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1 Multiphysics 8.0 Customer 3.0- 1/30/04 Dr. Paul Lethbridge - Product Manager ANSYS Multiphysics 8.0 Technology Overview & Benefits.

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Presentation on theme: "1 Multiphysics 8.0 Customer 3.0- 1/30/04 Dr. Paul Lethbridge - Product Manager ANSYS Multiphysics 8.0 Technology Overview & Benefits."— Presentation transcript:

1 1 Multiphysics 8.0 Customer /30/04 Dr. Paul Lethbridge - Product Manager ANSYS Multiphysics 8.0 Technology Overview & Benefits

2 2 Multiphysics 8.0 Customer /30/04 Topics Covered What is Multiphysics? Multiphysics Benefits Educational Products Market Applications – Market segments by Technology – Market Segments by Industry Multi Field (Coupled Physics) Capabilities Direct physics coupling Sequential physics coupling Multi-field Solver (New feature at release 8.0) Other New features Enhanced non-linear Piezoelectric & piezoresistive element. Fluid damping elements Cyclic Symmetry for Magnetostatics Low Frequency Electromagnetic Contact Coupled E-B Particle Tracing Re-meshing for FSI Selected Multi-Physics Examples Product Roadmap & Strategy – Transition to Workbench Environment Product Websites

3 3 Multiphysics 8.0 Customer /30/04 The ANSYS Family of Products Educational/Non Commercial Use Products Ease of use & Entry level capability Powerful tools for the physics specialist High performance mechanical & Thermal Extreme functionality The whole enchilada! ANSYS Multiphysics ANSYS Mechanical ANSYS FLOTRAN ANSYS Emag ANSYS Professional ANSYS Structural ANSYS MCAD & ECAD Connection products ANSYS University

4 4 Multiphysics 8.0 Customer /30/04 Topics Covered What is Multiphysics? Multiphysics Benefits Educational Products Market Applications – Market segments by Technology – Market Segments by Industry Multi Field (Coupled Physics) Capabilities Direct physics coupling Sequential physics coupling Multi-field Solver (New feature at release 8.0) Other New features Enhanced non-linear Piezoelectric & piezoresistive element. Fluid damping elements Cyclic Symmetry for Magnetostatics Low Frequency Electromagnetic Contact Coupled E-B Particle Tracing Re-meshing for FSI Selected Multi-Physics Examples Product Roadmap & Strategy – Transition to Workbench Environment Product Websites

5 5 Multiphysics 8.0 Customer /30/04 What is ANSYS Multiphysics? Structural Fluid Thermal Electrostatic Electrical Magnetic Electro- magnetic A general purpose analysis tool allowing a user to to combine the effects of two or more different, yet interrelated physics, within one, unified simulation environment.

6 6 Multiphysics 8.0 Customer /30/04 Benefits of Multiphysics No other analysis tool provides as many physics under one roof! Greatest breadth and technical depth of physics. Fully parametric models across physics, geometry, materials, loads. Perform Design Optimization across physics, geometry, materials and loads. Seamless integration with ANSYS Probabilistic Design System (PDS). Extremely sophisticated analysis capability. Bottom line benefits: – Analysis closely match reality – bringing reality to the desktop – Reduced assumptions that question certainty and compromise accuracy. – Lower cost: Fewer analysis software tools to purchase,learn & manage. – Lower cost: R&D process compression

7 7 Multiphysics 8.0 Customer /30/04 Benefits of Multiphysics “The use of Multiphysics allows us to return to the basics of engineering where a model and the predictive solution closely approximate reality; this allows the engineer to design with a high degree of confidence that the answers are correct.” Dr. Howard Crabb - Ford Motor Company

8 8 Multiphysics 8.0 Customer /30/04 ANSYS Multiphysics Educational Products Educational products are: ANSYS Research512 K Nodes ANSYS University Advanced128 K Nodes ANSYS University Intermediate32 K Nodes ANSYS University Introductory16 K Nodes ANSYS ED1 K Nodes ANSYS ANSYS Productivity Pack Ed (Bundle of MCAD & ECAD Connection products) All Educational products offer the same physics, coupling and broad analysis capability of commercial ANSYS Multiphysics. Products are however problem size limited per physics…

