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Copyright INCASES Engineering GmbH Future Component Characterization for EMI Analysis - INCASES Engineering GmbH - O. RethmeierW. Rissiek.

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Presentation on theme: "Copyright INCASES Engineering GmbH Future Component Characterization for EMI Analysis - INCASES Engineering GmbH - O. RethmeierW. Rissiek."— Presentation transcript:

1 Copyright INCASES Engineering GmbH Future Component Characterization for EMI Analysis - INCASES Engineering GmbH - O. RethmeierW. Rissiek

2 Copyright INCASES Engineering GmbH Motivation Modern designs use components that are characterized through  increasing package density  increasing package dimension  increasing clock rates  faster transition times  high power consumption  Increasing signal integrity problems  High thermal radiation  Strong electromagnetic fields in the neighborhood of the IC  Package can be as effective as antennas

3 Copyright INCASES Engineering GmbH Radiation Effects Differential Mode  Current Loops (e.g. Signal Loops / Bypass Loops)  Common Mode  Differential mode - Common mode coupling (Potential Shift in the Supply System)   Radiation through cables and packages

4 Copyright INCASES Engineering GmbH Requirements EMI Analysis and SI Analysis requires a  complete  clear  consistant provision of all data and parameters of the design (including component characterization).

5 Copyright INCASES Engineering GmbH Component Characterization  Mechanical characterization  highly complex internal structure  often no geometrical information available  Electrical characterisation  e.g. IBIS  Thermal characterization

6 Copyright INCASES Engineering GmbH Complexity of Design  In general, a  numerical EMI analysis of the complete design is not possible –memory –computation time  Partitioning of the problem uses  a prior knowledge of an expert approach (more ‘classification’ data)  simplified assumptions (less detailed simulation models)

7 Copyright INCASES Engineering GmbH Essential Component Characteristics for EMI-Analysis (I) Geometrical parameter  Package type (e.g. QFP, BGA, PGA,...)  Package dimensions (length, width, height,...)  Pin pitch of the component

8 Copyright INCASES Engineering GmbH Essential Component Characteristics for EMI-Analysis (II) Electrical Parameter  Technology  Supply-voltages  Analog, mixed analog / digital  Noise margin  Input- / output behavior  Band width of signal pins  Max. / min. voltage res. currents  Transfer time  Frequency

9 Copyright INCASES Engineering GmbH Details on Electrical Parameter Buffer Specific Quantities: Voltages and Currents Voltage positive power supplyV cc VI/OAnalysis/Evaluationdatasheet negative power supplyV ss /GNDVI/OAnalysis/Evaluationdatasheet min. voltage low-levelV OLmin VOAnalysisdatasheet max. voltage low-levelV Lmax VI/OAnalysis/Evaluationdatasheet min. voltage high-levelV Hmin VI/O Analysis/Evaluationdatasheet max. voltage high-levelV OHmax V OAnalysisdatasheet Threshold voltageV It VIEvaluationdatasheet Ref.-voltage low/high Def. tdV mDR VI/OEvaluationdatasheet Ref.-voltage high/low Def. tdV mDF VI/OEvaluationdatasheet Voltage positive power supplyV cc VI/OAnalysis/Evaluationdatasheet negative power supplyV ss /GNDVI/OAnalysis/Evaluationdatasheet min. voltage low-levelV OLmin VOAnalysisdatasheet max. voltage low-levelV Lmax VI/OAnalysis/Evaluationdatasheet min. voltage high-levelV Hmin VI/O Analysis/Evaluationdatasheet max. voltage high-levelV OHmax V OAnalysisdatasheet Threshold voltageV It VIEvaluationdatasheet Ref.-voltage low/high Def. tdV mDR VI/OEvaluationdatasheet Ref.-voltage high/low Def. tdV mDF VI/OEvaluationdatasheet ParameterSymbolUnit Currents max. current low-levelI OLmax AOAnalysisdatasheet max. current high-levelI OHmax AOAnalysisdatasheet BufferSourceApplication

