Presentation on theme: "Professor Sung-Yeul Park"— Presentation transcript:
1 Professor Sung-Yeul Park Battery Energy Storage with an Inverter that Mimics Synchronous GeneratorsTeam 1508 MembersNerian KullaSabahudin LalicDavid HooperFaculty AdvisorProfessor Sung-Yeul ParkTo: ECE/CSE FacultyECE 4901Design Review11/11/2014
2 Outline Background Information Project Goals Key Specifications Design DC/DC DesignDC/AC DesignFinal Integrated DesignBudgetTime line
3 Background Information IFEC, which stands for International Future Energy Challenge, is an international student competition for innovation, conservation, and effective use of Electrical Energy.The main objective of this project is to:develop a grid-connected energy storage system with an inverter that can mimic the functions of synchronous generators.able to autonomously deliver the right amount of real power and reactive power according to the grid frequency and voltage orto regulate the frequency and voltage via changing the real power and reactive power delivered.
4 Design a Battery that will supply Power to a vehicle, as well as a Power Grid. Battery capability:Bi-directional current flow(Grid to Battery or Battery to Grid)Potentially fulfill the energy storage needs of the electricgrid supplying ancillary servicesreactive power compensationvoltage regulationand peak shaving
5 Project GoalsRealize power conversion between the battery and the gird/load with high efficiencyAchieve seamless transfer between grid-connected and stand-alone modesReduce manufacturing costHave the basic functions of charging,discharging and protection for the batteryMeet the desired power quality to the grid/loadImprove power density
7 Design Requirements/Challenges: Needs to be bidirectional It requires to Buck and Boost the voltageConvert voltage from DC to ACConvert voltage from AC to DCBe within the budgetBe energy-efficientMeet the specifications
8 Topology DC-DC Converter Bidirectional Buck & Boost converters Buck converter required to lower voltage from 350V DC to 48V DCBoost converter required to increase the voltage from 48V DC to 350V DCUses a LC filter to conduct buck and boost conversion and regulate voltage/current ripple
9 Topology AC-DC Rectifier Rectifier Bridge Convert AC-to-DC needed to charge batteryInput 230V AC and outputs 325V DCUses diodes to rectify current from AC to DCUses Inductor to filter current rippleA DC link Capacitor filter voltage ripple
10 DC-AC Inverter/AC-DC Rectifier TopologyDC-AC Inverter/AC-DC RectifierInverter BridgeConvert DC-to-ACUses four Power MOSFET switchesPWM to control the MOSFETLC filter for a clean B2G AC waveform
11 Topology Power Schematic Bidirectional Boost Converter (Battery to Grid )&Buck Converter(Grid to Battery)AC-to-DC (Grid to Battery)&DC-to-AC (Battery to Grid)DC Link
13 DevicesSwitchesActive switches are used to invert DC to AC and convert DC to DC for buck and boost mode using PWM- Devices considered were the MOSFET, IGBT and GaN
14 Devices Switches The device of choice is the Power MOSFET High switching frequency ( >200kHZ)Reduces the size of the passive elements i.e. Inductors, CapacitorsLow switching power lossLow conduction resistanceLow cost
15 Devices Sensors Current Sensors Voltage Sensors Measure the input current and output currentNeeded for the control stageVoltage SensorsMeasure the AC Grid voltage, DC Link voltage and Battery voltage.Needed to for feedback for the control stage
16 PCB BoardUsing Altium Designer software, we plan on designing our PCB board using the Top and Bottom layer for the components, as well as a mid-layers for common connections, reduce noise levels, and for High Current usage. (Power, Ground, etc.)When building a PCB board, there are different things to consider for the most efficient, safest and reliable Power usage.
17 Placing ComponentsWe give careful thought when placing components in order to minimize trace lengths.We place Parts next to each other that connect to each other, which will make laying out traces less difficult and more neat.Arrange components in a specific orientation (up and down, left and right) for easier Pin connections.
18 Using complete planes for Power, Ground, etc. Copper pours on signal layers are common in PCB’s:Can be a hatched ground pour an analog designSolid Power supply pour for carrying heavy currentsSolid ground pour for EMC shielding
19 Track DesignDetermine standard track width ( avoid shorts occurring, number of tracks used in an area)Consider track size for lines carrying currentDetermine pad shapes and sizesThermal IssuesWith higher processing speeds and higher component densities, in addition working with high voltages and currents, thermal issues should be taken into considerationIt is important to allow sufficient space for cooling around hot components.It is also a good idea to leave extra space around components that dissipate larger amounts of heat.
20 Timeline Completed: Proposal submission System Simulations Circuit Schematic/DesignFuture Goals:PCB LayoutQualification ReportPerformance Test
21 Timeline Completed: Proposal submission System Simulations Circuit Schematic/DesignFuture Goals:PCB LayoutQualification ReportPerformance Test