9 9 Multiphysics 8.0 Customer /30/04 Educational Products – Problem Size Limits

10 10 Multiphysics 8.0 Customer /30/04 Topics Covered What is Multiphysics? Multiphysics Benefits Educational Products Market Applications – Market segments by Technology – Market Segments by Industry Multi Field (Coupled Physics) Capabilities Direct physics coupling Sequential physics coupling Multi-field Solver (New feature at release 8.0) Other New features Enhanced non-linear Piezoelectric & piezoresistive element. Fluid damping elements Cyclic Symmetry for Magnetostatics Low Frequency Electromagnetic Contact Coupled E-B Particle Tracing Re-meshing for FSI Selected Multi-Physics Examples Product Roadmap & Strategy – Transition to Workbench Environment Product Websites

11 11 Multiphysics 8.0 Customer /30/04 Induction heating RF Heating Heat-exchangers – Electronics cooling – Automotive – A/C systems SEMICON – Ion implanters – PVD / CVD Fluid systems – Hydraulic – Pneumatic – Fuel – Microfluidics Electromagnetic machines – Pumps – Generators – Motors – Solenoids Inertial Pressure Mass Proximity Thermal Acoustic Market Applications by Technology Sensors & TransducersActuatorsProcesses Three “broad” Market segments uniquely identified as being inherently Multiphysics Click mouse to progress

12 12 Multiphysics 8.0 Customer /30/04 Market Applications by Industry Electronics Automotive Aerospace / Space Marine SEMICON Government / Military Medical / BioMed Pharmaceutical Appliances Multiphysics is not limited to any specific industry. There are analysis applications and opportunity across the board.

13 13 Multiphysics 8.0 Customer /30/04 Topics Covered What is Multiphysics? Multiphysics Benefits Educational Products Market Applications – Market segments by Technology – Market Segments by Industry Multi Field (Coupled Physics) Capabilities Direct physics coupling Sequential physics coupling Multi-field Solver (New feature at release 8.0) Other New features Enhanced non-linear Piezoelectric & piezoresistive element. Fluid damping elements Cyclic Symmetry for Magnetostatics Low Frequency Electromagnetic Contact Coupled E-B Particle Tracing Re-meshing for FSI Selected Multi-Physics Examples Product Roadmap & Strategy – Transition to Workbench Environment Product Websites

14 14 Multiphysics 8.0 Customer /30/04 Coupled Physics Capabilities: Methods There are two methods to couple physics, Direct & Sequential. Direct - solves all DOF’s at the FEA coefficient matrix level. Sequential - solves DOF’s for one physics then passes results as loads & boundary conditions to the second physics. At least two iterations, one for each physics, in sequence, are needed to achieve a coupled response. There are many confusing terms for the two methods: Coupled Physics Terminology Preferred ANSYS Inc. “descriptive usage” DirectSequential Strict Mathematical usage Matrix Load vector LHS RHS Monolithic Staggered Archaic Use at your peril! Strong Weak Tight Loose Full Partial

15 15 Multiphysics 8.0 Customer /30/04 Direct Coupled Physics Applications Coupled PhysicsApplications Thermal-Structural Anything with a structure! Gas turbines. Pressure-Structural (Inviscid FSI)Acoustics, sonar, SAW Piezoelectric Microphones, sensors Piezoresistive Pressure sensors, strain gauges, Accelerometers Circuit coupled electromagnetics: CIRCUIT124 CIRCUIT125 Motors, MEMS Electrostatic- Structural: TRANS126 TRANS109 MEMS Electro-thermal-structural -magnetic: SOLID5, PLANE13 SOLID62, SOLID98 IC, PCB electro-thermal stress, MEMS actuators Fluid-thermal Piping networks, manifolds

