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P09321 Updates. T EST M ATERIALS O RDERED Sheet metal FPGA ROM Chips SOIC to DIP Adapter.

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Presentation on theme: "P09321 Updates. T EST M ATERIALS O RDERED Sheet metal FPGA ROM Chips SOIC to DIP Adapter."— Presentation transcript:

1 P09321 Updates

2 T EST M ATERIALS O RDERED Sheet metal FPGA ROM Chips SOIC to DIP Adapter

3 S ENSORS W E ’ RE LOOKING AT OPB700: Reflective Object Sensor OPB100: Emitter & Sensor GP2D120: Op to electric Device

4 P ARTIALLY E XPLODED VIEW

5 C OLLAPSED C ROSS S ECTION

6 H OUSING S HEET M ETAL L AYOUT

7 A SSEMBLY ORDER Main housing Inner mounting rails for PCB Install PCB and nitinol latch assembly Mount Top Mount Empty return door Mount Extension/ Ramp Mount legs

8 I SSUES Ramp / Extension clearance Outside leg hinges 180 max Empty return lock Empty return clearance Mounting location for sensors Mounting locations for ball & spring latches Edge deflection on 3’ drop

9 M ECHANICAL BOM Sheet Aluminum – 6061 Alloy, 3/32” thick, 6.8 sq. ft Hinge – 45in Pop Rivets - 1/8” dia Pins/clips – (x2) Machine Screws- (x8) Retroreflective Tape Spring Hinge Lock/key Assembly Circuit Board Material- 7.75”x11” (x2) Nitinol Latch Assy- (x33) Ball/spring latch- (x3) Rubber bushings- (x4)

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