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Designing Great 2 in 1 Devices Wang Kai P, Intel Wang Kai K, Intel.

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Presentation on theme: "Designing Great 2 in 1 Devices Wang Kai P, Intel Wang Kai K, Intel."— Presentation transcript:

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2 Designing Great 2 in 1 Devices Wang Kai P, Intel Wang Kai K, Intel

3 2 Legal Disclaimer Information in this document is provided in connection with intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in intel's terms and conditions of sale for such products, intel assumes no liability whatsoever, and intel disclaims any express or implied warranty relating to sale and/or use of intel products, including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. A "mission critical application" is any application in which failure of the Intel product could result, directly or indirectly, in personal injury or death. Should you purchase or use Intel's products for any such mission critical application, you shall indemnify and hold Intel and its subsidiaries, subcontractors and affiliates, and the directors, officers, and employees of each, harmless against all claims costs, damages, and expenses and reasonable attorneys' fees arising out of, directly or indirectly, any claim of product liability, personal injury, or death arising in any way out of such mission critical application, whether or not Intel or its subcontractor was negligent in the design, manufacture, or warning of the Intel product or any of its parts. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined". Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information. The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling , or go to: All information provided related to future Intel products and plans is preliminary and subject to change at any time, without notice. Intel and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. * Other names and brands may be claimed as the property of others. All materials in, and discussions of, this presentation are classified as Intel confidential and are subject to the non-disclosure agreement between Microsoft Corporation and Intel Corporation dated October 24, Copyright © 2014, Intel Corporation. All rights reserved. 3

4 Agenda Review of Hardware Recommendation for Microsoft’s Continuum Support Introduction on Dynamic Platform Thermal Framework Key strategies to reduce system thickness on your fanless designs and tradeoffs on system design to go thin Focus on Intel® Core™ M Processor

5 Phone/ Tablet <7” Phone & > 7” Tablet Thinnest, Lightest, Longest Battery Life Small Screen 2 in 1 Fanless Detachable 10.1” – 12.5” 2 in 1 in Ultra-Thin Detachable Fanless Designs Small Screen 2 in 1 Convertible 11.6” – 12.5” 2 in 1 in Ultra-Portable Convertible form factor Large Screen 2 in ” – 15.6” 2 in 1: Full PC performance and Tablet convenience in one versatile device Ultra-Thin Notebook ” – 14” A Lightweight Notebook with compelling Performance & Great Battery Life Mainstream Notebook 11.6” – 17.3” A classic Productivity Notebook with balance of Great Performance and Portability High Performance Notebook 14”-18.4” Feature Rich & Highest Performance Notebook Tablet Experience PC Experience Device Landscape – Focus on Intel® Core ™ M today Intel® Atom™ Processor (Baytrail-T) Intel® Core™ Processor (Broadwell-U) 1 Ultrabook offered for corporate notebooks SOFIA Family 2 in 1 Experience Intel® Pentium™ Processor (Baytrail-M) Intel® Core™ M Processor (For Fanless Designs) Broadwell H Intel® Core™ M Processor (For Fanless Designs) BYT-M Intel Confidential *Other names and brands may be claimed as the property of others 24 Focus on Intel® Core™ M Processor

6 Agenda Review of Hardware Recommendation for Microsoft’s Continuum Support Introduction on Dynamic Platform Thermal Framework Key strategies to reduce system thickness on your fanless designs and tradeoffs on system design to go thin

7 7 Windows* 10 “Continuum” improves UX for 2 in 1s  Microsoft started to support “2 in 1 mode aware” from Windows 8.0 OS, and Intel began platform enabling on this feature from Haswell platform generation too.  Windows* 10 “Continuum” offers a new, adaptive, user experience through optimizing the look and behavior of apps and the Windows.  OEMs/ODMs can report hardware transition to enable more automatics and contextual entry into and exit from "tablet mode". Intel is heavily promoting and enabling this platform capability to all OEM/ODM partners. Do you want to enter Tablet mode? Note: the above screen shot was captured on Windows* 10 Technical Preview 9926 release. The prompt message of “Continuum” feature might change in the future Windows* 10 release.

