tables (ext by 1 yr) (2012) - PENDING 2.System Drivers Chapter Revisit the AMS/RF sub-driver of Consumer SOC driver (2013) - PENDING Overhaul SOC-CP & CS (TV) models, Embedded Memory (2013) - PENDING Overhaul Driver list ? Is SOC-CS really a driver? Who is ? (2012) - PENDING What's the next driver ? Automotive, Medical, Energy. Update MPU model (&frequency). What about microservers ? (2012) - PENDING 3.Cross-TWG CTSG: node timing, additional A-factor updates (2012) - PENDING How will FinFET, UTBB SOI timing change PPA projections? (2012) - PENDING Renewal of PIDS roadmaps (compact modeling interaction) (2012-13) - PENDING 3D effort with the other TWGs (2012-13) - PENDING

4. ITRS Design ITWG 2012 4 Highlights of 2012-2013 Plans 1.Design Chapter Review/next ver of Power-Aware DT roadmap (2012-13) - DONE Special DT for non-Moore fabrics (SW, AMS/RF, MEMS) (2013) - PENDING Updates on LCP, DFT, Design Verification; v2 of 3D section (2013) - PENDING Additional content on (design for) resilience, memory (2012) - PENDING 2012 (September) – need to have updated tables (ext by 1 yr) (2012) - PENDING 2.System Drivers Chapter Revisit the AMS/RF sub-driver of Consumer SOC driver (2013) - PENDING Overhaul SOC-CP & CS (TV) models, Embedded Memory (2013) - PENDING Overhaul Driver list ? Is SOC-CS really a driver? Who is ? (2012) - PENDING What's the next driver ? Automotive, Medical, Energy. Update MPU model (&frequency). What about microservers ? (2012) - PENDING 3.Cross-TWG CTSG: node timing, additional A-factor updates (2012-13) - DONE How will FinFET, UTBB SOI timing change PPA projections? (2012-13) - DONE Renewal of PIDS roadmaps (interaction on compact modeling) (2012-13) - DONE 3D effort with the other TWGs (2012-13) - PENDING

5. ITRS Design ITWG 2012 5 Design Cost Chart

6. ITRS Design ITWG 2012 6 Power Design Technology Roadmap

7. ITRS Design ITWG 2012 7 Power Design Technology Roadmap NEW: approximate computing, dark Silicon, extreme heterogeneity

8. ITRS Design ITWG 2012 8 New Power Design Technology 1.Approximate computing Variable-accuracy computing (e.g., flexibly going from 64b to 16b) 4D computing: reconfiguration on the fly AVS ? (e.g., part of DVFS). Margin reduction? 2.Dark Silicon normally-off computing = extreme power gating 3.Extreme heterogeneity coprocessor-dominated architectures (pervasive heterogeneity; energy- efficiency from specialization; HW accelerators) 10 x 10, 13 dwarves, … Cf. Intel accelerators for MPU vs. Tensilica (or, GPUs, xPUs) NOTES Not every product can use all the techniques Asynchronous could be too late HW Virtualization and Superscalar factors need to be examined

9. ITRS Design ITWG 2012 9 Highlights of 2012-2013 Plans 1.Design Chapter Review/next ver of Power-Aware DT roadmap (2012-13) - DONE Special DT for non-Moore fabrics (SW, AMS/RF, MEMS) (2013) - PENDING Updates on LCP, DFT, Design Verification; v2 of 3D section (2013) - PENDING Additional content on (design for) resilience, memory (2012) - PENDING 2012 (September) – need to have updated tables (ext by 1 yr) (2012) - PENDING 2.System Drivers Chapter Revisit the AMS/RF sub-driver of Consumer SOC driver (2013) - PENDING Overhaul SOC-CP & CS (TV) models, Embedded Memory (2013) - PENDING Overhaul Driver list ? Is SOC-CS really a driver? Who is ? (2012) - PENDING What's the next driver ? Automotive, Medical, Energy. Update MPU model (&frequency). What about microservers ? (2012) - PENDING 3.Cross-TWG CTSG: node timing, additional A-factor updates (2012-13) - DONE How will FinFET, UTBB SOI timing change PPA projections? (2012-13) - DONE Renewal of PIDS roadmaps (interaction on compact modeling) (2012-13) - DONE 3D effort with the other TWGs (2012-13) - PENDING

10. ITRS Design ITWG 2012 10 Memory as a Key Factor in Future DT Figure DESN12 Possible Variability Abstraction Levels Physical Device Gate Chip Bit Cell Circuit Array

11. ITRS Design ITWG 2012 11 Memory as a Key Factor in Future DT Figure DESN8 Variability-Induced Failure Rates for Three Canonical Circuit Types

12. ITRS Design ITWG 2012 12 Highlights of 2012-2013 Plans 1.Design Chapter Review/next ver of Power-Aware DT roadmap (2012-13) - DONE Special DT for non-Moore fabrics (SW, AMS/RF, MEMS) (2013) - PENDING Updates on LCP, DFT, Design Verification; v2 of 3D section (2013) - PENDING Additional content on (design for) resilience, memory (2012) - PENDING 2012 (September) – need to have updated tables (ext by 1 yr) (2012) - PENDING 2.System Drivers Chapter Revisit the AMS/RF sub-driver of Consumer SOC driver (2013) - PENDING Overhaul SOC-CP & CS (TV) models, Embedded Memory (2013) - PENDING Overhaul Driver list ? Is SOC-CS really a driver? Who is ? (2012) - PENDING What's the next driver ? Automotive, Medical, Energy. Update MPU model (&frequency). What about microservers ? (2012) - PENDING 3.Cross-TWG CTSG: node timing, additional A-factor updates (2012) - PENDING How will FinFET, UTBB SOI timing change PPA projections? (2012) - PENDING Renewal of PIDS roadmaps (interaction compact modeling) (2012-13) - PENDING 3D effort with the other TWGs (2012-13) - PENDING

