1. S Pyatt Cicorel optimised welding parameters

2. S Pyatt 30 degree loop parameters

3. S Pyatt BJ820 bond chart for Cicorel board

4. S Pyatt BJ820 bond chart for Loctite 3525 die to sub Work in progress

5. S Pyatt BJ820 bond chart for Loctite 3525 die to die Work in progress

6. S Pyatt BJ820 bond chart for Dymax 6 621 die to sub

7. S Pyatt BJ820 bond chart for Dymax 6 621 die to die

8. S Pyatt BJ820 bond chart for Dymax 3013 die to sub

9. S Pyatt BJ820 bond chart for Dymax 3013 die to die

10. S Pyatt BJ820 bond chart for Dymax 3013 die to sub

11. S Pyatt BJ820 bond chart for TRA DUCT die to die

12. S Pyatt BJ820 bond chart for TRA DUCT die to sub Work in progress

13. S Pyatt Pull test results Loctite 3525 die to die Work in progress

14. S Pyatt Pull test results Dymax 6 621 die to die Average g:9.470557 Std Dev g:0.440693 Fail typeFrequency First heel break37 Second heel break42 First heel peel0 Second heel peel0

15. S Pyatt Pull test results Dymax 3013 die to die Average g:9.310747 Std Dev g:0.481358 Fail typeFrequency First heel break79 Second heel break0 First heel peel0 Second heel peel0

16. S Pyatt Pull test results TRA DUCT die to die Average g:8.99628 Std Dev g:0.488235 Fail typeFrequency First heel break82 Second heel break0 First heel peel0 Second heel peel0

17. S Pyatt Pull test results Loctite 3525 die to substrate Work in progress

18. S Pyatt Pull test results Dymax 6 621 die to substrate Average g:10.88151 Std Dev g:1.444102 Fail typeFrequency First heel break14 Second heel break13 First heel peel0 Second heel peel24

19. S Pyatt Pull test results Dymax 3013 die to substrate Average g:10.6189 Std Dev g:1.301571 Fail typeFrequency First heel break18 Second heel break6 First heel peel0 Second heel peel27

20. S Pyatt Pull test results TRA DUCT die to substrate Work in progress

21. S Pyatt Why is there are difference? Pull angles!

22. S Pyatt Maths goes here

23. S Pyatt The peels are actually vertical tears Completed weld marks

24. S Pyatt Meanwhile on the dies No peels. All heel breaks.

25. S Pyatt Conclusions All three UV glues are suitable for wire bonding on the Hesse BJ820. Pull testing for die to die wires gives the correct results. Pull testing for die to substrate wires gives false results due to incorrect pull angles. The process is not suitable for production work.