1. High Altitude Balloon Payload Design Project Critical Design Review July 17, 2012

2. Design Team: Jen Hoff (EE) Kate Ferris (EE) Alison Figueira (CS) Makenzie Guyer (CS) Kaysha Young (ME/MET) Emily Bishop (ME) Advisors: Dr. Brock J. LaMeres -Electrical & Computer Engineering Dr. Angela Des Jardins -Montana Space Grant Consortium Hunter Lloyd -Computer Science Robb Larson -Mechanical & Industrial Engineering Sponsor: NASA

3. To collect measurements at high altitudes of atmospheric temperature and pressure, the internal temperature and dynamic movement of a payload that meets HASP flight requirements. Mission Objective Budget: $500 Schedule: 8 Weeks 6/4/12 -7/27/12

4. Functional Requirements Log/Store data from the sensors on a non-viotile storage device Power Sensors and any electronics needed to run these sensors Protect the system from environmental conditions Protected from the impact upon landing/jerk from the balloon pop Provide state of health information of the system Performance Requirements Consume 5 watts in order to accurately represent the research team’s thermal output Log data from the temperature and pressure sensors at a rate of 1 measurement per second Provide insulation to keep the internal temperature between -40 C and 60C Must provide at least 4 hours of power for the duration of the setup, flight, and recovery time. Must withstand an vertical force of 10 G and a horizontal force of 5 G Physical Requirements Must weight 1.62 kg Maximum Total Volume: 15 cm x 15 cm x 30 cm Must mechanically interface with the HASP payload plate in addition to the BOREALIS system Reliability Requirements Must be able to survive preliminary tests and two launches Mission Requirements

5. 2012 Payload Computer System Electrical SystemMechanical System System Architecture

6. Computer System Logging DataInterpreting Data Reading from Sensors SD CardSD Shield 2012 Payload Computer System Electrical System Mechanical System

7. Goes through same process for Pressure Sensor, and all Three Temperature Sensors Start Setup: Start LED’s, define pins, startup SD library, startup IMU, define timers Loop: Update Timers, average IMU data Timer goes off Retrieve Data Interpret Data Store in RAM Store on SD card, with timestamp (millis) Analog Sensors Event Get Accelerometer and Gyroscope Values Average Values Store current averages in Array IMU Event Store IMU averages to SD card with timestamp (millis) Reset current averages and clear average array Program Flow Chart

8. Testing SD card Timer Events SD card, RTC (not used), and timers Reading from Analog Sensors Reading from IMU

9. Testing Cont. Timer Events

10. Testing Cont. SD card, RTC, and timers

11. Testing Cont. Reading From Analog Sensors

12. Data from Burn In Test RTC was not working correctly, addressing problem with Gyroscope, but it was able to record and store data for the duration of the Burn In Test

13. Cold Test In the second cold test, only the analog sensor data was collected. Problem with temperature sensors Collected data every second for duration. 5753462 milliseconds ~ 95.891 minutes

14. Refrigerator Test After getting new temperature sensors, the computer and sensor were placed in the fridge for ~10 min. trials. The fridge got down to 8C.

15. Flight Plan For the first flight, just the analog sensors (pressure and three temperature) will be used. Between flights the IMU will be tested (addressing issue is fixed) Second flight will have all sensors hooked up.

16. Budget

17. Electrical System Sensors Power System Batteries Pressure Temperature Movement Acceleration Interfacing Electrical System 2012 Payload Computer System Electrical System Mechanical System

18. Schematic

19. Burn In Test

20. Burn In Test Results BURN-IN TEST TIME VOLTAGE of BatteriesCURRENT from BatteriesVOLTAGE 3.3CURRENT from 3.3 0 minutes 14.2 V0.07 A3.29 V7.8 mA 5 minutes 12.4 V0.068 A3.298 V7.6 mA 10 minutes 12.13 V0.0689 A3.299 V7.8 mA 15 minutes 12.068 V0.068 A3.299 V7.7 mA 20 minutes 12.057 V0.0685 A3.2999 V7.7 mA 25 minutes 12.056 V0.068 A3.2999 V7.6 mA 30 minutes 12.046 V0.071 A3.2999 V6.8 mA 35 minutes 12.05 V0.071 A3.2999 V6.8 mA 40 minutes 12.056 V0.071 A3.2999 V6.8 mA 45 minutes 12.061 V0.071 A3.2999 V6.8 mA 50 minutes 12.063 V0.071 A3.2999 V6.8 mA 60 minutes 12.069 V0.071 A3.2999 V6.8 mA 70 minutes 12.073 V0.071 A3.2999 V6.8 mA 80 minutes 12.076 V0.071 A3.2999 V6.8 mA 90 minutes 12.079 V0.071 A3.2999 V6.8 mA 100 minutes 12.080 V0.071 A3.2998 V6.8 mA 130 minutes 12.083 V0.071 A3.2998 V6.8 mA 160 minutes 12.087 V0.071 A3.299 V6.8 mA 190 minutes 12.088 V0.071 A3.299 V6.8 mA 220 minutes 12.088 V0.071 A3.299 V6.8 mA

21. Burn In Test  Total Discharge  Needed to add power resistors which updated the current pulled from the batteries to 0.241919771 A

22. Cold Test  Cold Test  Put the temp sensor into the fridge with an external temp sensor and recorded the values of the test.