13. ITRS Design ITWG 2012 13 MTM – AMS/RF Subdriver Several emphases in DT, DFT: System verification, Hetero systems Plan: paste high-level block model from AMS/RF -- core model –Hope to obtain model from additional groups, market analysis –E.G. WiFi/GPS/cellular/BT/NFC front-end blocks, tuner/demodulator blocks

14. ITRS Design ITWG 2012 14 Generating Mixed-Fabric Drivers Primitive models (Digital) Functional blocks (digital) SoC / SiP Drivers (SoC-CP) Device models (PIDS) Technology models (A&P) Technology models (Interconnect) Device models (ERD) Primitive models (Other) Primitive models (AMS/RF) Functional blocks (non- Moore) SoC / SiP Drivers (SoC-CS) GAP …

15. ITRS Design ITWG 2012 15 What Drivers? 1.SOC-Consumer Portable (CP) Driver What will be future driving applications ? What Geos would drive them moving forward ? US ? Are phone and tablet similar enough for SOC-CP projection? 2.SOC-Consumer Stationary (CS) driver Is it still a driver ? (orginially abstracted from Cell) Smart TV processor ? Kinect ? Is Signal processing on mobile similar to stationary ?

16. ITRS Design ITWG 2012 16 Proposed changes to MPU Model ItemCurrent (2011) model Proposed model Die area140mm 2 (CP), 260mm 2 (HP) Area ratioCore :: 1Core : LLC : UnCore :: 1: 1: 1 LLCNA12MB (2011) + 1.4x every tech node [Borkar10, Borkar07] UnCoreNAUncore Scaling SRAM A-factor (U SRAM ) 60F 2 (6T), 84F 2 (8T) (bulk) 60F 2 (6T), 84F 2 (8T) (bulk, FinFET) 40F 2 (6T), 56F 2 (8T) (high-density FinFET) *** * CP – Cost-Performance; HP – High Performance ** L2$ and L1$ is per core

17. ITRS Design ITWG 2012 17 Uncore (increasing portion of MPU) consists of: –Memory controller(s) –Graphics and display controller(s) –I/O and bus interface controller(s) Updated MPU Model: UnCore Scaling ItemProposed model Memory controllerN/2 (CP), N (HP); N = # cores [Borkar07, Borkar11, 80-core, IVB] Graphics and Display controller2x every tech node [NHM, SNB, NVIDIA] I/O and bus interface controllerN/6 [SNB, IVB] Logic (# transistors) growthSame as core Logic densitySame as core SRAM (# bitcells) growth512MB * # GPU-Cores [IVB, NVIDIA] SRAM densitySame as core

18. ITRS Design ITWG 2012 18 SoC / MPU Potential Driver Convergence ? Ongoing product roadmap and More-Than-Moore impact analysis (WIP) Recent SoC clock and #cores frequency scaling trends May need to re-examine existing MPU and/or create new driver 1.Clock frequency growing at 1.5X every 2 years. 2.Number of cores growing at 2X every 4 years. 3.Networking-like SoC scaling: off-chip latency, accelerators, L3 cache 4.Power limitation under 4W per core (HPC example). 5.Off-chip speed can be as high as 204 Gbits / sec. 6.Mobile Computing SoCs increasingly competing in server space Beginning to be used in data centers and cloud computing Extreme core efficiency (active power <4W, sleep power< 0.5W) Cores and frequency scaling similar to conventional MPUs

19. ITRS Design ITWG 2012 19 Special DT for non-Moore fabrics SW, AMS/RF, MEMS, 3D / novel packaging ? Current design technology still insufficient Design technology will continue to broaden What design technology is needed beyond current ideas ? New 3D / TSV design flows New multi-physics modeling, simulation, analysis tools Example: thermal / mechanical analysis (base station) Example: MEMS + electrical analysis (mobile gaming) Example: sensors + signal processing (industrial, medical) Example: software + HW simulation (data center network)

20. ITRS Design ITWG 2012 20 Device Model / PIDS interaction Agreed to only one low power device in the roadmap Removed LOP device flavor from 3 to 2 devices Still questioning how much CD variation can be tolerated Should Design content change as we move toward 450 mm ? Should Design care about node definitions ? (foundry names vs. ITRS)

21. ITRS Design ITWG 2012 21 Design and System Drivers – Messages 1.Design technology continues to add low power roadmap techniques 2.Design technology, still unclear how new devices affected it (FinFET) 3.Design technology for 3D continues to spread across chapter 4.Design technology for resilience a fundamental portion of DFM 5.Non-Moore fabrics will require increasingly specialized DT 6.Memory an increasingly important factor for design technology 7.Push to integrate AMS/RF on SoC/SiP despite positive 3D prospects 8.Soaring applications may overhaul driver list: DTV, microservers…