Presentation on theme: "Network Engineering Taster Day Mark Clements. 30 March 2012Engineering Taster Day 2 Welcome to Engineering Taster Day: Morning Session Ambassadors Fire."— Presentation transcript:
Network Engineering Taster Day Mark Clements
30 March 2012Engineering Taster Day 2 Welcome to Engineering Taster Day: Morning Session Ambassadors Fire alarms Emergency exits Gathering points Toilets Breaks
30 March 2012Engineering Taster Day 3 Today : Network Design Methodology. Preliminary processes. Modular Design. Modular options. Wiring Closet choices. Vertical Cabling issues. When to use fibre optic cabling. Power problems & solutions.
30 March 2012Engineering Taster Day 4 Network Design Methodology 1. Gather network requirements 2. Document the logical and physical network implementation. 3. Design layer 1, 2 and 3 structures. 4. Carry out analysis of user requirements. 5. Gather users’ requirements and expectations. – Users, skills, attitudes towards IT. – Mission-critical data & operations. – Protocols allowed on network. We shall concentrate on the first FOUR parts of this methodology.
30 March 2012Engineering Taster Day 5 Design process includes Designer - person doing the design. Client - person paying for the design. User(s) - person(s) who will be using the product. Brainstorming – the generation of ideas Specifications development - to meet client objectives and satisfy certain standards. Building and testing – measuring performance to gauge how well the design works.
30 March 2012Engineering Taster Day 6 Required Documentation Engineering journal. Logical topology. Physical topology. Labelled outlets. Labelled cable runs. Summary of outlets and cable runs. Cut sheets.
30 March 2012Engineering Taster Day 7 The Network Choice The de facto current network implementation of choice will be Ethernet. 100BASE-TX available – 100Mbps. Always use at least 100BASE-TX or FX for vertical cabling. Begin with physical layer design. – Layer 2 & 3 design comes later.
30 March 2012Engineering Taster Day 8
30 March 2012Engineering Taster Day 9 Modular Design This approach divides a system into small modules (parts). Each module can be designed separately. Makes design and testing easier. Good for replicated items e.g., the network on several floors of a building.
30 March 2012Engineering Taster Day 10 Network Layers Layer 1 is the cables (or wireless links). Layer 2 is responsible for the transfer of data between adjacent network nodes (e.g., PC to switch). Layer 3 is responsible for data transfer between a source host on one network to a destination host on a different network.
30 March 2012Engineering Taster Day 11 Design Groups At this point, you should begin thinking about splitting into smaller groups to carry out your design. – Cabling of individual floors of buildings. – Cabling between floors of buildings. – Cabling between buildings. – Costing and time estimation. You need to do this before the afternoon sessions 3
30 March 2012Engineering Taster Day 12 Cabling a floor of a building (logical design) 1
30 March 2012Engineering Taster Day 13 Cabling a floor of a building (physical design) Horizontal cabling uses Category 6 cabling (Cat 6). An individual length of copper cable can only run for 100 metres in an Ethernet environment. Good up to 1000 Mbps. See ANSI/TIA/EIA-568-B.2- 10 specifications.
30 March 2012Engineering Taster Day 14 Horizontal Cabling Horizontal Cross Connect (HCC). One floor only. Patch panels. Patch cords (jumpers). Don’t exceed 100m. Use Cat 6 cabling.
30 March 2012Engineering Taster Day 15 Layer 1 alternative - wireless WiFi can be used to provide end users with connectivity. Good for listed buildings. Quick to install. Good for laptops, tablets, smartphones. Can give poor coverage if poorly designed. Electrical interference can limit the data rate. Not used to link buildings or floors together.
30 March 2012Engineering Taster Day 16 Cabling between floors of a building Main Distribution Frame (MDF) on centre floor. Intermediate Distribution Frames (IDFs) on other floors. Point of Presence (POP) connected to MDF. Vertical cabling used here.
30 March 2012Engineering Taster Day 17 Cabling between floors - fibre
30 March 2012Engineering Taster Day 18 Wiring Closets (MDF and IDF) Careful choice required for MDF & IDFs. For today, assume that a closet is available in the centre of each building. Large enough for all equipment. Lighting, power, door size. Horizontal cabling not to exceed 90m. – If it exceeds 90m, install an IDF. Heating/ventilation/air conditioning (HVAC) issues. Floor strength is important.
30 March 2012Engineering Taster Day 19 Wiring Closets 2 At least 2 fire rated plywood covered walls Raised floor desirable or tiled, painted concrete etc – no carpet Near POP – connection to Internet 21° C and 30% – 50% humidity Good lighting & power supply 0.9m door must swing outwards Lock to be outside, but allow anyone inside to get out
30 March 2012Engineering Taster Day 20 Cabling between Buildings - Fibre Optic Solves grounding problems. Avoids lightning problems. High data rate. Expensive!
30 March 2012Engineering Taster Day 21 Extended Star Topology 2
30 March 2012Engineering Taster Day 22 Backbone (Vertical) Cabling Runs Maximum distances for vertical cabling are shown in the table below.
30 March 2012Engineering Taster Day 23 Costings Assume the following prices for network components: PC £500. 24-port switch £400. 2811 router with 4 serial ports £1200. Linksys WRT300N Wireless-N Router £200. Cat 6 cabling per metre £0.20. Cat 6 installation & termination £0.20 per metre. Double the above cabling costs for fibre optic cabling. Cable outlets (2-way) £2.00 2m Ethernet patch/outlet cable £2.00
30 March 2012Engineering Taster Day 24 Conclusion Gather user requirements & analyse Brainstorm ideas & use design process Document all work Follow cabling regulations, no more than 100m for metallic Cat 6 cable Choose wiring closets carefully Use fibre for backbones, vertical cabling and between buildings to avoid power problems
30 March 2012Engineering Taster Day 25 References 1. http://2.bp.blogspot.com/_fYpiec4PxIc/TJrIk3OW37I/AAAAAAAAABI/K0ujZU1QJac/s1600/star.jpg http://2.bp.blogspot.com/_fYpiec4PxIc/TJrIk3OW37I/AAAAAAAAABI/K0ujZU1QJac/s1600/star.jpg 2. http://www.techonlineindia.com/Libraries/tol/Joe3.sflb.ashx http://www.techonlineindia.com/Libraries/tol/Joe3.sflb.ashx 3. http://2.bp.blogspot.com/_8rA8izP54U4/SFadBFotFNI/AAAAAAAAAM0/089fMDFIsFk/s400/alan_sugar _pitcrew_01.jpg http://2.bp.blogspot.com/_8rA8izP54U4/SFadBFotFNI/AAAAAAAAAM0/089fMDFIsFk/s400/alan_sugar _pitcrew_01.jpg