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2007013265 Moon – jun young. Index  Introduce product  Semiconductor product manufacturing process Wafer backgrinding Wafer saw Die attach Mold Mark.

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Presentation on theme: "2007013265 Moon – jun young. Index  Introduce product  Semiconductor product manufacturing process Wafer backgrinding Wafer saw Die attach Mold Mark."— Presentation transcript:

1 2007013265 Moon – jun young

2 Index  Introduce product  Semiconductor product manufacturing process Wafer backgrinding Wafer saw Die attach Mold Mark Sorter Visual packing

3 Introduce product  PKG(TSOP,SOP)  Card(sdcard)

4 wafer  The wafer is cut into pieces called dies.

5 manufacturing process  Wafer backgrinding For Uniform thickness of the wafer

6 manufacturing process Wafer saw ○ cutting wafer for assemble the pieces of the wafers(die)

7 manufacturing process  Die attach attach the die on die pad using epoxy

8 manufacturing process  Mold the process that cover with device by plastic

9 manufacturing process  Mark  In order to distinguish it from other things, a kind of marker is engraved process

10 manufacturing process  Sorter

11 manufacturing process  Visual  Checking product

12 manufacturing process  Packing & delivery

13


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