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Advanced Technology Electronics Co. 1. Product Name ( 품명 ) : Conductive gold fabric(Taffeta) with conductive adhesive ( 직포 Gold 단면 도전테이프 ) 2. Product No.

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Presentation on theme: "Advanced Technology Electronics Co. 1. Product Name ( 품명 ) : Conductive gold fabric(Taffeta) with conductive adhesive ( 직포 Gold 단면 도전테이프 ) 2. Product No."— Presentation transcript:

1 Advanced Technology Electronics Co. 1. Product Name ( 품명 ) : Conductive gold fabric(Taffeta) with conductive adhesive ( 직포 Gold 단면 도전테이프 ) 2. Product No. ( 품번 ) : DE1-1028CG (1026CG) 3. Structure ( 구조 ) 4. Characteristics ( 특성 ) Conductive gold fabric (Taffeta) Release liner Acrylic conductive adhesive EMI SHIELDING ADHESIVE Width (mm) 폭 Length (M/Roll) 길이 Adhesive Strength (180peel * gf/ 25mm) 점착력 Thickness ( ㎛ ) 두께 50 More than 3,600 More than 1,000 Less than ℃ *60% R.H. SUS 304Plate 30min, 300mm/min EMQI-1026 (0.5Kgf) 130 ±10 Max 1,080 PET film(25 ㎛ ),40 ℃,500g Holding Strength (sec) 유지력 Surface resistivity (Ω/sq inch) 표면저항 Volume resistivity (Ω/sq inch) 수직저항 Less than 0.1EMQI-1031 (0.5Kgf) Material 재료 REFERENCESTANDARDITEM Conductive adhesive resin Composition 도전점착제 구성성분 Base Adhesive Polyester Woven fabric(Taffeta), Copper and Gold(24K) plated avg 110 ㎛ One side conductive adhesive avg 30 ㎛ Acrylic ester polyol copolymer + Nickel powder Release Liner CP paper avg 70 ㎛ Lead (Pb) content 납 함유량 Cadmium content 카드뮴 함유량 Mercury (Hg) content 수은 함유량 Chromium Ⅵ (Cr 6+ ) content 6 가 크롬 함유량 pass PBB, PBDEs content 브롬계 난연제 함유량 Analyzed by GC/MS (Less than 100ppm) USEPA 3050B, ICP-AES (Less than 100ppm) EN 1122, ICP-AES (Less than 5ppm) USEPA 3052, ICP-AES (Less than 100ppm) USEPA 3060A (Less than 100ppm) * Meets RoHS compliant

2 Advanced Technology Electronics Co. 1. Product Name ( 품명 ) : Conductive gold fabric(Taffeta) with conductive adhesive ( 직포 Gold 단면 도전테이프 ) 2. Product No. ( 품번 ) : DE1-1030CG 3. Structure ( 구조 ) 4. Characteristics ( 특성 ) Conductive gold fabric (Taffeta) Release liner Acrylic conductive adhesive EMI SHIELDING ADHESIVE Width (mm) 폭 Length (M/Roll) 길이 Adhesive Strength (180peel * gf/ 25mm) 점착력 Thickness ( ㎛ ) 두께 50 More than 3,600 More than 1,000 Less than ℃ *60% R.H. SUS 304Plate 30min, 300mm/min EMQI-1026 (0.5Kgf) 70 ±10 Max 1,080 PET film(25 ㎛ ),40 ℃,500g Holding Strength (sec) 유지력 Surface resistivity (Ω/sq inch) 표면저항 Volume resistivity (Ω/sq inch) 수직저항 Less than 0.1EMQI-1031 (0.5Kgf) Material 재료 REFERENCESTANDARDITEM Conductive adhesive resin Composition 도전점착제 구성성분 Base Adhesive Polyester Woven fabric(Taffeta), Copper and Gold(24K) plated avg 50 ㎛ One side conductive adhesive avg 30 ㎛ Acrylic ester polyol copolymer + Nickel powder Release Liner CP paper avg 70 ㎛ Lead (Pb) content 납 함유량 Cadmium content 카드뮴 함유량 Mercury (Hg) content 수은 함유량 Chromium Ⅵ (Cr 6+ ) content 6 가 크롬 함유량 pass PBB, PBDEs content 브롬계 난연제 함유량 Analyzed by GC/MS (Less than 100ppm) USEPA 3050B, ICP-AES (Less than 100ppm) EN 1122, ICP-AES (Less than 5ppm) USEPA 3052, ICP-AES (Less than 100ppm) USEPA 3060A (Less than 100ppm) * Meets RoHS compliant