16 16 Multiphysics 8.0 Customer /30/04 Sequential Coupled Physics Applications Thermal-Structural Anything with a structure! Gas turbines. Electromagnetic-thermal Electromagnetic-thermal-structural Induction heating, RF heating Electrostatic-Structural Electrostatic-Structural-Fluidic MEMS Electrostatic – Charged particle Ion Optics, Field Emission Display Technology, Analytical instruments Magnetic - StructuralSolenoids, electromagnetic machines Fluid-Solid: FLOTRAN based FSI MpCCI: Bi-directional FSI CFX-ANSYS unidirectional interface Aerospace, automotive fuel, hydraulic systems, fluid bearing, MEMS fluid damping, drug delivery pumps, heart valves. Electromagnetic-Solid-Fluid Fluid handling systems, EFI, hydraulic systems Thermal-CFD Electronics cooling Multi-field SolverMany! All of the above! Sigfit: Unidirectional, Structural – Optical Automotive lighting, astronomy, any optical instruments

17 17 Multiphysics 8.0 Customer /30/04 Topics Covered What is Multiphysics? Multiphysics Benefits Educational Products Market Applications – Market segments by Technology – Market Segments by Industry Multi Field (Coupled Physics) Capabilities Direct physics coupling Sequential physics coupling Multi-field Solver (New feature at release 8.0) Other New features Enhanced non-linear Piezoelectric & piezoresistive element. Fluid damping elements Cyclic Symmetry for Magnetostatics Low Frequency Electromagnetic Contact Coupled E-B Particle Tracing Re-meshing for FSI Selected Multi-Physics Examples Product Roadmap & Strategy – Transition to Workbench Environment Product Websites

18 18 Multiphysics 8.0 Customer /30/04 Multi-field Solver - Pretext Situation Prior to Release 8.0: Significant number of multi-physics problems can be addressed with sequential coupling using core elements. Our current tools for sequential coupling require advanced APDL and domain knowledge to process solution. We have out-grown custom-command macros that perform sequential coupling e.g..: – FSSOLV – ESSOLV Fluid Solid Interaction (FSI) was a first step towards automated sequential coupling technology

19 19 Multiphysics 8.0 Customer /30/04 Multi-field Solver – Why? There is Growing Market Requirement to: Solve multi-physics problems from all industries. Often need to incorporate more than two physics. Couple more easily to external codes Provide an easier to use Multiphysics environment for current analysts. In Response: ANSYS have developed a “multi-field” solver to automate sequential coupling, and be general enough in the design for most multi-field solution requirements” The multi-field solver is an evolution of our successful FSI solver

20 20 Multiphysics 8.0 Customer /30/04 Multi-field Solver – Implementation Model and mesh – Single model of physical parts. – Multiple, separate meshes for each “Field”, derived from base solid model. What is a FIELD ? – A FIELD is an Finite Element model set up to perform a single solution It may solve for a single physics (e.g. a mechanical structure) It may solve for directly coupled physics (e.g.. piezoelectrics) – A selection of element types is used to define a FIELD – Each FIELD has it’s own mesh – Loads, boundary conditions, solver selection are all part of the FIELD definition – A FIELD may be any analysis type (Static, Harmonic, Transient) – Each FIELD creates it’s own results file – A FIELD may be defined (imported) from an external code via a CDB file.

21 21 Multiphysics 8.0 Customer /30/04 Multi-field Solver – Implementation Interfacing between Fields Fields “talk” to one another through surface or volumetric interfaces Field coupling is realized by mapping loads from one mesh to another – Support similar or dissimilar meshes – Supports 1 st order and 2 nd order elements or mixtures of both Automated mesh “morphing” of non-structural domains is available for all non-structural element types. Multifield Solution The solver loops through all fields Supports static, transient and harmonic analysis Convergence is monitored at the interfaces where loads are transferred.