8 Intel’s solution to deliver mode change to the OS When user changes the mode from clamshell to tablet and vice versa, Sensor hub FW/EC/BIOS should notify appropriate indicator “Clamshell/Slate mode PNP0C60”. To implement this feature, OEMs/ODMs need to have: Sensor FW & EC support – Have key logic designed to determine and notify right device mode to BIOS. BIOS support - BIOS uses ACPI control method to send notifications to Intel’s Virtual Buttons Driver. Please refer to details from “Virtual Buttons and Indicators BIOS Requirements” chapter of Intel’s “BIOS Enabling Guide for Windows* 10” doc (IBP# ). Intel Virtual Buttons Driver installed - Kit#: Intel(R) Virtual Buttons driver – HF MSFT Intel OEM/ODM SBIOS Intel Virtual Buttons Driver Inbox GPIO Button Driver OS + The kit may be changed to incorporate Windows* 10 support in the future Sensor hub FW & EC

9 Intel’s tool to test 2 in 1 mode change feature Intel has designed a simple tool “2in1 Mode Detection Test Tool version ” (Kit#: , under “test tool” category) to test the implementation of 2 in 1 mode change. OEM/ODM partners are encouraged to run this test once you have full chassis system and sensor/EC/BIOS implementation in place. The tool quick start guide is included in the kit, and please read it before conducting your testing. The tools snapshots below: + The kit may be changed to incorporate Windows* 10 support in the future The first step: choose device form factor The last step: you can go through Result column (yellow box) to get the results, and also save the results (red oval) and send it to Intel’s support team in case of any failure.

10 Agenda Review of Hardware Recommendation for Microsoft’s Continuum Support Introduction on Dynamic Platform Thermal Framework Key strategies to reduce system thickness on your fanless designs and tradeoffs on system design to go thin

11 11 Intel DPTF – Dynamic Platform Thermal Framework Intel® DPTF is the Key Driver of Power/Thermal Management

12 Intel® DPTF Passive Policy I Introduction 12 Time (sec) cTDP-Base/ cTDP-Down Power (W) Temperature (C) SOC Tjmax Thermal design target Skin thermal design target Tjmax Board Sensor * _ Temp PL1 >=TDP Dynamic PL1 starts to adaptively control DPTF_PSV within skin thermal spec. The Control algorithm could go as low as cTDP-Base/cTDP-Down to maintain skin based on system thermal requirements. Dynamic PL1 starts to adaptively control DPTF_PSV within skin thermal spec. The Control algorithm could go as low as cTDP-Base/cTDP-Down to maintain skin based on system thermal requirements. DPTF_PSV corresponding to Skin spec Skin spec Skin Temp Pkg Power Pkg Power (DPTF) Skin Temp (DPTF) Note: An accurate on-board thermal sensor to monitor skin thermal requirement to provide the best performance in thermally constrained platforms

13 13 Switchable Dynamic PL1 Scenario Design Optimized dynamic PL1 algorithm to different scenarios to maximize system performance and enhance UX. Active Dock 6-8WHorizontal Tablet: 3.5W Vertical Tablet / Clamshell 4-6W Brings the benefits of core performance scaling for 2:1s Intel® DPTF provides instant and dynamic contextual performance management to enhance 2-in-1 user experience. The higher PL1 is possible to have better performance. The number is an example, not the real result.

14 Agenda Review of Hardware Recommendation for Microsoft’s Continuum Support Introduction on Dynamic Platform Thermal Framework Key strategies to reduce system thickness on your fanless designs and tradeoffs on system design to go thin

15 A New Approach to Design Innovation XYZ Design Rules Innovate solutions

16 What Contributes to Thin & Fanless Designs Thermals Improved methods to disperse heat Manage air gaps These are areas that you influence in your platform System Stack-up Balance heat dissipation through back panel & display Chassis Advancements Thin die-cast Aluminum A panel PCB Minimize size and/or Z-height for proper battery capacity or system thickness Type 4 uVia technology Component Area Using 2 x64 LPDDR3 PMIC VR solution Display Panel Selection Choosing thinner panels Power consumption

17 Designing Thin and Small Motherboards Mainboard: 10 layer Type 4 PCB  Layout, single sided component placement 2 x64 LPDDR3 memory solution Daughter card: 6 layer Type 3 PCB PMIC power delivery CPU facing rear, Storage and Wi-fi facing screen Mix of mainboard or main/daughter card; configurable design with M.2 connectors SoC Memory Power Wi-Fi 64 mm SSD 100 mm EC 30 mm

18 Rear Panel Die Cast Aluminum Aluminum die cast can produce thin & light chassis components IDV 12.5” chassis only 0.75 mm thick & 124 gm  Used hard tooling Al die cast thickness as thin as:  0.4 mm for 10” and below systems  0.55 mm for 11.6” systems; 0.75mm for 12.5” & larger A-cover Outer Side A-cover Inner Side Thin Al Die Cast is a viable option for thin & light tablets

19 Memory Layout Optimization Two x64 LPDDR3 devices Crosstalk mitigated by shorter routes No RTT resistors (and VTT traces) 3-on-3 instead of 3-on-7 X64 LPDDR3 same side as processor Requires Type 4, 10 Layer PCB. Possible with stack-up x64 LPDDR3 on bottom side Requires Type 4, 10L Any Layer PCB SoC DRAM 3 3 3mils 43  1.75” max* *Routing example applies to Data signals, intra-group spacing. Refer to Platform Design Guide for complete solution details. 64 x 100 mm 2.5 mm 40 x 100 mm 4.3 mm TWO x64 LPDDR3 placed very close to processor package can achieve board size savings