3 Advanced Technology Electronics Co. 1. Product Name ( 품명 ) : Conductive mesh with both side conductive adhesive (Mesh 양면 도전테이프 ) 2. Product No. ( 품번 ) : DE4-2020C 3. Structure ( 구조 ) 4. Characteristics ( 특성 ) Conductive mesh Acrylic conductive adhesive Release liner Acrylic conductive adhesive Width (mm) 폭 Length (M/Roll) 길이 Adhesive Strength (180peel * gf/ 25mm) 점착력 Thickness ( ㎛ ) 두께 50 More than 3,600 More than 1,000 Less than ℃ *60% R.H. SUS 304Plate 30min, 300mm/min EMQI-1026 (0.5Kgf) 130 ±10 Max 1,000 PET film(25 ㎛ ),40 ℃,500g Holding Strength (sec) 유지력 Volume resistivity (Ω/sq inch) 수직저항 Material 재료 REFERENCESTANDARDITEM Adhesive resin Composition 도전점착제 구성성분 Base Adhesive Polyester Woven fabric(Mesh), Copper and Nickel plated avg 100 ㎛ One side conductive adhesive avg 30 ㎛ The other side conductive adhesive avg 30 ㎛ Acrylic ester polyol copolymer + Nickel powder Release Liner CP paper avg 70 ㎛ Lead (Pb) content 납 함유량 Cadmium content 카드뮴 함유량 Mercury (Hg) content 수은 함유량 Chromium Ⅵ (Cr 6+ ) content 6 가 크롬 함유량 pass PBB, PBDEs content 브롬계 난연제 함유량 Analyzed by GC/MS (Less than 100ppm) USEPA 3050B, ICP-AES (Less than 100ppm) EN 1122, ICP-AES (Less than 5ppm) USEPA 3052, ICP-AES (Less than 100ppm) USEPA 3060A (Less than 100ppm) EMI SHIELDING ADHESIVE * Meets RoHS compliant

4 Advanced Technology Electronics Co. 1. Product Name ( 품명 ) : Conductive fabric (Ripstop) with conductive adhesive ( 초직포 도전 단면테이프 ) 2. Product No. ( 품번 ) : DE2-1028C (1026C) 3. Structure ( 구조 ) 4. Characteristics ( 특성 ) Conductive fabric (Ripstop) Release liner Acrylic conductive adhesive EMI SHIELDING ADHESIVE Width (mm) 폭 Length (M/Roll) 길이 Adhesive Strength (180peel * gf/ 25mm) 점착력 Thickness ( ㎛ ) 두께 50 More than 3,600 More than 1,000 Less than ℃ *60% R.H. SUS 304Plate 30min, 300mm/min EMQI-1026 (0.5Kgf) 140 ±10 Max 1,080 PET film(25 ㎛ ),40 ℃,500g Holding Strength (sec) 유지력 Surface resistivity (Ω/sq inch) 표면저항 Volume resistivity (Ω/sq inch) 수직저항 Less than 0.1EMQI-1031 (0.5Kgf) Material 재료 REFERENCESTANDARDITEM Conductive adhesive resin Composition 도전점착제 구성성분 Base Adhesive Polyester Woven fabric(Ripstop), Copper and Nickel plated avg 120 ㎛ One side conductive adhesive avg 30 ㎛ Acrylic ester polyol copolymer + Nickel powder Release Liner CP paper avg 70 ㎛ Lead (Pb) content 납 함유량 Cadmium content 카드뮴 함유량 Mercury (Hg) content 수은 함유량 Chromium Ⅵ (Cr 6+ ) content 6 가 크롬 함유량 pass PBB, PBDEs content 브롬계 난연제 함유량 Analyzed by GC/MS (Less than 100ppm) USEPA 3050B, ICP-AES (Less than 100ppm) EN 1122, ICP-AES (Less than 5ppm) USEPA 3052, ICP-AES (Less than 100ppm) USEPA 3060A (Less than 100ppm) * Meets RoHS compliant