22 22 Multiphysics 8.0 Customer /30/04 Multi-field Solver – Implementation Time loop: For transient analysis, refers to solution in time For static analysis, refers to each load step For harmonic analysis, refers to harmonic analysis within time step Stagger loop: Implicit coupling of various fields in time loop Number of stagger iterations determined by convergence of load transfer or max stagger iterations Field loop: Field solution with specific solution options Load transfer to a particular field occurs before solution of the field Dissimilar mesh across surface/ volume interface between fields Time Loop End Time Loop Stagger Loop End Stagger Loop Field Loop ( i=1,n) End Field Loop Physics Field 1 Physics Field 2 Physics Field n

23 23 Multiphysics 8.0 Customer /30/04 Multi-field Solver- Physics Loads PHYSICS Physics Loads Transferred in Field Loop SENDRECEIVE CFDHeat flux, Forces, Temperatures Displacement, Velocity, Temperature, Heat rate, Forces THERMAL Temperature, heat flux Temperature, Heat flux, Heat rate, Displacement STRUCTURALDisplacement, VelocityForces, Temperature, Displacement MAGNETICForces, Heat rateTemperature, Displacement ELECTRICForces, Heat rateTemperature, Displacement High Frequency ELECTROMAGNETIC Heat RateTemperature, Displacement

24 24 Multiphysics 8.0 Customer /30/04 Multi-field Solver – Multi-user deployment No need for a super user to handle all physics, separate physics can be processed by individual analysis experts in the company: Intra-Company Resource Multi-fieldAnalysis CAD Model Physics 1 Engineer e.g. CFD Model pre processing (loads, boundary conditions & mesh) Physics 2 Engineer e.g. Electromagnetics Model pre processing (loads, boundary conditions & mesh) Physics 3 Engineer e.g. Structural Model pre processing (loads, boundary conditions & mesh) Physics 4 Consultant Engineer e.g. HF electromagnetics Model pre processing (loads, boundary conditions & mesh)

25 25 Multiphysics 8.0 Customer /30/04 CFD CDB File Electromagnetics CDB fileStructural CDB file HF Emag CDB file Multi-field Solver – Multi-user deployment Each physics has its own CDB and results (*.R*) file. Solid Model Physics 1 e.g. CFD Model pre processing (loads, boundary conditions & mesh) Physics 2 e.g. Electromagnetics Model pre processing (loads, boundary conditions & mesh) Physics 3 e.g. Structural Model pre processing (loads, boundary conditions & mesh) Physics 4 e.g. HF electromagnetics Model pre processing (loads, boundary conditions & mesh) Field1.RFL Results FileField2.RMG Results fileField3.RST Results file Field4.RMG Results file Multi-field Solver

26 26 Multiphysics 8.0 Customer /30/04 Multi-field Solver - dissimilar mesh interface Example of dissimilar mesh between physics: CFD mesh: 600,000 elements (Fluid region not shown) Thermal-mechanical mesh: 15,000 elements

27 27 Multiphysics 8.0 Customer /30/04 Multi-field Solver- Summary Physics is treated as a "field" with an independent model & mesh Each field is defined by a group of element types Load transfer regions are identified by surfaces and/or volumes Sequential (Load vector) coupling between fields Each field may have: – Different analysis types – Different solvers and analysis options – Different mesh descretization Each field can be imported from an external solver (e.g. CFX) Surface load transfer across fields Volumetric load transfer across fields Automated morphing of non-structural elements Independent results files for each field

28 28 Multiphysics 8.0 Customer /30/04 Multi-field Solver- Physics & Applications Multi-Field Coupled Solver - Physics Applications/ Markets Thermal-Structural Anything with a structure! Gas turbines. Electromagnetic-thermal Induction heating, RF heating Electrostatic-Structural - Fluidic: MEMS Electrostatic – Charged particle Ion Optics, Field Emission Display Technology, Analytical instruments Magnetic – Structural - Thermal Solenoids, electromagnetic machines, Bus bars Fluid-Solid: FLOTRAN based FSI CFX-ANSYS unidirectional interface Aerospace, automotive fuel, hydraulic systems, fluid bearing, MEMS fluid damping, drug delivery pumps, heart valves. Thermal – CFD Electronics cooling, engines Magnetic - CFD MR fluids, Ferro-fluidics, automotive Third Party/External Product coupling: Sigfit: Unidirectional, Structural – Optical MpCCI: Bi-directional FSI Automotive lighting, astronomy, any optical instruments

