Presentation on theme: "Fg INFN CSN1 5/4/041 INFN CSN 1 5 APRILE 2004 STATO CMS DRIFT TUBES fgasparini."— Presentation transcript:
fg INFN CSN1 5/4/041 INFN CSN 1 5 APRILE 2004 STATO CMS DRIFT TUBES fgasparini
fg INFN CSN1 5/4/042 Final results of the Trigger Test on the 25ns beam
fg INFN CSN1 5/4/043 More than 50% of the chambers has been produced, the full lot will be completed around mid chambers (full lot is 210) are already at CERN Superlayer production in Aachen,CIEMAT and Legnaro is going on smoothly at the usual rate corresponding to 19~ 20 chambers per year (nominal is 18)
fg INFN CSN1 5/4/ chambers (80 Superlayers, of the largest MB4) have to be produced in Torino. Torino completed the assembly of the tools and tables and is now Ready to start. A first dummy Superlayer was assembled successfully We expect to be able to make a sound production plan in the MU Barrel Week in Aachen at end of April.
fg INFN CSN1 5/4/045
6 Status of Torino MB4 Production Line 2 nd layer glued: 1 st measurement of wire position (no fine tuning of I-Beam alignment, no check of single wires off tolerance (±100 m). Wire seen by CCD camera Wire image sw-reconstruced
fg INFN CSN1 5/4/047 An exercise for Torino wrt schedule V Assume that Torino produce 2 ch/month,starting June 04 (INFN Milestone), 10 work month/year (20 ch/year, is the actual rate in the other sites) End inst.window chambers needed available 1 Aug.05 (mag.test) 18 (YB+2/+1/0) 23 (mid may) 1 Dec.05 (begin lowering) 1 March 06 (end SX inst.) 30 (YB-2/-1) 33 (mid Dec.) Sept.06 (end UX Inst) 40 (sect. 1 and 7) 40 (mid april 06)
fg INFN CSN1 5/4/048 Plates and beams : cutting and assembly in Torino/Dubna and Protvino in schedule,to be finished in few months Chamber dressing at ISR : all parts defined (but few for MB4) and available to allow a steady dressing. (Bologna) Chamber Alignment at ISR: going on on schedule (>80 aligned) (CERN) Installation tools : only large cradle for Torino MB4 missing available in summer 04 HV Supplies (CAEN) : delivery in progress, delivery of 75% of the full lot in 2004 LV Supplies: offer from CAEN, tech. sound. Waiting common tender for ECAL/DT/RPC (Sharp/Willmott) HV cables production at ISR(IHEP) : on schedule (problem in definition of cutting lengths) CCB : preserie from CAEN (40) available in May (1 month delay) SB : preserie of 40 available and under test in Bologna + 50 end of April BTIm : ~ half lot produced TRB : see later HVB : see later
fg INFN CSN1 5/4/049 Minicrates: on the critical path There is a delay of a couple of months :MC assembly moved from March to May. 1) Problems of yield in the second preserie from the Trigger Board Firm (N). Some mistakes in the assembly of the boards (N) and few defective BTIm included in the shipment to N from the firm producing the BTIm 2) Some change in the internal MC cabling due to unexpected Integration problems. 3) Delay in CCB delivery 12 read out Minicrates assembled in CIEMAT will be at Legnaro beginning of April, enough boards are avilable to complete 5~6 MC. Assembly and test will begin mid may. The 5 ~ 6 MC could be finished by July,taking into account the debugging phase of the full test chain. A reasonable expectation is than to reach a speed of 8 to 10 MC/month in September and the nominal speed of 12 ~ 15 by October. First 5 MC are for the 5 top MB1 of YB+2 in July to check integration with HOB 12 MC for the top part of YB+2 in September 12 for YB+1 top = 29 by Oct. (possible?)
fg INFN CSN1 5/4/0410 HV BOARDS HVB ACCIDENT
fg INFN CSN1 5/4/0411 Shown are the outer layers,the break down occurs across the brown channels. In the center of them is the line carrying the HV for the wires (3.8 KV).The inner layers carry the HV for cathode and strips.
