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14-11-2005 TRFA Annual meeting, Florida, USA 1 Novel halogen free epoxy resin for high performance electronic applications P.K.Dubey, Dr. Hitesh Soni*,

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Presentation on theme: "14-11-2005 TRFA Annual meeting, Florida, USA 1 Novel halogen free epoxy resin for high performance electronic applications P.K.Dubey, Dr. Hitesh Soni*,"— Presentation transcript:

1 TRFA Annual meeting, Florida, USA 1 Novel halogen free epoxy resin for high performance electronic applications P.K.Dubey, Dr. Hitesh Soni*, Dr. M.Soni, Ms. Thipa Thai Organics Chemicals Co., Ltd. (Epoxy Division) Map Ta Phut-Rayong (Thailand)

2 TRFA Annual meeting, Florida, USA 2 Introduction: PWB, flip chip encapsulation, surface mounting adhesives, conformal and die coatings are major applications requiring FR epoxy resin Demand of halogen free fire retardant material due to environmental issues Lead free soldering calling for high heat resistance Miniaturization of electronic components requiring high thermal stability

3 TRFA Annual meeting, Florida, USA 3 Conventional FR epoxy resins Bromine containing Standard for many years and have environmental and thermal stability issue Filler containing Capable to achieve V-0 rating Problem of high viscosity, aggregation of filler and micro structural defects in cured resin Red phosphorous Suitable to achieve V-0 rating but have issue of pigmentation & handling Phosphorous additives Effective fire-retardants. Problem of high water affinity, risk of p-o-p or c-o-p bonds under humid condition along with low thermal stability

4 TRFA Annual meeting, Florida, USA 4 Mechanism of various flame retardant action R-H + X R + HX HX + OH H 2 O + X Al(OH) 3 xH 2 0 Al 2 O 3 + H 2 O Px H 3 PO X H 3 PO X + CH 2 –CH 2 – H 3 PO 4 + C - H2O- H2O 1. Halogen based flame retardant 2. Filler based flame retandant 3. Phosphorus based flame retardant

5 TRFA Annual meeting, Florida, USA 5 Present work Reactive phosphorous compound (DOPO) selected for study as fire- retardant Multifunctional EOCN and EBPN resins synthesized and suitably reacted with DOPO Phenolic compounds based on phenol Novolac, bis-phenol Novolac, O- cresol Novolac, and tris-phenols are selected as hardener. 2MI and TPP are used as catalyst All sets of combinations studied for thermal, mechanical, and electrical properties.

6 TRFA Annual meeting, Florida, USA 6 Epoxy Resin: YDBN 602 and YDBN 602P

7 TRFA Annual meeting, Florida, USA 7 Epoxy resin TOCN 4030 and TOCN 4030P

8 TRFA Annual meeting, Florida, USA 8 Phenolic Hardeners: Phenol Novolac-PNO-Cresol Novolac- OCN BPA Novolac- BPN Tris- Phenol- TP

9 TRFA Annual meeting, Florida, USA 9 Catalyst 2- Methyl Imidazole- 2MI Triphenyl Phosphine- TPP

10 TRFA Annual meeting, Florida, USA 10 Reaction Mechanism of 2-MI with epoxy group Source: Farkas, A., Strohem, P.F., J.Appl. Polym. Sci., 1968, 12, p159

11 TRFA Annual meeting, Florida, USA 11 mechanism of reaction between epoxy and phenol using TPP as catalyst Romanchick, W.A., Sohn, J.E., and Geibel, J.F., ACS Symposium Series 221-Epoxy Resin Chemistry II ( Ed: R.S.Bauer) American Chemical Society, Washington, D.C. 1982, p-85

12 TRFA Annual meeting, Florida, USA 12 Basic Properties of Epoxy resins

13 TRFA Annual meeting, Florida, USA 13 Typical properties Epoxy resins PropertyTOCN 4030 YDBN 602 TOCN 4030P YDBN 602P Coloryellow EEW HyCl, ppm< 50 Ionic chlorine, ppm< 2 Total Chlorine, ppm Residual ECH content, ppm < 5 Physical properties are comparable

14 TRFA Annual meeting, Florida, USA 14 PropertyTOCN 4030 YDBN 602 TOCN 4030P YDBN 602P 125oC Softening point Glass transition temperature Phosphorus content002.1 Mn Mw/Mn Melt viscosity is low in case of YDBN resins in-spite of high Mw/Mn ratio. YDBN resins has lower softening point Typical properties Epoxy resins

15 TRFA Annual meeting, Florida, USA 15

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17 TRFA Annual meeting, Florida, USA 17 Curing Behavior of Epoxy resins with Phenolic hardeners

18 TRFA Annual meeting, Florida, USA 18 OCN is fastest reactive phenolic hardener

19 TRFA Annual meeting, Florida, USA 19 YDBN 602 is more reactive because of better structural symmetry and low melt viscosity

20 TRFA Annual meeting, Florida, USA 20 2MI is more reactive compared to TPP because of alkoxide ion formation and more basicity of the 2MI catalyst

21 TRFA Annual meeting, Florida, USA 21 Modified resins are lower in reactivity due to the presence of acidic Phosphorus compounds.

