1. J-STD-001F & IPC-A-610F Impacts of a New Revision
Frank Honyotski, Master IPC Trainer (MIT)
STI Electronics, Inc.

2. Agenda
J-STD-001F
What’s New
Additions
IPC-A-610F
Training

3. A New Revision of J-STD-001
What’s New?
Format
Removed Space Shuttle symbol
Layout
Some requirements relocated for readability
Revised Requirements
Where data supported a change
New Requirements
To support industry advance

4. J-STD-001 Terms & Definitions FOD
1.8.3 FOD (Foreign Object Debris)
A generic term for a substance, debris, particulate matter or article alien to the assembly or system.

5. J-STD-001 Requirements Flowdown
When an assembly, e.g., daughterboard, is procured, that assembly should meet the requirements of this standard. The connections from the procured assembly to the manufactured assembly shall [D1D2D3] meet the requirements of this standard.
If the assembly is manufactured by the same manufacturer, the solder requirements are as stated in the contract for the entire assembly.
The design and workmanship of COTS items should be evaluated and modified as required to ensure the end-item meets contract performance requirements.
Modifications shall [D1D2D3] meet the applicable requirements of this standard.

6. Table 3-1 Maximum Limits of Solder Bath Contaminant
The balance of an SAC305 lead-free bath shall [N1D2D3] be the items listed in Table 3-1.
Use of other lead-free solder alloy contamination limits shall [N1D2D3] be on agreement between Manufacturer and User.

7. 3.8.1 Component and Seal Damage
Loss of silver-palladium metallization shall [D1D2D3]:
Not expose ceramic on the terminal end face.
Be no greater than 25% of width or thickness on any termination side (not the end face).
Be no more than 50% on top of a 5 or 3 sided termination component.

8. 4.5.1 Gold Removal
Except as noted above, gold shall [N1PD2D3] be removed:
a. From at least 95% of the surfaces to be soldered of the through-hole component leads with >2.54 μm [100 μin] gold thickness and all through-hole leads that will be hand soldered regardless of gold thickness.
b. From 95% of all surfaces to be soldered of surface mount components regardless of gold thickness.
c. From the surfaces to be soldered of solder terminals plated with >2.54 μm [100 μin] of gold thickness and from all solder cup terminals, regardless of gold thickness.

9. Solder Connection Anomalies
Table 4-1 added to include solder anomalies not just defects.
Table 4-1 Solder Anomalies
Criteria
Class 1
Class 2
Class 3
Fractured solder
Defect
Disturbed solder
Incomplete reflow of solder paste
Cold or rosin solder
Evidence of dewetting that causes the solder connection to not meet the solder fillet requirements
Solder has not wetted to the land or termination where solder is required
Solder that violates minimum electrical clearance
Solder that contacts the component body (except as noted in other clauses)
Does not comply with wetting criteria of 4.18
Solder bridging except when path is present by design
Blowholes and pinholes providing the solder connection meets all other requirements
Acceptable
Process Indicator
Solder that obscures the stress relief bend of through-hole components, Note 1
Note 1: Solder in the bend radius is not cause for rejection provided the lead is properly formed and the topside bend radius is discernible.

10. Jumper Wires
5.6 Jumper Wires Jumper wires shall [N1D2D3] be permitted only by drawing(s)/engineering documentation or other contractual action. When the criteria for jumper wires is not specified by engineering documentation, the requirements of through shall [N1D2D3] apply. See IPC-7711/7721 and IPC-A-610 for additional information.
Jumper wire information now matches 610.

11. Through-Hole Mounting and Terminations
Table 6-2 Components with spacers added to through-hole.
Table 6-2 Components with Spacers
Criteria
Class 1
Class 2
Class 3
Supported holes with spacer in full contact with both the board and the component.
Acceptable
Supported holes with spacer touching both the board and the component but not in full contact.
Process Indicator
Supported holes with spacer not touching either the board or the component.
Defect
Un-supported holes with spacer in full contact with both the board and the component.
Un-supported holes with spacer not in full contact.
Spacer is inverted.
No Requirement

12. Hold Down of Surface Mount Leads/Components
Surface mounted device leads or components shall not [N1N2D3] be pressed down against the PCB land or other mating surface during the soldering operation or during solder solidification.
NOTE: Mechanically constrained devices such as connector securing tabs or holding a part over a pad from the sides during soldering is not the same as pressing the component down to the land.

13. Butt/I Connection-Solder Charged Termination (NEW)
Butt/I Connections – Solder Charged Terminations
These criteria are for components designed with a hole or holes in the lead, a bump on the bottom to assure a good (G) fillet thickness across most of the bottom, and an attached solder slug to control the amount of solder. Connections formed to solder-charged leads positioned perpendicular to a circuit land in a butt/I configuration shall [D1D2D3] meet the dimensional and solder fillet requirements of Table 7-11; see Figure 7-11.

14. Butt/I Connection-Solder Charged Termination (NEW)
Feature
Dim.
Class 1
Class 2
Class 3
Maximum Lead Side Overhang A
Not permitted
Maximum Lead Toe Overhang B
Minimum End Joint Width C
100% of (W)
Minimum Fillet Height F
Completely wets and fills bottom hole on the termination
Lead Width W
Note 1
Land Width P
Note 1: Unspecified parameter or variable in size as determined by design

15. P-Style Terminations (NEW)
Connections formed to components having the P-Style termination (Figure 7-19) shall [D1D2D3] meet the dimensional and solder fillet requirements of Table This termination style is typically found on edge mounted connectors that will be soldered on both sides of the board.