29 29 Multiphysics 8.0 Customer /30/04 Multi-field Solver- Benefits Provides an easy to use framework to solve coupled field problems in ANSYS Multiphysics Ability to sequentially couple any number of physics fields Applicable across all physics available in ANSYS Multiphysics Multiple field specification with different solution option for each field – Analysis type (Transient/Static/Harmonic) – Solver options – Material & geometric non-linearity Automated surface and volume load transfer across dissimilar mesh Automated Morphing of field elements Unidirectional coupling between CFX and ANSYS Multiphysics Unidirectional coupling between third party solvers and ANSYS Multiphysics Provides analysis opportunities in many new market areas where there have previously been no solutions.

30 30 Multiphysics 8.0 Customer /30/04 Multi-field Solver- RF Attenuator Example RF/microwave energy is attenuated through resistive losses in a Nichrome film attached to the microstripline waveguide. The energy is lost in the form of heat which is conducted both through the devices ceramic substrate and top insulating surface film. Solid Model: RF waveguide Ceramic substrate Nichrome film Image from KDI data sheet. Typical Packaged Device:

31 31 Multiphysics 8.0 Customer /30/04 Multi-field Solver- RF Attenuator Example HF Emag mesh: 98,175 elements Thermal Mesh: 6,600 elements Thermal Physics Field 2 Heat generation rate HF Emag Physics Field 1 High-Frequency electromagnetic coupled to a steady-state thermal analysis:

32 32 Multiphysics 8.0 Customer /30/04 Multi-field Solver- RF Attenuator Example E-field H-field Resultant temperature Analysis results:

33 33 Multiphysics 8.0 Customer /30/04 Multi-field Solver- MEMS RF Switch Example Transient response of MEMS RF Switch to a pulsed voltage excitation: Beam support post Ground electrode Beam electrode Substrate Perforation holes to control fluid damping

34 34 Multiphysics 8.0 Customer /30/04 Multi-field Solver- MEMS RF Switch ExampleMulti-fieldAnalysis Physics 1: Mechanical Engineer Mesh solid model of switch Mesh solid model of switch Apply clamped BC’s Apply clamped BC’s Perform squeeze-film damping analysis using FLUID136, FLUID138. Perform squeeze-film damping analysis using FLUID136, FLUID138. Prepare structural dynamics analysis run Prepare structural dynamics analysis run Physics 2: Electronics Engineer Create Air mesh around switch Create Air mesh around switch Apply voltage BC’s Apply voltage BC’s Prepare electrostatics analysis run Prepare electrostatics analysis run Write CDB file Write CDB file CAD Model MFIMPORT Each physics model is prepared independently:

35 35 Multiphysics 8.0 Customer /30/04 Multi-field Solver- MEMS RF Switch Example Electrostatics Physics Field 2 Displacement, Forces Mechanical Physics Field 1 Structural mesh: 1894 elements Electrostic mesh: 16,353 elements Transient, dynamic electrostatics coupled to mechanical analysis:

36 36 Multiphysics 8.0 Customer /30/04 Multi-field Solver- MEMS RF Switch Example Displacement of switch mid-plane Under pulse voltage excitation Analysis Results:

37 37 Multiphysics 8.0 Customer /30/04 Multi-field Solver Example: CFX Imported field Gas turbine with internal cooling example: Unidirectional coupling between CFX and ANSYS CFX performs conjugate heat transfer fluid solution. CFX writes an ANSYS CDB file containing surface forces, volumetric temperatures; defining an “external field” for the multifield solver ANSYS interpolates CFX results onto the ANSYS FE mesh ANSYS solves the thermal-stress analysis Makes use of Cyclic symmetry (113 blades!)