10 Copyright INCASES Engineering GmbH Details on Electrical Parameter Buffer Specific Quantities: Time and Clock Frequencies Times max. Fall time low/hight TIRmax s IEvaluationdatasheet max. Fall time high/lowt TIFmax s IEvaluationdatasheet typical Fall time low/hight TOR sOAnalysismodel typical Fall time high/lowt TOF sOAnalysismodel special delay time low/high of an output load circuitt OmDR sO Evaluationmodel special delay time high/low of an output load circuitt OmDF s OEvaluationmodel Times max. Fall time low/hight TIRmax s IEvaluationdatasheet max. Fall time high/lowt TIFmax s IEvaluationdatasheet typical Fall time low/hight TOR sOAnalysismodel typical Fall time high/lowt TOF sOAnalysismodel special delay time low/high of an output load circuitt OmDR sO Evaluationmodel special delay time high/low of an output load circuitt OmDF s OEvaluationmodel ParameterSymbolUnit Clock Frequencies min. work frequencyf Wmin HzI/OAnalysisdatasheet max. work frequencyf Wmax HzI/OAnalysisdatasheet typical work frequencyf Wtyp HzI/OAnalysisSpec BufferSourceApplication

11 Copyright INCASES Engineering GmbH Details on Electrical Parameter Buffer Specific Quantities: Voltages

12 Copyright INCASES Engineering GmbH Resistance Input resistanceR i  IAnalysismodel Output resistance low/highR OLH  OAnalysismodel Output resistance high/lowR OHL  OAnalysismodel Resistance Input resistanceR i  IAnalysismodel Output resistance low/highR OLH  OAnalysismodel Output resistance high/lowR OHL  OAnalysismodel ParameterSymbolUnit Capacitance Input capacitanceC I F IAnalysismodel Output capacitanceC O FOAnalysismodel BufferSourceApplication Buffer Specific Quantities: Resistance, Capacitance Details on Electrical Parameter

13 Copyright INCASES Engineering GmbH Details on Electrical Parameter Buffer specific Characteristics Band widthf OB of a signal at output (f Pmin/typ/max, t TOR/F ) f IB of a buffer at input (t TIR/Fmax ) (static) Noise marginhigh-level S H = V OHmin - V IH min low-level S L = V ILmax - V OLmax V ILmax, V IHtop - V Hmin Noise potentialClassification of radiated / internal noise characteristics from driver parameter into low, medium, high SensitivityClassification of sensitivity from the receiver parameter into low, medium, high ActivityClassification using all parameter into low, medium, high Buffer specific Characteristics Band widthf OB of a signal at output (f Pmin/typ/max, t TOR/F ) f IB of a buffer at input (t TIR/Fmax ) (static) Noise marginhigh-level S H = V OHmin - V IH min low-level S L = V ILmax - V OLmax V ILmax, V IHtop - V Hmin Noise potentialClassification of radiated / internal noise characteristics from driver parameter into low, medium, high SensitivityClassification of sensitivity from the receiver parameter into low, medium, high ActivityClassification using all parameter into low, medium, high Derived QuantitiesExplanation Derived Quantities

14 Copyright INCASES Engineering GmbH Component specific Characteristics Noise potentialClassification of the component using all parameter into low, medium, high SensitivityClassification of the component using all parameter into low, medium, high ActivityClassification of the component using all parameter into low, medium,high Component specific Characteristics Noise potentialClassification of the component using all parameter into low, medium, high SensitivityClassification of the component using all parameter into low, medium, high ActivityClassification of the component using all parameter into low, medium,high Derived QuantitiesExplanation Details on Electrical Parameter Derived Quantities

15 Copyright INCASES Engineering GmbH BUSBus-inputs and outputs; e.g.at bus driver, controller, etc. CLOCKAll clock inputs and outputs; e.g. at flip-flop, counters, processor, etc. CTRLControl inputs like Reset, RAS, CAS, WE, OE, DIR, etc. DATAData inputs and outputs like gates, memory components, etc. SUPPLYSupply pins of all components BUSBus-inputs and outputs; e.g.at bus driver, controller, etc. CLOCKAll clock inputs and outputs; e.g. at flip-flop, counters, processor, etc. CTRLControl inputs like Reset, RAS, CAS, WE, OE, DIR, etc. DATAData inputs and outputs like gates, memory components, etc. SUPPLYSupply pins of all components HYPOTHETICPins that cannot be assigned to other classes DEFAULT HYPOTHETICPins that cannot be assigned to other classes DEFAULT Signal ClassExplanation Details on Electrical Parameter Buffer Classification

16 Copyright INCASES Engineering GmbH Summary EMI - Analysis of PCB’s requires  behavioral buffer models like IBIS  additional ‘classification’ parameters for an expert approach  specific geometrical package information  Extension of current standardization required!


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