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- Purpose - Main sequences - Resources (manpower and GSE), including location -Main activities of the assembly and integration of the subsystems -Final.

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Presentation on theme: "- Purpose - Main sequences - Resources (manpower and GSE), including location -Main activities of the assembly and integration of the subsystems -Final."— Presentation transcript:

1 - Purpose - Main sequences - Resources (manpower and GSE), including location -Main activities of the assembly and integration of the subsystems -Final integration and tests EUSO-BALLOON DESIGN REVIEW, 18.12.2012, CNES TOULOUSE Sylvie Dagoret-Campagne LAL, Orsay, Baptiste Mot, IRAP, Toulouse The EUSO-BALLOON AIT- Development plan 1

2 CDR – 18.12.2012AIT Development plan and GSE2 EUSO-BALLOON, a Highly Modular instrument 4 subsystems : « electrical » (DP,PDM,DP) 1 mechanical, DP : 11 components (boards), PDM : 5 components (boards), PWP : 1 Each component under the responsibility (design, fabrication, procurement) of different laboratories world wide spread. Phase B  Phase C&D  Need AIT/AIV procedures Need resource evaluation Need time evaluation (planning)

3 Main sequences of Integrations CDR – 18.12.2012AIT Development plan and GSE3 EC-Unit Integration: MATRA-LAL Electronic Integration: LAL Electronic Integration: LAL Data processing Integration: INFN-Naples Data processing Integration: INFN-Naples PDM integration: APC PDM integration: APC Optics Tests: RIKEN-JP/UAH- US tests Optics Tests: RIKEN-JP/UAH- US tests Full electronics intgration: APC Full electronics intgration: APC Instrument Integration: B.I.S CNES Instrument Integration: B.I.S CNES Mechanics assembly: B.I.S CNES Mechanics assembly: B.I.S CNES Final Tests: B.I.S CNES time

4 Manpower for AIT Full Instrument AIT :B. Mot/IRAP Mechanical AIT : G. Roudil/IRAP Electronic AIT : M Dupieux/IRAP Optical AIT : C. Catanalo/IRAP AQ AIT : TBD / IRAP CDR – 18.12.2012AIT Development plan and GSE4 PDM-AIT : P. Barrillon/S. Dagoret /LAL H. Miyamoto/L AL S. Blin/LAL C. Moretto/LAL APC Team DP AIT : G. Osteria/INF N Naples- INFN Rome- INFN BARI-INFN IAAT- Tuebingen Full integration : Subsystem/ electronic integration : DP integration :

5 GSE-PDM AIT Development plan and GSE5CDR – 18.12.2012

6 GSE-CAL AIT Development plan and GSE6CDR – 18.12.2012

7 GSE-DP and GSE-Opt AIT Development plan and GSE7CDR – 18.12.2012

8 Component Pre-assembly Componen t test EC-Unit HVPS EC-ASIC PDM-B Pre- Integration Assembly Integration Tests & Validation PAECM2 PAECM1 THV1 THV2 TECA2 TECA1 TPD1.. N TPD1.. N IEC1 IEC2 IEC3 IEL1 IEL2 AP 1 AP 2 AP 3 CAPH EEC1 TrigP DM CAKI EC1 CDR – 18.12.2012AIT Development plan and GSE8 PDM AIT activities sequence

9 PDM AIT activities list AIT Development plan and GSE9CDR – 18.12.2012 Test namecomponentcommentdurationlocationwho component pre-assembly PAECM1MAPMT Photon collection efficiency and gain measurement for each channel1 month for 36 unitsAPCAPC & LAL PAECM2MAPMTSorting to fit an EC1 hourAPC THV1HVPScable reference THV2HVPSHV tuning (depending on PMT gains) APC Component Tests TECU1EC-Unit static test under HV, normal air pressure1 hourLAL TECU2EC-Unitstatic test under HV, low pressure12 hoursAPCLAL TECA1EC-ASICvisual inspection1 hourLAL TECA2EC-ASICelectronic test bench1 week for 6 unitsLAL TPD1PDM-B Electrical mechanical compatibilitie1 dayKoreaSKKU TPD2PDM-BPower supply tests1 dayKoreaSKKU TPD3PDM-BASIC configuration1 dayKoreaSKKU TPD4PDM-BASIC readoutTBDKoreaSKKU TPD5PDM-BTrigger functionality testsTBDKoreaSKKU TPD6PDM-BHVPS switch control testsTBDKoreaSKKU TPD7PDM-BDP (or CCB) interfacesTBDKoreaSKKU TPD8PDM-BHK logic and interface testsTBDKoreaSKKU Pre-Integration IEC1EC-Unit+HVPS static test under HV, normal air pressure1 hour per EC unitAPCAPC&LAL IEC2EC-Unit+HVPSstatistic test under HV, low pressure12 hour / EC-UnitAPCAPC&LAL IEC3EC-Unit+HVPS+EC-ASIClight on EC-Unit+ EC-ASIC red by Test-EC-ASIC 10 days assembly+15 days testsAPCAPC&LAL IEL1PDMPDM-B readout external computer LALAPC&LAL IEL2PDM+DPlink CCB+PDM-B1 weekLALAPC&LAL