23. Output Wattage  Power Resistors  Needed to add 2W to the inside of the payload to reach the required 5W

24. Output Wattage Pressure: 0.00528 Temp Sensors: 0.0165 Batteries: 2.915037 Power Resistor: 2.063 Total: 4.999817 P=I*V

25. Mass Budget  Mass of the inside of the Payload  Weighted 0.73lbs.

26. Budget Sensors(+shipping): $122.92 Batteries: $82.32 Battery Boxes: $4.58 PC Board: $12.81 Headers: $12.76 Total: $237.86

27. Mechanical System Structural System Thermal Structure Temperature Material Enclosure Attachment Impact Mechanical System 2012 Payload Computer System Electrical System Mechanical System

28. Thermal i. Must be similar to the MSU HASP Research Team structure materials 1.Polystyrene must be used for the insulation (approx. 1 cm thickness) 2.A shiny reflective aluminum coating should be applied 3.Additional material or support structures will be needed to make the structure strong ii. The internal temperature of the payload must be kept between -40 C and 60 C Structural System i. Enclosure 1. The external volume may not exceed 5.875 in x 5.875 in x 11.8 in (15 cm x 15 cm x 30 cm) 2. The internal volume must be at least 131.6 in 3 : 4.5 in x 4.5 in x 6.5 in ii. Attach Enclosure Structure 1. HASP 1. Enclosure must securely attach to HASP Plate and not be disconnected for the duration of the flight 2. Must be easily attached and unattached from the ASP plate for ease of assembly and disassembly 2. BOREALIS 1.Must attach to the BOREALIS rope connection system iii. Impact Forces 1. Must withstand a vertical impulse force of 10 G’s 2. Must withstand a horizontal impulse force of 5 G’s Mechanical Systems Requirements

29. Preliminary Design Review Results

30. Immediate Changes to the PDR ** Reduced height to 6 inches ** Choose to not use corner rebar wire ** Changed L Brackets to Corner Brackets ** Not using Plaskolite

31. Assembly : Initial Trials Fiberglass and Resin + foam = disaster Fiberglass and Resin + Aluminum foil + duck tape = success

32. New Design Implementations Improved Design Considerations Access Electronics while they are attached to HASP Plate No Reflective surfaces as not to interfere with other HASP Payloads HASP Power Cord entrance Implementing Technique Make the top and one side panel removable Paint the exterior white Cut a small aperture at the back of the payload for cords to run in.

33. Payload : Structural Elements Structural Support Enhancers: * Fiber Glass Cloth * Corner Brackets 0.5” thick Expanded Polystyrene Insulation White Reflective Paint Fiber Glass Cloth W/ resin Material Configuration

34. Payload :Electronic Stabilization * 4-40 Hex Socket Cap Screws

35. Payload : Exterior Surface Krylon Flat White Paint - Chosen by the HASP team due to research done by prior space flight teams from MSU

36. Payload : Assembly -HASP Plate -High Conductive Copper Heat Sink -3 walled structure -1 wall - 1 top -17 – 10-32 x ½” button head screws - 4 – 10-32 x 1” button head screws -4 – 4-40 x 1.25” hex socket cap screws - 4- 4-40 x 2.0” hex socket cap screws

37. Payload : Attachment to HASP Corner Brackets 4 – 10 32 x 1” button head screws 4 - #10 Nuts

38. Payload : Attachment to BOREALIS Due to odd shape and unevenly distributed weight, the BOREALIS Team is configuring an attachment plan.

39. Type of Test -Drop Test -Long Term Thermal Test What will be Tested - Accelerometers -Structure components -Insulation -Heat Sink Mechanical System - Testing

40. Test #1 : Drop Tests Accelerometer Testing ** Must withstand a 10 G vertical load ** Must withstand a 5 G horizontal load Test: The accelerometer was attached to the inside of the box with duct tape. A lab view program was set up to collect acceleration data from X, Y, Z, and Total Acceleration. The interior was padded with packing foam. The box was dropped from various heights, ensuring that the G loads were met.

41. Test #1 : Drop Test Results Vertical Test Horizontal Test Maximum Load: 15 G Maximum Load : X - 8 G Y – 10 G

42. Test #1 : Drop Test Results A drop test was completed to test the ability of the box to withstand a much higher load. The over all acceleration reached over 20 G, and the vertical load reached 19 G. The enclosure showed no signs of wear or tear after these tests The enclosure will withstand the G loads required by HASP

43. Test #2: Thermal Test Cold Room Test: *Cold room at -60 C *Raise temperature to - 20C *No results due to failure to collect data from temperature sensors due to electronic problems

44. Mechanical Systems Mass Budget QuantityWeight/Piece (g)Total Weight Extruded Polystyrene1150 Fiber Glass and Resin122.5 Brackets428.576114.304 Bracket Mounting Hardware 417.236868.9472 HASP Mounting Material49.980439.9216 CCA Stack Mounting Standoff 410.433841.7352 Total Mass 840.51

45. MaterialCost Extruded Polystyrene$12.25 Brackets & Assembly Hardware8.58 Mounting Hardware5.48 Heat Sink34.95 Miscellaneous Assembly Materials (fiberglass, resin, acetone, duct tape, gorilla glue, etc) 68.81 Paint11.95 Total142.02 Mechanical System Budget

46. Total Budget Computer Science: $62.70 Electrical: $237.86 Mechanical: $142.04 Total: $442.60 Under budget:$57.40

47. Final Configuration