fg INFN CSN1 5/4/0412 The three layers of the Old and Improved design with insulating channels 1.5 mm wide. The other three are the symmetric image. Below the outer layer of the New Design with channels enlarged to 2.8mm. The inner layers are identical to the Old design Volts ground Volt Volt
fg INFN CSN1 5/4/0413 Total lot of HVB Type of board total PCB rej. Accepted boards Infant failure Installed in IHEP in IHEP in chambers in chambers 1 st generation 6% % % 3700 bad batch 21% ~7% ~ 0 2 nd generation rd generation ~300 3 rd generation was supposed to be 5000 boards, production stopped after long term failures of 8 out of 1080 boards of the 1 st generation (3000 hours under HV and 5 months in gas) 2 nd and 3 rd generation :substantial improvement of infant mortality The 2 nd and 3 rd generation boards passed an aging cycle (10 cycle between –30 and +50 deg) with no failure up to now. The aging process was tested and found very effective on a sample of 300 boards of the bad batch: the mortality was found to be ~ 7% within few (~ 12) hours under HV.(in agreement with the finding in the Superlayers).
fg INFN CSN1 5/4/0414 Boards : Three types of boards were produced: The three types of boards ( O,I and N) have in common the outer insulation material ( prepreg no flow). Old (O) : one prepreg no flow layer on the outer face 6103 assembled and accepted in IHEP Of them were put aside by visual inspection (~ the full batch of Oct.01,after first defective HVBs were discovered in Aachen in May 02) Improved (I) : double prepreg layer and different gluing cycle (temp., pression etc..) Designed after the bad batch of Oct assembled,accepted in IHEP and “aged” New design (N) : as (I) but with double width of the insulation channel versus the wire line in the outer layers. 1660Assembled,tested in IHEP (PCB aged) out of 5000 foreseen For the details in blu see the page “production history”.
fg INFN CSN1 5/4/ st Gen.HVB FAILURES : 1% faults in the first 500 hours (test passed by 5200 HVB) ~ 1.7% taking away the 1200 HVB “improved”of 2 nd gen. that did not show any failure,but were not tested for more than 500 h. 0.25% between 500 and 1000 hours % between 1000 and % between 1500 and % between 2000 and 3000 hours 1500 (before the accident of mid dec.2003) PCBs are produced by a firm, the assembly of the components is done in IHEP. The final test lasts 12 hours in gas at 4000 V No failure can be attributed to mistakes during the assembly
fg INFN CSN1 5/4/ HVB of the 1 st generation failed in Dec.03 and Jan.04 in the outer layers of the board and in chambers that worked very fine for more than 3000 hours. The long term HV run of these chambers ended in june or in september and than the chambers were left quiet but under gas flow. The accident happened at the switch on in view of a last test before installation. The chambers ready for installation are 24 : 12 MB3 and 12 MB2. They are equipped with 1080 HVB. The boards represents the 0.8% of the lot. In the history of the 24 chambers, TWO HVB failed during assembly ( one MB3 in Legnaro and one MB2 in CIEMAT).(0.1%) The failure after the positive long term HV test was fully unexpected Before this accident the failure rate between 2000 and 3000 hours (the typical duration of the long term test) was 0 % on a total of about 1500 HVB.
fg INFN CSN1 5/4/0417 IN summary: Failures occurred only in the outer layer (3800 volts) along the long straight lines AND the bent ones. No failure in the inner (1800 and –1200) Field values in inner and outer layers are comparable. Failures do not pass through the printed layer or the outer prpreg Failures are at the interface between outer prepreg and FR4 PCB The failures in the outer layers are present in the old boards only (one prepreg layer) No failure up to now in the Improved boards (double prepreg)
fg INFN CSN1 5/4/ st generation good board failure
fg INFN CSN1 5/4/0419 Section of 1st gen board,put aside by visual inspection 1st gen. Good board that failed
fg INFN CSN1 5/4/0420 Conclusion: This indicates that the week point is the bad adhesivity of the no flow prepreg to the FR4. Absorbtion of gas in microcavity can only worsen this situation. (test on gas abs. going on in Legnaro) Double prepreg (improved boards) have a visibly better adhesion and no infant failure up to now…………. However we can’t predict the long term behavior. Decision : elimination of the prepreg no flow, avoid contact with gas,take away ground surface in the wire layer. MAKE NEW BOARDS. that do not need the prepreg no flow, and minimizes the direct contact of HV insulating parts with the gas. This can be done by adding two extralayers. (from 6 to 8 layers).