38 38 Multiphysics 8.0 Customer /30/04 ANSYS Internal Physics Field External Physics Field Multi-field Solver Example: CFX Imported fieldStructural Physics Field 2 Volumetric Temperatures Interpolated Volumetric Temperature Surface Forces Interpolated Surface Forces Details of field stagger loop: CFX Model Physics Field 1

39 39 Multiphysics 8.0 Customer /30/04 Multi-field Solver Example: CFX Imported field Imported field process: Create CFD model in CFX-build, Pre-process and Solve Conjugate HT problem in CFX-solve. Use the export utility in CFX-Post create a ANSYS CDB file CDB file has SUR152/154 elements with force loads and SOLID70 with temperatures derived from CFX mesh. Create solid region in ANSYS Multiphysics and mesh for thermal-stress analysis Apply boundary conditions (Omega loading, cyclic symmetry) Read in the cdb file from CFX via the MFIMport command Create the fluid solid (FSIN) interfaces via SF command for the surface Forces Create the solid-solid volumetric (FVIN) interface via BFE command for the temperatures User defines solid region as "field2" and fluid (CFX) region as "field1" ANSYS 8.0 multi-field stagger loop algorithm is used to transfer loads from "field2“ mesh to "field1 mesh and then solves the thermal-stress analysis."

40 40 Multiphysics 8.0 Customer /30/04 Multi-field Solver Example: CFX Imported field Field 1: CFD Results Pressure Streamlines Temperature

41 41 Multiphysics 8.0 Customer /30/04 Multi-field Solver Example: CFX Imported field Field 2: Thermal Mechanical Results Displacement Equivalent stress (SEQV) Temperature

42 42 Multiphysics 8.0 Customer /30/04 CFX can export the following to ANSYS Multiphysics – At surfaces Nodal heat flux Nodal forces – Within Solid volumes Nodal temperatures CFX loads can be read only with the ANSYS Multiphysics Multi- field Solver CFX5 export – Stand-alone CFXExport executable available for CFX5.6 customers – ANSYS CDB file created from CFX results files – Works with ANSYS Multiphysics 8.0 and the Multifield solver Multi-field Solver: CFX support

43 43 Multiphysics 8.0 Customer /30/04 Topics Covered What is Multiphysics? Multiphysics Benefits Educational Products Market Applications – Market segments by Technology – Market Segments by Industry Multi Field (Coupled Physics) Capabilities Direct physics coupling Sequential physics coupling Multi-field Solver (New feature at release 8.0) Other New features Enhanced non-linear Piezoelectric & piezoresistive elements. Direct coupled piezoresistive elements Fluid damping elements Cyclic Symmetry for Magnetostatics Low Frequency Electromagnetic Contact Coupled E-B Particle Tracing Re-meshing for FSI Selected Multi-Physics Examples Product Roadmap & Strategy – Transition to Workbench Environment Product Websites

44 44 Multiphysics 8.0 Customer /30/04 Series 22X elements bring consistency and ease of use to our direct coupled physics: Capabilities – New material models and coupled-field effects – More special features and loads Consistency – Flexible setting of DOFs and reactions - controlled by KEYOPT(1) – Element shapes and orders - match our 18X solid structural elements – Load labels - CHRG vs AMPS – Large deflection capability - available for ALL analyses with structural DOFs New code architecture – Use existing / enhanced ‘core’ legacy elements as building blocks – Inherit the functionality of ‘core’ elements - material models, loads, special features. – Calculate directly coupled-field effects inside the element. – Facilitates infrastructure to rapidly deploy additional directly coupled physics. Direct Coupled-Field Elements - Benefits

45 45 Multiphysics 8.0 Customer /30/04 Series 22X Coupled Field Elements Higher order solid elements for – Piezoelectric analysis – Piezoresistive analysis Applications – Pressure transducers – Sensors – Accelerometers – Microphones Elements – PLANE223 2-D 8-Node Quad – SOLID226 3-D 20-Node Brick – SOLID227 3-D 10-Node Tetrahedral Couples to CIRCU124 – Can build Wheatstone bridge etc Images courtesy Endevco & Fujikura. Acceleration R1 R2 R4 R3 Force

46 46 Multiphysics 8.0 Customer /30/04 Coupled Field Piezoresistive Element Strain gauge accelerometer principle of operation: Proof mass R1R2R3R4 R1 R2 R3 R4 Acceleration Force R1 R2 R4 R3 Acceleration Force Piezoresistors R1 normal compression tension piezo-resistor color key Support Frame

