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The issue: A non-standard thin window design  No closed form expression for maximum stress vs. volume pressure  FEA (finite element analysis): geometry.

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Presentation on theme: "The issue: A non-standard thin window design  No closed form expression for maximum stress vs. volume pressure  FEA (finite element analysis): geometry."— Presentation transcript:

1 The issue: A non-standard thin window design  No closed form expression for maximum stress vs. volume pressure  FEA (finite element analysis): geometry stress material strain volume pressure displacement LH2 Window tests } Procedure  Precision measurement of window  FEA predictions (non-elastic)  Performance measurement Strain gages Photogrammetry

2 Modified Torispherical integrated window and flange design (tapered detail at right). Machine parameters shown. Precision measurement of window and flange with CMM at FNAL Industrial Center. Absorber Window Design R rr  Minimize window thickness

3 Results so far  2 rupture tests (130 and 330 micron windows, 15 cm radius)  Preliminary agreement of strain and displacement measurement with elastic region FEA predictions  Systematic errors resolved  Establishing Photogrammetry as a measure of strain  2 nd rupture test confirmed FEA prediction  Manifold complete, clear windows made for flow test Progress The remaining program:  4 more rupture tests (on 330 micron windows)  2 additional windows for absorber  Cryo pressure test of windows/absorber  Safety valve test  Flow test  Decision on intelligent absorber instrumentation

4 Absorber:  6 windows manufactured 6 weeks  Rupture tests complete9 weeks  New FEA calculations4 weeks  Flow test complete6 weeks  Safety valve test complete9 weeks  Instrumentation feedthroughs worked out 11 weeks  Vacuum Enclosure for absorber11 weeks  Safety review13 weeks Timelines The LINAC test area:  “Phase I” civil engineering  Refrigeration system installed  Cryo plumbing and LH2 controls installed  Evacuation chamber built  Instrumentation:  strain: bolometry, laser, photogrammetry  Luminosity: bolometry, silicon  RF radiation: ?


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