fg INFN CSN1 5/4/0421 old new added layer
fg INFN CSN1 5/4/0422 insulation “Prepreg flow’ “Prepreg no flow” CROSS SECTION OF OLD and NEW HVB WIRES 1 STRIPS 1 CATHODES 1 STRIPS 2 WIRES 2 In this layer are the distribution lines of HV to the wires and the pads to sold components: Resistors,capacities and connection wires CATHODES 2 “Prepreg no flow” In this layer wires connections only Soldering pads in the new outer layer Flow prepreg 1,2,3rd generation boards NEW BOARDS
fg INFN CSN1 5/4/0423 The total lot of boards is about In agreement with CMS,to avoid dramatic delay in the installation, we are installing the 1600 Boards with double channel and double prepreg in the chambers to be installed in YB+2,the most accessible one (May …September). Use the NEW Boards in the YB+1 etc in Nov…Dec. In the mean time the sites will equip their chambers with old boards of any type that will be gradually substituted with the NEW before installation of chambers in the yokes. This implies that the boards of some 180 chambers will be substituted at ISR (360 days of 1 Person). (cost,manpower,logistic………) In this hypothesis 9250 NEW Boards are needed for wheels +1,0,-1,-2 The new boards should be available in relevant lots by september 2004 for YB+1, and the full production completed by beginning 2005 (march,april) boards in 6 ~8 months > 1500 to 1200 boards/month. (current rate 400/month) Find producer for the new PCBs, and improve by a factor 3 or 4 the board assembly rate.
fg INFN CSN1 5/4/ YB+2 YB+1 YB0 YB+2 YB+1 YB v 33.2 JAN 05 By the time of the magnet test v 34.0 AUG 05 OLD NEW CHANGE OF THE INSTALLATION SEQUENCE 3rd gen.boards New Boards
fg INFN CSN1 5/4/0425 The DT collaboration agreed to produce new boards 9250 for the installed chambers 1750 as spares (for spare chambers and in case of problems in YB+2) Total ~ Positive discussion are going on with IHEP Beijing and other collaborators. IHEP will produce 3500 new HVB within the current MoU and is investigating the possibility of an increase of the assembly rate by a factor 3 to produce the full lot of (9250 by march~april 2005) We are also looking for help from other collaborating countries for help in assembly (Hungary)
fg INFN CSN1 5/4/0426 Dobbiamo produrre in totale Boards,compresi spares. La stima attuale e' di circa 410 KE (non abbiamo offerte definitive) A carico INFN 205 KE (resto diviso tra Germania e Spagna) E' bene prevedere 10% di IVA : totale richiesta aggiuntiva 226 KE (186 nel 204 e 40 nel 2005) possibile disponibilita su fondi gia’ assegnati nel 2004 : 83 KE totale aggiuntivi 2004: 186 – 83 = 103 KE nel = 123 KE L'ipotesi attuale di suddivisione tra le Agenzie prevede che i PCB siano pagati sostanzialmente da Italia e Germania, Componenti e assemblaggio da Italia e Spagna. CONTENZIOSO CON ALBA IN CASO DI CAMBIO DI PRODUTTORE Per la revisione del contratto con Novatel per la saldatura a mano dei BTIm sono necessari nel 2004 : 54 KE,tutti a carico Italiano. Totale sul = 157 KE
fg INFN CSN1 5/4/0427 La stima attuale del costo delle HVB (165 KE) si basa su un prezzo stimato per PCB di circa 15 E a pezzo (costo vecchie 10 E), potrebbe pero' essere di piu'. Ho verificato il possibile costo dei componenti: e' previsto essere 5.4 E/board totale 60 KE. Per l'assemblaggio abbiamo dalla Cina notizie incoraggianti ma niente di definitivo boards sono coperte dal vecchio MoU. Per le altre 7500 posso fare una stima basata sui vecchi costi : circa 182 KE Totale circa 410 KE. I fondi disponibili 2004 su voci che e' possibile posporre sono : 75 KChF residuo 2003 Bologna e una parte delle assegnazioni di 150 KChF su Bo,Pd e To per manpower per cablaggi. CMS Tech.Coord e’ informato : Il cablaggio delle cinque ruote finira’ nel Questo rende disponibili per altro uso altri 50 KChF. Totale 125 KChF = 83 KE Spero di non aver fatto errori