20 34 Whr Battery 2 cells (17 Whr ea) Single Package 130 x 135 x 3 mm CPU 2 x64 LPDDR3 Wi-Fi*/ Bluetooth® PMIC Power LTE M.2 NGFF SSD System Layout HVM-friendly layout for 12.5” Thin & Fanless Design For complete details, refer to Go Thin & Fanless Design Kit (IBP Doc # ) Single Motherboard

21 Glass + TP + Panel MB CPU CPU Shielding + TIM Rear Cover Heat Spreader Cross Section at Processor Cross Section at LTE Module M.2 … …… Air Gap Total: 7.99 mm Glass + TP + Panel Heat Spreader MB Rear Cover Heat Spreader Air Gap Air Gap LTE Total: 7.99 mm System Stack-up

22 Recommend MOS 3.5 for Hand-held and MOS 2.5 for On-table Thermal Consideration Thermal Ergonomic Specifications For Hand-held For On-Table

23 Running Skype * 720P via LTE Hand-Held/On-Table Ta=25c Thermal Consideration Thermal Simulation Condition Modeling Calculating Result

24 Thermal Consideration Thermal Simulation Results (Skype* 720P via LTE ) 42.8 C 38.7C LCD Rear Cover 46.7C 45.3C LCD Rear Cover Hand-Held On-Table Temperature © LCD & Rear Cover can meet MOS 3.5 as Hand-Held mode/MOS 2.5 On-Table mode

25 Thermal Consideration Thermal ideas for thin form factors  Enough air gap Select Low-power panel Graphite and Cu spreaders on display / rear cover Larger heat spreaders for main hot component Don’t stack CPU underneath the display backlight Make batteries split. (Optimum) Increased Cu content in the motherboard Air is the best low-cost thermal insulator CPU MB Spreader Cooler skin Air Gap CPU MB Spreader Hotter skin

26 Thermal Consideration Thermal ideas for thin form factors Enough air gap  Select Low-power panel Graphite and Cu spreaders on display / rear cover Larger heat spreaders for main hot component Don’t stack CPU underneath the display backlight Make batteries split. (Optimum) Increased Cu content in the motherboard It can lower whole LCD temperature Hi-power LCD Low-power LCD 46.7C 43.3C

27 Thermal Consideration Thermal ideas for thin form factors Enough air gap Select Low-power panel  Graphite and Cu spreaders on display / rear cover Larger heat spreaders for main hot component Don’t stack CPU underneath the display backlight Make batteries split. (Optimum) Increased Cu content in the motherboard It can transfer heat to cooler area and make skin cooler Hot spot Graphite 46.7C 44.6C

28 It can spread more heat from CPU and make skin cooler Heat Spreader On CPU CPU MB Spreader Hotter skin CPU MB Spreader Cooler skin Thermal Consideration Thermal ideas for thin form factors Enough air gap Select Low-power panel Graphite and Cu spreaders on display / rear cover  Larger heat spreaders for main hot component Don’t stack CPU underneath the display backlight Make batteries split. (Optimum) Increased Cu content in the motherboard

29 Cooler LCD Thermal Consideration Thermal ideas for thin form factors Enough air gap Select Low-power panel Graphite and Cu spreaders on display / rear cover Larger heat spreaders for main hot component  Don’t stack CPU underneath the display backlight Make batteries split. (Optimum) Increased Cu content in the motherboard Separate heat source can make LCD cooler Hotter LCD CPU Rear Cover LCD Back-Lite CPU

30 Thermal Consideration Thermal ideas for thin form factors Enough air gap Select Low-power panel Graphite and Cu spreaders on display / rear cover Larger heat spreaders for main hot component Don’t stack CPU underneath the display backlight  Make batteries split. (Optimum) Increased Cu content in the motherboard Put cooler component underneath high-touch area will improve UX Battery High Touch Low Touch

31 Thermal Consideration Thermal ideas for thin form factors Enough air gap Select Low-power panel Graphite and Cu spreaders on display / rear cover Larger heat spreaders for main hot component Don’t stack CPU underneath the display backlight Make batteries split. (Optimum)  Increased Cu content in the motherboard It can spread heat from component and lower whole PCB temperature 30% Cu content70% Cu content 67.1C 61.2C

32 32 Summary and Call to Action Intel® Core TM M processors provide flexibility to have thin fanless designs Designing Great 2 in 1 devices require tradeoffs for materials, thickness and system designs – it can be done Ensure that your system design accounts for all tradeoff and do your simulations Add sensors in chassis to use Tskin for thermal management, not just Tjunction Ensure your platform supports hooks for Continuum Support and adopts Intel® DPTF for best thermal optimization

33 Intel Confidential — Do Not Forward


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