5 Advanced Technology Electronics Co. 1. Product Name ( 품명 ) : Conductive fabric(Taffeta) with both side conductive adhesive ( 직포 양면 도전테이프 ) 2. Product No. ( 품번 ) : DE1-2030C 3. Structure ( 구조 ) 4. Characteristics ( 특성 ) Acrylic conductive adhesive Release liner Conductive fabric (Taffeta) EMI SHIELDING ADHESIVE Width (mm) 폭 Length (M/Roll) 길이 Adhesive Strength (180peel * gf/ 25mm) 점착력 Thickness ( ㎛ ) 두께 50 More than 3,600 More than 1, ℃ *60% R.H. SUS 304Plate 30min, 300mm/min 80 ±10 Max 1,080 PET film(25 ㎛ ),40 ℃,500g Holding Strength (sec) 유지력 Material 재료 REFERENCESTANDARDITEM Conductive adhesive resin Composition 도전점착제 구성성분 Base Adhesive Polyester Woven fabric(Taffeta), Copper and Nickel plated avg 50 ㎛ One side conductive adhesive avg 20 ㎛ The other side conductive adhesive avg 20 ㎛ Acrylic ester polyol copolymer + Nickel powder Release Liner CP paper avg 70 ㎛ Volume resistivity (Ω/sq inch) 수직저항 Less than 0.1EMQI-1031 (0.5Kgf) Lead (Pb) content 납 함유량 Cadmium content 카드뮴 함유량 Mercury (Hg) content 수은 함유량 Chromium Ⅵ (Cr 6+ ) content 6 가 크롬 함유량 pass PBB, PBDEs content 브롬계 난연제 함유량 Analyzed by GC/MS (Less than 100ppm) USEPA 3050B, ICP-AES (Less than 100ppm) EN 1122, ICP-AES (Less than 5ppm) USEPA 3052, ICP-AES (Less than 100ppm) USEPA 3060A (Less than 100ppm) * Meets RoHS compliant

6 Advanced Technology Electronics Co. 1. Product Name ( 품명 ) : Copper foil with conductive adhesive (Cu 단면 도전테이프 ) 2. Structure ( 구조 ) 3. Characteristics ( 특성 ) Copper Release liner Acrylic conductive adhesive Width (mm) 폭 Length (M/Roll) 길이 Adhesive Strength (180peel * gf/ 25mm) 점착력 Thickness ( ㎛ ) 두께 50 More than 3,600 More than 800 Less than ℃ *60% R.H. SUS 304 Plate 30min, 300mm/min EMQI-1026 (0.5Kgf) 65 ±10 Max 650 PET film(25 ㎛ ),40 ℃,500g Holding Strength (sec) 유지력 Surface resistivity (Ω/sq inch) 표면저항 Volume resistivity (Ω/sq inch) 수직저항 Less than 0.1EMQI-1031 (0.5Kgf) Material 재료 REFERENCESTANDARDITEM Conductive adhesive resin Composition 도전점착제 구성성분 Base Adhesive Copper foil avg. 35 ㎛ One side conductive adhesive avg 30 ㎛ Acrylic ester polyol copolymer + Nickel powder Release Liner CP paper avg 70 ㎛ Lead (Pb) content 납 함유량 Cadmium content 카드뮴 함유량 Mercury (Hg) content 수은 함유량 Chromium Ⅵ (Cr 6+ ) content 6 가 크롬 함유량 pass PBB, PBDEs content 브롬계 난연제 함유량 Analyzed by GC/MS (Less than 100ppm) USEPA 3050B, ICP-AES (Less than 100ppm) EN 1122, ICP-AES (Less than 5ppm) USEPA 3052, ICP-AES (Less than 100ppm) USEPA 3060A (Less than 100ppm) EMI Shielding Adhesive


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