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3D ICs for Mobile Computing GSA/ITAC April 2011 Paul Kempf.

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Presentation on theme: "3D ICs for Mobile Computing GSA/ITAC April 2011 Paul Kempf."— Presentation transcript:

1 3D ICs for Mobile Computing GSA/ITAC April 2011 Paul Kempf

2 3D ICs for Mobile Computing (or Mobile Computing = Smartphone evolution) 1.Smartphone trends driving 3D ICs 2.Technology for 2.5D & 3D – Through Silicon Via (TSV) for Memory – Interposers & Wafer Level Packages – Heterogeneous Integration – Embedded silicon 3.10 years in 2

3 Smartphone Component Footprint PCB Area (mm 2 ) Year Mainstream Smartphone fewer ICs each year integration into a few subsystems High-End Smartphone die size limited SoCs integration has not kept pace with feature race handhold size contraint

4 Torch SIM Card Holder uSD Card Holder EDGE Transceiver SAW Filters UMTS PA EDGE PA WiFi/BT Audio Codec PMIC ISP uP and Memory eMMC GPS Analog BaseBand RF PMIC UMTS Transceiver EDGE Filters RF Switch uUSB connector Side 2

5 Smartphone Part Count Component Count (#) Year Mainstream Smartphone high level integration lower cost increasing performance High-End Smartphone mobile computing platform packed with features embedded memory many radio connectivity sensors cameras time-to-market is key

6 High-End Memory Performance LPDDR1 LPDDR2 LPDDR2 2ch LPDDR3 2ch Wide IO SDR Wide IO DDR 2X

7 BiCMOS to CMOS analogy Lesson from Compute Servers Power density driving 3D integration for servers Mobile devices have extreme thermal constraints - How long until mobile follows servers?

8 Integration is dead Long live (3D) integration Number of die in package Hybrid/Ceramic/Glass Mixed Semiconductor Technology SoC 2.5D 3DIC PoP SiP NOW RF CMOS Mixed Signal Year (courtesy Yuan Xie, PENNSTATE)

9 3D Applications in Mobile Memory SpeedPower Imaging Sensitivity RF Efficiency Power Mgt Size Connectivity Size

10 TSV Memory Stack LPDDR2 with TSV stack Applications Processor with TSV Design standards required to scale-up supply base Bump layout Array configuration Pin Assignments (source: Texas Instruments)

11 Heterogeneous Integration Silicon interposer advantages – Reduced die complexity – Mixed technologies Mechanical Strength Fewer IO Lower power Wide interfaces (source: Amkor Technology, Inc.)

12 Cost-Efficient Heterogeneous Stacking Heterogeneous integration is usually expensive 3D stacking: cost-efficient for heterogeneous integration (Courtesy: Borkar, Intel)(Courtesy: Yuan Xie, PENNSTATE)

13 Silicon Embeded Substrate (1)Space saving / Miniaturization (2)Reduction of IC bump pitches potentially leads to size reduction of the IC (3)SESUB can take over redistribution (4)Low height substrate of max. 300µm incl. the embedded ICs (5)Excellent EMI performance, good heat dissipation, high reliability (6)Roadmap to embed Thin-Film inductors, Thin-Film capacitors and other passive components (7)Integrated Shielding (source: TDK-EPC Corporation)

14 SESUB Process Flow Bumping Half Dicing Back Grinding (source: TDK-EPC Corporation)

15 Preparing L1-L2Chip MountingLaminationVia HolePlating SESUB Process Flow (source: TDK-EPC Corporation)

16 LaminationVia Hole L1&L4Plating & EtchingSR LaminatingSolder Ball AttachSMT & CSP MountUnder Fill SESUB Process Flow (source: TDK-EPC Corporation)

17 Layer 1-2 via Layer 2-3 via Layer 3-4 via Line/space 40/40 µm (min) IC ( Si thickness: 50 µm ) Bump BGA SMD partsFine pitch connection µm (min.) Layer 2 Layer 1 Layer 4 Layer 3 Cross-section of highly integrated SESUB module Substrate thickness 300 μm (source: TDK-EPC Corporation)

18 Module size :10 x 8 x1,6mm 285pins 0.5mm pitch BGA, Ball size Φ0.25mm Die : PM-IC die 5.0 x 5.0mm, Digital die 2.8 x 2.4mm 31 components integrated Metal Can Shield or Integrated Shield 0.3mm 1,6 mm L C C C L Molding Resign Shielding Metal 0.1mm 1.0mm L4 L3 L2 L1 VLS2520 C1005 MLP2012 C1005 MLP1608 C1005 C1608 C06 8mm 10mm 0.5mm 0.25mm C06 PMU (Power Management Unit) (source: TDK-EPC Corporation)

19 Connectivity Combo Module - R074 R054D = (9.5 x 11.9 mm) Buried Quad-Combo IC (GPS-WLAN-BT-FM) SESUB size reduction of 45% R074 = (7.5 x 8 mm) (source: TDK-EPC Corporation)

20 Mixed TSV and SESUB (source: Yole Developpment)

21 10 Years in 2 A Mobile Computing Revolution Now Performance improvement Power reduction Next Sub-system integration Miniaturization Future Laptop in your hand Mobile revolution

22 Acknowledgements Thanks to those who put together a lot of the original material for this review: – Yuan Xie, PENNSTATE – R. Schmidt, IBM – Texas Instruments – Amkor Technology, Inc. – TDK-EPC – Yole Developpment

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