1. Critical Design Review Northwest Nazarene University Advisor: Dr. Lawrence Chad Larson Ben Gordon Seth Leija David Vinson Zach Thomas Drew Johnson

2.  Section 1: Mission Overview ◦ Purpose ◦ Goals ◦ Theory ◦ Success ◦ Benefits ◦ Expected Results ◦ Organizational Chart  Section 2: Design Description ◦ Design Process ◦ Design Requirements ◦ User Guide Compliance ◦ System Overview ◦ Design View ◦ Superhydrophobic ◦ Flexible Chips ◦ Radiation Hardened Chips ◦ Pseudo code ◦ Block Diagram

3.  Section 3: Prototyping/Analysis  Section 4: Manufacturing Plan  Section 5: Testing Plan  Section 6: Risks  Section 7: Project management plan  Section 8: Conclusions

4. Mission Overview

5.  Study the feasibility of using Superhydrophobic materials in the presence of high acceleration and vibrations for possible use on space missions.  Test Radiation Hardened chips and new FleX chips with American Semiconductors Inc.

6.  Do research on superhydrophic material that would allow it to be used in future space missions.  Gather data on Radiation hardened chips and to gain experience working with the microchip industry.

7. Mission Overview: Theory  W hen water is in contact with the superhydrophobic surface (diatomaceous earth) it is more attracted to its own surface tension than it is to the material. This is because the material works like a microscopic bed of nails. Diatomaceous earth is a new material developed by John Simpson at Oakridge National Laboratory and is exceptional due to its high contact angle with water and low price.

8.  For this mission to be considered a success, the SH material needs to be recovered and tested post-flight. It would be best if the Superhydrophobic material survived the flight.  Get usable data from the radiation hardened chips

9.  The goal of this launch is to prove that this diatomaceous earth can survive a rocket launch and still be functional post-flight.  This material could have many different benefits if it is shown to survive space travel. The SH material has already been shown to work in microgravity by NNU and NASA’s SEED. NASA would benefit from the data gathered if they decide to use this material on future missions.

10.  It is hypothesized that the material will survive the high acceleration and vibrations and still be functional in post-flight testing.

11.  It is expected that the radiation hardened chips will make less errors in the flight compared to the non-hardened chips.

12. American Semiconductors Dale Wilson Electrical David Vinson Seth Leija Drew Johnson Superhydrophobic Mechanical Ben Gordon Chad Larson Zach Thomas Advisor Dr. Dan Lawrence Advisor Dr. Parke

13. Design Description

14.  Design Superhydrophobic Encasement  Design American Semiconductor Board/ Final Design of Plate.  Build encasement/Build American Semiconductor board.  Implement into Plate ◦ Test board ◦ Run full flight test

15.  Physical Envelope Cylindrical:  Diameter: 9.3 inches  Height: 4.75 inches  Mass Canister + Payload = 20±0.2 lbf  Center of Gravity Lies within a 1x1x1 inch envelope of the RockSat payload canister‘s geometric centroid.

16.  A Superhydrophobic “donut” will be on one plate  The electrical systems will be on another plate above the original plate.

17. Superhydrophobic “donut” Flexible Chips Geiger Counter Board Arduino Board

18. “Donut”  A donut shaped hollow object will house Superhydrophobic material. This shape allows for different forces on different axis.  This will be on the lower plate and will be placed around the center support.

25. Flexible Chips  New flexible chips from American Semiconductors will now be integrated in with the Arduino subsystem

26.  American Semiconductors will work with students to design a board which will test their radiation hardened chips Arduino/American Semiconductor Board & Geiger Counter

27. loadTestVectors(); runTestVectorsThroughASChips(); readSensorData(); writeSensorDataToSDCard(); saveTestToSDCard(); CompareResultsWithExpected(); If Error { writeErrorToSDCard(); } Our system will be activated by a G-Switch. When turned on, the Arduino will load test vectors from the attached SD card. Additional sensor data from previous RockON boards will also be written to the SD card. The test vectors will be run through different portions ASC’s chip and the results will be compared to the expected results. The raw data as well as the errors will both be written onto the SD card.

28.  Using 1 PCB  Geiger board will record radiation  Arduino board will test the radiation hardened chips and flex chips for error count  Arduino will also have flash memory  Activating with G-switch  There is software out there for Arduino that will be used

29. G-Switch Arduino ASC Chip (Packaged) ASC Chip (Unpackaged) Voltage Regulator SD Card Clock Microcontroller Power Data Clock Power Supply

30. Prototyping/Analysis

31.  Since the CDR, the superhydrophobic enclosure has been designed and is currently being prototyped on our dimension sst 1200es 3D printer. The materials have been collected from American Semiconductors and are in the process of being tested so they will function properly throughout the launch and flight.

32. 32 Mass Budget SubsystemTotal Mass (lbf) SH2.5 Electrical1 … … … … Total3.5 Over/Under6.5 The mass is scheduled to be found more thoroughly once the parts are procured Ballast will be needed

33.  Arduino board: 7 V with each I/O pin running on 40 mA.  Flexchips: 1.2 V, low but unknown amperage.  Geiger Counter: 9V, same as RockOn.  All parts will be turned on at the start of the flight.

34. Manufacturing Plan

35.  SH “Donut” needs to be manufactured Print Prototype Nov 30Jan 25 Complete Fabrication Mechanical Subsystem Begin Testing Jan 11 Fix errors in design Jan 18

36. Electronic Parts arrive Dec 12 Board assembled Electrical Subsystem Jan 23 Board design complete Feb 10 Feb 13 Testing Begins This schedule was made with help from American Semiconductor Inc.

37.  PCB Needs to be prototyped and manufactured  We suspect that there may be up to 5 small revisions made on the electronics.  The Arduino board, socket, SD card, and PCB still need to be obtained.

39.  Need to figure out how much water there needs to be to be useful in the “Donut”  Test for any leakage ◦ To test for leakage the amount of vibration resistance needs to be found ◦ A passed test will be zero leakage  Test the contact angle of the superhydrophobic surface.

40.  The chips will be tested to make sure they produce the correct outputs before entering an area with radiation to see how much the radiation affects functionality.  Data will be taken at 1MHz  The electrical system will pass once it is shown to be able to gather data for a whole flight test. Correct voltages will be measured.

41.  Most of the code still needs to be written. We are waiting for all the parts to arrive and then will write the code with American Semiconductor’s help. American Semiconductors has a testing code that will hopefully be modified to complete our necessary actions.

43. Previous Risk Factors  Risk 1: SH enclosure breaks  Risk 2: G-switch fails to start data collection  Risk 3:Malfunction of electrical board.  1: The SH enclosure will be double layered and extensively tested.  2: Will just have to be accepted.  3: The board will be tested to be in perfect working order multiple times prior to launch. Consequence Risk 1Risk 2 Risk 3 Possibility

44. Risk Factors  Risk 1: Leads on Flex chip fall off.  Risk 2: G-switch fails to start data collection  Risk 3: wires on packaged chip break due to G’s during launch Consequence Risk 2 Risk 1 Risk 3 Possibility

45. Project Management Plan

46. ItemAmount Budgeted ($) ½ Can $7000.00 paid by American Semiconductors Superhydrophobic MaterialMade by NNU for less then $50.00 TravelFunded by Idaho Space Grant FacilitiesProvided by NNU Radiation Hardened Chips and other Electronics Provided by American Semiconductors Electronics hardware$200 by NNU

47.  With the “donut” being manufactured the main focus will be on the electrical system. We have established weekly meetings with American Semiconductors to stay on schedule.  Questions?