22 TRFA Annual meeting, Florida, USA 22 Possible reaction of Phosphorus Resin with Catalyst Ring cleavagepolymerization

23 TRFA Annual meeting, Florida, USA 23 Phenolic reactivity trend- OCN>PN>TP>BPN

24 TRFA Annual meeting, Florida, USA 24 Thermal Property

25 TRFA Annual meeting, Florida, USA 25 Sample cured 175oC/6hrs Concentration of catalyst effect reactivity not the final crosslink structure 2-MI system gives higher Tg than TPP system

26 TRFA Annual meeting, Florida, USA 26 6 hrs at 175oC is adequate curing schedule for full crosslinking YDBN system shows higher Tg compared to TOCN system

27 TRFA Annual meeting, Florida, USA 27 TP shows highest Tg( oC) YDBN systems shows better Tg compared to TOCN system in all cases. Modified resins shows lower Tg-due to high EEW and polarity. Modified resins with 2MI catalyst shows Tg in range of oC depending on curing agent Sample cured 175oC/6hrs

28 TRFA Annual meeting, Florida, USA 28 Flammability And Thermal Degradation

29 TRFA Annual meeting, Florida, USA 29 Effect of Phosphorus content on flammability Phosphorus content YDBN 602-2MITOCN 4030 –2MIYDBN 602-TPPTOCN 4030-TPP 0V-2BurnV-2Burn 0.8V-2 with low burning time V-2V-2 with low burning time V-2 1.2V-1V-1 with drippingV-1V-1 with dripping 1.5V-0 with low average burning time. V-0 with high average burning time V-0 with low average burning time V-0 with high average burning time 2.0V-0V-OV-0 1.5% Phosphorus is adequate to get flammability rating V-O YDBN resins shows better flammability rating compared to TOCN TPP catalyst shows better flammability rating than 2MI

30 TRFA Annual meeting, Florida, USA 30 YDBN resins shows better thermal degradation stability P- resins shows initial loss at low temperature but Tmax is higher than unmodified resins TPP cured system shows better overall degradation stability

31 TRFA Annual meeting, Florida, USA 31 YDBN 602 char yield is higher than TOCN better flammability. Incorporation of phosphorus increases char yield dramatically. TPP cured system shows better char yield than 2MI

32 TRFA Annual meeting, Florida, USA 32 Mechanical Property PropertyYDBN 602/PN/2MI TOCN 4030/PN/2MI YDBN 602P/PN/2MI TOCN 4030P/PN/2MI Ratio100/50/1100/52/1100/35/1100/37/1 Curing Schedule120oC/15 min, 175oC/6 hrs 140oC/15 min, 175oC/6 hrs Glass fiber content, % Tensile strength, Mpa Tensile strain, % Tensile modulus, Gpa Flexural strength, Mpa Flexural strain, % Flexural modulus, Gpa Water absorption after 8 hrs at 80oC, %

33 TRFA Annual meeting, Florida, USA 33 Electrical property PropertyYDBN 602TOCN 4030YDBN 602PTOCN 4030P Dielectric Constant at 1 MHz Dielectric Strength(t-2mm), KV/mm Volume resistivity ( 500V), ohm- cm 2.275x (10e-15)1.957x(10e-15)4.346x (10e-15)4.60x (10e-15)

34 TRFA Annual meeting, Florida, USA 34 Conclusion: 1.Halogen free YDBN-P and TOCN-P resins could be material of choice where high glass transition temperature ( oC) or flammability is desired for electrical and electronics applications. 2.YDBN series of resins were found comparable to TOCN resins in terms of mechanical, electrical and thermal properties with distinct advantage of lower melt viscosity which could be advantageous for better wetting or lower coating thickness requirements. 3.Curing agents could be selected depending on process/ performance requirements. TP has exhibited higher Tg with low melt viscosity where as low functionality PN could be used for moderate Tg requirement. 4.2MI as catalyst lead to higher Tg of cured matrix compared to TPP.

35 TRFA Annual meeting, Florida, USA 35 Acknowledgement: Sincerely thanks -Management of TOCC -All Colleagues Somsak, Satid, Thithikan and Thaniya -Mr. Wutti of Mettler Toledo, Thailand

36 TRFA Annual meeting, Florida, USA 36 Thank you

37 TRFA Annual meeting, Florida, USA 37 Any Question?


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