fg INFN CSN1 5/4/0428 Il disegno della nuova HVB e’ sato discusso: 1) nella collaborazione e sara’ sottoposto all’esame di un comitato CMS (ESR). 2) con esperti di una nota ditta specializzata: giudizio positivo Trovati alcuni punti deboli e indicate alcune attenzioni in fase di costruzione. 3) con 3 ditte specializzate,in vista di invio di richiesta di offerta. Possibili procedure di test e qualificazione: 1) Entry test sui PCB : a 8~ 10 KV (+-) e test finale in gas dopo assemblaggio (8~ 10 ore) Su preserie (50 ~100 HVB) : 2) Sottomissione a cicli termici (-40,+50 ) 3) Sezionatura 4) Permanenza (15gg) in autoclave a 2 atm di Ar/CO2 e nuovo test HV 5) Test in camera climatica(80gradi,80%umidita’,200 volt ) e misura resistenza di isolamento 2,3,4,5 saranno eseguiti per campione su ogni batch 6) Assemblaggio e test in un DT (~ 50 HVB,cross talk/noise) ?????? Cercare di introdurre una condizione su mortalita’ infantile (fattibile solo a produzione lanciata ~ 2000 HVB per 500 ore) ???????
fg INFN CSN1 5/4/0429 foreseen in the contract with ALBA Total PCB produced Returned 2928 Total ship to IHEP Rejected in IHEP 1192 Good from IHEP 9612 (85 % of the order) Put aside after screeening 2260 (+411?) Missing (from ALBA-ship to IHEP) 496 < Missing (from ALBA-good from IHEP) 1688 < Production stopped after the accident. Gara Alba HVB (10950 large (19500 Lit) 350 small (11500 Lit) Totale offerta Klit (data 11/10/99) ~ EURO
fg INFN CSN1 5/4/0430 Status BTI m and TRBoards 24 march /12500 BTI m are already produced. 50 TRBoards of the first preserie of oct 2003 failed; because of the break of about 30% of the BTIm bonds during the soldering in the NOVATEL oven. The BTIm had survived to the burn in and oven cycles in Metallux (10 cycles from 0 To 100 deg.). A sample of 50 was passed in the oven in Padova and Metallux in a short cycle to 220 deg. With no failures. A second test in the oven was done in NOVATEL on few boards after careful adjustment of the parameters : the result was 0.1~0.2 % broken bonds. But the 8 BTIm housed in one board have about 2500 bonds In the next batch of 55 (Xmas 03) (with BTIm soldered by hand) 10 boards failed for mistakes in the assembly but 7 failed because of bad BTIM. We found that Metallux shipped to NOVATEL rejected BTIm
fg INFN CSN1 5/4/0431 The BTIm suffer of thermal fragility that prevent the soldering in a oven. The acceptance test at the firm foresees 10 cycles from 0 to 100 deg. and burn in. Rejection < 1% 50 modules were submitted in Padova to 100 cycles, with 6 rejections. 500 modules had 220 cicles from 15 to 70 deg. : 1 failure. It seems that the failures are due to a local detachment between the glob top resin and the ceramic support. Our understanding is that BTIm glob topping is fragile,termal stress can only worse the situation,we prefer to solder the all the BTIm by hand and avoid passing into an oven.
fg INFN CSN1 5/4/0432 extracCost 35.6 E/Board The total extracost for 1500 boards is ~ E The result of the Tender was E (+15%).We propose to revise the contract ( full INFN)
fg INFN CSN1 5/4/0433 FUNDING etc. Germany Italy Spain Funds % 24% 59% 17% Spent (end 03) 4053* 12577* 3362* %(end 03) 75% 95% 90% Post. LV/HV ~750 Antic. HV % 86% 90% Fin. Plans of FA 2004/ /05 * exp. in 2003 to be checked in Aachen 28/4
fg INFN CSN1 5/4/0434 M&O Years For Spares Normal Total M&O/year It.spares It. Normal It total Ger.spares Ger.Normal Ger. Total Spain spares Spain normal Spain total OK OK Share of spares: Italy 56% Germ 23% Spain 16% CERN 5% Share of Normal M&O B: Italy % Germ % Spain % CERN % China 1150 (?) 4%