47 47 Multiphysics 8.0 Customer /30/04 Coupled Field Piezoresistive Element Four Piezoresistor elements Beam Strain gauge accelerometer analysis example: Accelerometer uses four piezoresistive sensors per beam in a Wheatstone Bridge configuration. Objective is to compute Output voltage and sensitivity with 5 V DC excitation. SOLID95 for mass, frame, and beam SOLID226 for Piezoresistors Voltage coupling used to create Wheatstone bridge. Frame Proof Mass Detail of beam:

48 48 Multiphysics 8.0 Customer /30/04 Coupled Field Piezoresistive Element Analysis results for 1 G acceleration load: Stress in beam: MPa Differential voltage in bridge: 2.79 mV Sensitivity: 2.84e-4 Vsec 2 /m Axial stress contour plots:

49 49 Multiphysics 8.0 Customer /30/04 Damping Elements for Thin Film Applications FLUID D 4 or 8 node squeeze film fluid element FLUID D 2 node viscous fluid link element FLUID or more node slide film damper Applicable to MEMS or macro devices where damping attributed to thin films/ air gaps is required. “KEYOPTS” control the flow regime: Continuum, High Knudsen numbers etc. The fluid environment is defined by a set of real constants. For FLUID136 & FLUID138: The elements are added to the structure and a static analysis is used to determine the damping effects at low frequencies, and a harmonic analysis is used to determine the stiffening and damping effects at high frequencies. The DMPEXT command is used to extract frequency dependent damping parameters for use with the MDAMP, DMPRAT, ALPHAD, and BETAD commands for use in structural dynamics analysis with correct damping. Accurately extract ALPHA and BETA Rayleigh damping terms for a transient analysis.

50 50 Multiphysics 8.0 Customer /30/04 Damping Elements for Thin Film Applications FLUID 136: Models viscous fluid flow behavior in small gaps between fixed surfaces and structures moving perpendicular to the fixed surfaces. Used to determine the stiffening and damping effects that the fluid exerts on the moving structure. Based on the Reynolds squeeze film theory and the theory of rarefied gases. A static analysis is used to determine the damping effects at low frequencies. A harmonic analysis is used to determine the stiffening and damping effects at high frequencies. The DMPEXT command is used to extract frequency dependent damping parameters for use with the MDAMP, DMPRAT, ALPHAD, and BETAD commands for use in structural dynamics analysis with correct damping. Accurately extract ALPHA and BETA Rayleigh damping terms for a transient analysis.

51 51 Multiphysics 8.0 Customer /30/04 Damping Elements for Thin Film Applications FLUID 138: Models the viscous fluid flow behavior through short channels (i.e., holes) in microstructures moving perpendicular to fixed surfaces. Can be used in conjunction with FLUID136 elements to determine the stiffening and damping effects that the fluid exerts on the moving perforated microstructure. Assumes isothermal flow at low Reynolds numbers. Accounts for gas rarefaction effects and fringe effects due to the short channel length. Can be used to model either continuous or high Knudsen number flow regimes. Applicable to static, harmonic, and transient analyses. FLUID 139: 139 is a combination of Couette (low frequency) and Stokes flow (inertial effects at high frequency). The viscous flow between surfaces is represented by a series connection of mass- damper elements whereby each node corresponds to a local fluid layer Applicable to large deflection.

52 52 Multiphysics 8.0 Customer /30/04 Damping Elements for Thin Film Applications Damping low frequencies represents fluid displacement effects Squeeze or Spring higher frequencies represents compressible fluid effects Squeeze & damping constants:

53 53 Multiphysics 8.0 Customer /30/04 Automated using the DMPEXT command macro Damping Elements for Thin Film Applications Computing damping parameters for flexible bodies using the Modal Projection Technique: Build a structural and thin-film fluid model and mesh. Perform a modal analysis on the structure. Extract the desired mode eigenvectors. Select the desired modes for damping parameter calculations. Perform a harmonic analysis on the thin-film elements. Compute the modal squeeze stiffness and damping parameters. Compute modal damping ratio and squeeze stiffness coefficient. Display the results: MDPLOT.