10 PDM-AIT Activities list AIT Development plan and GSE10CDR – 18.12.2012 Test namecomponentcommentdurationlocationwho Assembly AP19 EC-Units+PDM-Frame mechanical integration and screwing1 dayAPCLAL AP2 9 EC-Units+6 EC-ASIC+PDM- Frame mechanical integration and screwing1 dayAPCLAL AP3 9 EC-Units+6 EC- ASIC+HVPS+PDM-Framecabling1 weekAPC AP4 9 EC-Units+6 EC- ASIC+HVPS+PDM-B+PDM- Frame mechanical integration and cabling1 weekAPCLAL Calibration CAPHEEC1 EC-Units+EC-ASIC Photon counting calibration (Test-EC- ASIC)3 weeksAPCAPC&LAL CAKIEC1 EC-Units+EC-ASIC KI channels calibration (Test-EC-ASIC)3 weeksAPCAPC&LAL Validation TrigPDM PDM + light source apply a fast moving light spotfew daysAPCAPC&LAL SWLOG PDM + light source apply a variable light sourcefew daysAPCAPC&LAL

11 DP-Activities sequence AIT Development plan and GSE11CDR – 18.12.2012

12 DP-AIT Activities list AIT Development plan and GSE ID51212 Test namecomponentcommentdurationlocationwho ID1LVPS+HK+CPU 1-2 monthesNaples IAAT and INFN (NA-BA- Roma2) and Korea ID2LVPS+HK+CPU+GPS+CLKSPI tests ID3 LVPS+HK+CPU+GPS+CLK+C CB ID4 LVPS+HK+CPU+GPS+CLK+C CB CCB through SPI ID5 LVPS+HK+CPU+GPS+CLK+C CB CCB through Spacewire ID6 LVPS+HK+CPU+GPS+CLK+C CB+PDM-B … ID1 ID5 CDR – 18.12.2012

13 Computer PDM board EC-ASIC board Power supply Logic analyzer NI(PC interface) Multimeter Charge injection EC-ASIC board ASIC PDM board AIT Development plan and GSE13 Pre-Integration EC-ASIC and PDM-B CDR – 18.12.2012

14 PDM-B-DP Pre-Integration CDR – 18.12.2012AIT Development plan and GSE14

15 EC-HV EC-DYNODE HVPS2 HVPS1 MAPMT EC-ANODE EC-ASIC PDM-B IR-CAM Batteries PWP LVPS-DP1 LVPS-DP2 LVPS-PDM LVPS-HK HK CCB CLKB GPSR CPU DST SIREN CNES Telemetry EXT Bat Controller TLS Sensors Motors SPACEWIRE /PCI EC-Front EC-Back DP INTERFACES TESTED UP TO NOW FOR HARDWARE DP PDM

16 Optical AIT Activities list AIT Development plan and GSE16 Test namecomponentcommentdurationlocationwho TOP1Lenses 1,2,3acceptance tests1 week/lensIKEGAMIRIKEN TOP2Lenses 1+2+3performances tests1 monthAlabamaUAH TOP3Lenses 1+2+3 validation tests for integrated instrumentTBDCNESIRAP TOP 1TOP 2 CDR – 18.12.2012

17 PWP Activities sequence AIT Development plan and GSE17CDR – 18.12.2012

18 AIT Development plan and GSE18 Activities- Task forms All activities are referred by an acronym, Each activity is performed in a sequence of AIT-AIV of a subsystem of of the instrument They are tracked in activity forms by AIT managers Description : Component, Configuration, GSE, Task details, procedures, results Example of description of a task

19 Final AIT-AIV Resp : IRAP location : CNES 1.Overview of Integration Phases 2.Sequence of integrations 3.Global tests 4.Transport and flight campaign preparation 5.Flight campaign #1 AIT Development plan and GSE19CDR – 18.12.2012

20 1.SEQUENCE FOR INTRUMENT INTEGRATION AIT Development plan and GSE20CDR – 18.12.2012

21 2.GLOBAL TESTS AIT Development plan and GSE21CDR – 18.12.2012

22 3. TRANSPORT AND FLIGHT-CAMPAIGN PREPARATION AIT Development plan and GSE22CDR – 18.12.2012

23 Flight campaign #1 CDR – 18.12.2012AIT Development plan and GSE23

24 CDR – 18.12.2012AIT Development plan and GSE24 Conclusions Main phases of AIT identified : Subsystems Instrument (Final), Many activities identified for subsystem AIT and their component integration, Test procedures assessed, Some activities can be done in parallel, some in sequences. Merging points. Activities are inserted in a sequence of AIT of the subsystems, Types of activities: Component tests, pre-integration, assembly, integration, tests and validation, calibration. Resources in manpower for AIT distributed, location of the activities, including the management. Resources in GSE listed, Timing estimated, Activities follow-up: AIT-AIV will be controlled and tracked by the AIT managers using activities forms.


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