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MCP Electrodes and End Spoiling Jeffrey Elam, Qing Peng, Anil Mane, Thomas Prolier, Joe Libera Argonne National Laboratory Large Area Photodetector Collaboration.

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Presentation on theme: "MCP Electrodes and End Spoiling Jeffrey Elam, Qing Peng, Anil Mane, Thomas Prolier, Joe Libera Argonne National Laboratory Large Area Photodetector Collaboration."— Presentation transcript:

1 MCP Electrodes and End Spoiling Jeffrey Elam, Qing Peng, Anil Mane, Thomas Prolier, Joe Libera Argonne National Laboratory Large Area Photodetector Collaboration Meeting October 15, 2009

2 MCP Structure 2 1)resistive coating (ALD) 2)emissive coating (ALD) 3)conductive coating (thermal evaporation or sputtering) pore

3 Sputtering system Deposition chamber Load lockSample transfer Arm Sample rotation RF Magnetron Sputtering System, AJA International ATC 2400 John Pearson, MSD

4 Uncoated MCP MCP 100nm AZO MCP+100nm AZO+Cr 5nm+Au 50nm RF Magnetron Sputtering on Au/Cr Electrodes We’re done, right? No.

5 Electrodes and End-Spoiling in MCPs b Endspoiling: h=b/d

6 IEEE Trans Nucl. Sci. 19 (3) End spoiling output side: increases spatial resolution decreases gain trade-off: h~1-2 Input side: h~ Importance of End Spoiling

7 A A B B (end spoiling) N(E) becomes more narrow as end spoiling increases Effect of End Spoiling on Electron Energy Distribution

8 N(E) narrows as end spoiling increases Simulations: h=0 h=0.5 h=1 h=3

9 small increase in spatial resolution (10%) with 1.5 end-spoiling Effect of End Spoiling on MCP Spatial Resolution

10 No systematic change in angle distribution with end-spoiling Simulations: h=0 h=0.5 h=1 h=3

11 Effect of End-Spoiling on MCP Gain Gain ~ (SEC) (L/z) SEC=secondary electron coefficient L=pore length z=distance between collisions Since E field gradient=0 in electrode length h, no gain there Gain ~ (SEC) (L/z) exp(-0.65h) Gain decreases with end-spoiling

12 IEEE Trans Nucl. Sci. 19 (3) Effect of End-Spoiling on MCP Gain h=1.2 h=2.2 h=3 h=4 Gain decreases with end-spoiling Gain Voltage

13 13 Controlling End-Spoiling RF-magnetron sputtered Ti and Cu in high aspect ratio trench Sputtering is not “line-of-site” Need to use evaporation

14 Controlling End-Spoiling h=atan(θ)

15 Electrode Materials Ni 72% Cr ~17% Fe ~10% Mn ~1% Inconel 600: Trademark of Special Metals Corporation metalmelting Point °C Resistivity µΩ cm thermal conductivity W/mK Vickers Hardness MPa AdhesionOxidation Resistance Price to coat 8” square ($) Inconel GreatOK$0.3 Gold TerribleBest$6 Copper Poor $0.06 Ossy suggests: 200 nm Inconel 600, h=1-2. Ni ~80% Cr ~20% Nichrome: Brand name, range of compositions

16 Thermal Evaporation System, BOC Edwards AUTO 306 Hau Wang, MSD

17 Thermal Evaporation System, BOC Edwards AUTO 306 Hau Wang, MSD ~200nm thermal evaporated NiCr on 33 mm ALD MCP (end-spoiling not controlled) sample rotation motor


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