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Global Expert Technologies. Contents Company Overview Commitments to Quality Manufacturing Facility Technical Capabilities.

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Presentation on theme: "Global Expert Technologies. Contents Company Overview Commitments to Quality Manufacturing Facility Technical Capabilities."— Presentation transcript:

1 Global Expert Technologies

2 Contents Company Overview Commitments to Quality Manufacturing Facility Technical Capabilities

3 Contents Company Overview Commitments to Quality Manufacturing Facility Technical Capabilities

4 Global Expert Technologies  HK-based company with PCB manufacturing in Huizhou  Low to Medium volume production  Specialised on Technically-challenging Products  Diversified Customer base and Business segments  Stringent management in Quality and Environmental control

5 Company Milestone 2002 Trading Drilling & Film Plotting Obtained UL 2012 Phase 4 Expansion (Inner Layer) Completed 2007 Phase 2 Expansion Completed 2003 Huizhou Plant Phase 1 Completed 2004 Accredited ISO9001 and TL9000 Obtained ISO Certified to ISO/TS Phase 3 Expansion Completed Set up Mass Lamination 2013 Got the UL Canada certification

6 Corporate Culture Our Philosophy Having Quality People and Providing Quality Products Our Mission To satisfy our customer’s needs, provide highly professional service and deliver product excellence Our Environmental Commitments To produce environmental friendly products and apply comprehensive environmental protection strategies throughout the manufacturing process

7 Account Management – One-Stop Solution Order Placement Technical communication Contract Review Enquiry/Quotation Quality Improvement Follow-up Services Delivery Production Customer Account Manager

8 Sales Revenue Growth CAGR=15% USD ‘000 $26,868 $20,000 $20, f $16, $21, $18, $19, $23,364

9 Global Business ….. Customers from more than 50 countries West Europe China East Europe Asia America South Africa Argentina Turkey Ukraine IRAN Malaysia

10 Product Breakdown Data : End 2013 Layer Count Product Segment

11 Contents Company Overview Commitments to Quality Manufacturing Facility Technical Capabilities

12 Quality Certificates Accredited

13 Environmental Protection Set up Biochemical Waste Water Treatment plant in 2013 GET is a Green PCB Enterprise Awarded “Exemplary Enterprise in Huizhou” in 2008

14 Contents Company Overview Commitments to Quality Manufacturing Facility Technical Capabilities

15 Huizhou – A Green City with Rich History Huizhou lies strategically next to Guangzhou, Dongguan, Shenzhen and Hong Kong, with easy access to major air and sea ports in the fastest-growing region in the world. Huizhou’s two state-level development zones, Daya Bay Economic Development Zone and Zhongkai Hi-tech Industrial Park, Huizhou are home to manufacturing base of many MNCs like LG, Samsung, Lenovo, TCL/Thomson and etc. Huizhou was founded in 214 BC after Qin unified China and Emperor Qinshihuang set up the Boluo County. With permanent residents at 3.77 million. Huizhou has won numerous awards in China as a city, including China Top Tourism City, China Clean City, China Forestation City, Example City in Environment Protection, China Top 10 Gardening City, Best Residence Award, and China Leading City in Civilization etc. Hong Kong Macau

16 Huizhou Manufacturing Facility Total Floor Area : Total Floor Area : 16,600 m 2 Work Force: Work Force:350 Annual Capacity: Annual Capacity: 500,000 m 2

17 New Facilities in 2013 New Mass Lamination Machine New Routing MachineNew Fly Probe Testing Machine To ensure On Time Delivery To satisfy Special Requirements To enhance Production Capacity

18 1. Engineering (CAD/CAM) 4. CNC Drilling 5. Automatic Panel Plating Line 7. Automatic ENIG Plating Line 6. Stripping, Etching and Tin Stripping 8. Dry Film Imaging 10. Flying-probe Test 9. Dry Film Development 11. E-Test 12. Final QC 2. Mass Lamination 3. Automatic Optical Inspection

19 Contents Company Overview Commitments to Quality Manufacturing Facility Technical Capabilities

20 Process and Product Capabilities PRODUCTFINISHINGLAMINATESBOARD THICKNESS Rigid PCB Multi-layer ≤26 layers Double Sided Heavy Copper PCB (6oz finished) Hot Air Leveling /HASL (lead free) Immersion Gold,Immersion Silver Gold Fingers Carbon Ink, OSP FR-4, Roger, High TG FR-4, Halogen Free FR-4, 0.2~5.0mm (8 – 200 mil) MIN FINISHED HOLE SIZE SOLDER MASK INKOUTLINE PROFILE MAX. PANEL SIZE Laser Drill:0.10mm(4mil) Tolerance:0.01mm Mechanical Drilling: MIN:0.15mm Tolerance: ± 0.05mm (PTH) ±0.03mm (NPTH) Aspect rate: 1:8 LPI Soldermask Peelable Soldermask Punching, Routing, Punch And Push Back 476mm X 620mm (18.7”X24”)


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