16. P-Style Terminations (NEW)
Table 7-21 Dimensional Criteria – P-Style Terminations
Feature
Dim.
Class 1
Class 2
Class 3
Maximum Side Overhang A
50% (W)
25% (W)
Not permitted
Maximum Toe Overhang B
Note 1
Minimum End Joint Width C
75% (W)
100% (W)
Minimum Side Joint Length D
150% (W)
Minimum Fillet Height – Heel and Toe F
Note 2
25% (H)
Termination Height H
Note 3
Minimum Side Fillet Height J
Termination Length L
Termination Width W
Note 1: No part of the ‘‘L’’ portion of the termination extends beyond the land
Note 2: Wetting is evident
Note 3: Unspecified parameter or variable in size, determined by design

17. 10 Coating, Encapsulation and Staking(Adhesive)
Entire section reworded and new criteria added.

18. Witness (Torque/ Anti-Tampering) Stripe (NEW)
If torque (witness/anti-tampering) stripe is required, the following criteria shall [N1N2D3] be used:
a. Be continuous between the fastener and the substrate.
b. Be undisturbed.
c. Extend from the top of the fastener onto the adjacent substrate (at minimum).
d. Be aligned with the center line of the fastener.

19. Appendix C (NEW)
J-STD-001 Guidance on Objective Evidence of Material Compatibility
Overview
Most electronics assembly operations are a series of mechanical, thermal, and chemical processes, each having a potentially adverse effect on the long term functionality and reliability of the assembled product.
The average electronic assembly will have been subjected to at least 20 different chemical processes, many employing especially aggressive chemicals.
To accurately determine that mixtures of these various chemicals do not produce adverse effects, the Manufacturer needs to have examined chemical interactions within their chosen material sets. J-STD-001 has always required that “objective evidence” of “chemical compatibility” be on hand for review.
This appendix was generated by a focus group of the J-STD-001 committee to generate guidance on this issue.

20. IPC-A-610F

21. Personnel Proficiency (NEW)
All instructors, operators, and inspection personnel shall be proficient in the tasks to be performed.
Objective evidence of that proficiency shall be maintained and available for review.
Objective evidence should include records of training to the applicable job functions being performed, work experience, testing to the requirements of this standard, and/or results of periodic reviews of proficiency.
Supervised on-the-job training is acceptable until proficiency is demonstrated.

22. Supported Holes- Solder
Added criteria for Class 2 vertical fill for components with 14 or more leads and Less than 14 leads.
Table 7-4 Plated-Through Holes with Component Leads , Minimum Acceptable Solder Conditions1
Criteria
Class 1
Class 2
Class 3 A
Vertical fill of solder for component with less than 14 leads, Notes 2 and 3 (see ).
Not specified
75%
Vertical fill of solder for component with 14 leads or more. Notes 2 and 3 and Figure 6-4
50% or 1.2 mm [0.05 in], whichever is less
Note 1: Wetted solder refers to solder applied by any solder process including intrusive soldering. For intrusive soldering there may not be an external fillet between the lead and the land
Note 2: The 25% unfilled height includes the sum of both source and destination side depressions
Note 3: Less than 100% solder fill may not be acceptable in some applications, e.g., thermal shock, electrical performance

23. Chip Components – Billboarding
Changed the Class 3 Acceptable criteria.
For components size 1206 or smaller:
Component has 3 or more termination faces (metallization).

24. 8.3.5 Flat Gull Wing Leads Maximum Toe Overhang for Class 2,3
Not permitted when (L) is less than 3 (W)

25. Butt/I Connections- Solder Charged Terminations(NEW)
Same as J-STD-001F

26. P-Style Connections (NEW)
Same as J-STD-001F

27. 9.2 Chip Resistor Element Acceptable – Class 1, 2, 3
No damage to the resistive element or glass coating.
No exposure of the resistive element.
Reference to 1206 size component removed.

28. 9.13 Threaded Items and Hardware (NEW)
Defect - Class 1,2,3
Evidence of damage resulting from over-tightening of the threaded item.

29. 10.2.4 Laminate Conditions - Haloing
Criteria separated from edge delamination.
Edge delamination combined with Nicks and crazing.

30. 10.4 Flexible and Rigid-Flex Printed Circuitry
Criteria changed to more closely align with IPC-A600.

31. 10.5.5.2 Marking – Labels – Readability
Removed the laser and wand type scanner and replaced with code can be read with 3 or fewer attempts.

32. 10.8.4 Electrical Insulation Coating (NEW)
This material is used to provide insulation to an exposed conductor when conformal coating is insufficient to provide enough protection and encapsulation is too much.
All of the considerations used for conformal coating are applicable for insulation coating, except the surface where insulation coating is applied is generally not smooth enough for a uniform coating surface.
Thin coating is not a target attribute. See

33. 10.8.4 Electrical Insulation Coating (NEW)
The material used is frequently a conformal coat like material with a thickener added.
Example:
Bolted solder lugs where the edge surface is not fully protected by conformal coating
Component cases that are electively active
Wire termination, particularly moveable wires

34. Training

35. J-STD-001F Certification Course IPC-A-610F Certification Course
J-STD-001 Certified IPC Trainer (CIT) and Certified IPC Application Specialist (CIS) Training Courses
Currently under development
CIT Beta class to be held December 8-12, 2014
IPC-A-610 CIT and CIS Training Courses
CIT Beta class to be held February 2-6, 2015

36. Questions?