54 54 Multiphysics 8.0 Customer /30/04 Damping Elements for Thin Film Applications Transient dynamic response of damped MEMS RF Switch: Viscous FEA Model of damping holes:

55 55 Multiphysics 8.0 Customer /30/04 Damping Elements – Application Example Results: Transient dynamic response of the switch to a pulsed voltage excitation. ALPHA and BETA damping parameters were obtained from a squeeze-film analysis of the structure

56 56 Multiphysics 8.0 Customer /30/04 MEMS Accelerometer harmonic response: Damping Elements – Application Example Pressure distribution at 20 Hz for design with no damping control holes in the plate. Pressure distribution at 100 Hz for design with matrix of damping control holes in the plate.

57 57 Multiphysics 8.0 Customer /30/04 MEMS Accelerometer harmonic frequency response 0.1 – 10 kHz Shows results of four design iterations: Damping Elements - Application Examples Initial design (no plate holes) is overdamped Final design (honeycomb plate) has flattest frequency response

58 58 Multiphysics 8.0 Customer /30/04 LF Electromagnetic Cyclic Symmetry Feature: Cyclic symmetry (periodicity) for Low Frequency Electromagnetics Commands: CYCLIC and CYCOPT Supports: PLANE13, PLANE53, SOLID96, SOLID5, SOLID98, SOLID117 Benefits: This new feature is applicable to 3D magnetic scalar potential (MSP), magnetic vector potential (MVP) and edge (SOLID117) formulations. These commands are also used for cyclic symmetry structural analyses results greater consistency across physics. Reduce FEA problem size & faster solution time by making use of symmetry. Market applications: Primarily rotating electromagnetic machines Electric motors Alternators Inductive ignition system sensors

59 59 Multiphysics 8.0 Customer /30/04 LF Electromagnetic Cyclic Symmetry Example: 4 pole variable reluctance machine reduced to 90 degree sector: B circumferential

60 60 Multiphysics 8.0 Customer /30/04 LF Electromagnetic Cyclic Symmetry

61 61 Multiphysics 8.0 Customer /30/04 Low Frequency Electromagnetic Contact Feature: Contact for Low Frequency Electromagnetic Commands: TARGET169, CONTAC171 Supports: PLANE13, PLANE53, SOLID96, SOLID5, SOLID98 Benefits: This new feature is applicable to 3D magnetic scalar potential (MSP), and 2D magnetic vector potential (MVP). A lot easier to use than constraint equations! Market applications: Electric motors Alternators Inductive ignition system sensors Linear Motion Systems Non Destructive Testing Eddy current braking systems

62 62 Multiphysics 8.0 Customer /30/04 Low Frequency Electromagnetic Contact Example: “In pipe” eddy current based sensor. Sensor slides down pipe detecting flaw in pipe wall. B-field contours Pipe Sensor

63 63 Multiphysics 8.0 Customer /30/04 Ion Optics Enhancements Ion Optics - An important feature for the SEMICON and Analytical instrument markets: Particle tracing is a post processing feature. Can trace charged particle in either a electrostatic field or magnetostatic field or both. Particles initial conditions definable are: – Mass – Charge – Starting coordinates (x,y,z) – Velocity vector (Vx,Vy,Vz) Can define 50 particles per run. Particle trajectory can be plotted in 2D/3D or listed. Space charge effects are not accommodated. No relativistic effects (velocity is much smaller than speed of light).

64 64 Multiphysics 8.0 Customer /30/04 Ion Optics Enhancements Example of a particle trace through homogenous magnetic field, with a changing electric field. Animation is a composite of static cases

65 65 Multiphysics 8.0 Customer /30/04 Ion Optics Enhancements Example of a particle trace on a charged particle trace! PLTRACE command used to slide “visualization particles” along the charged particle trajectories.

66 66 Multiphysics 8.0 Customer /30/04 FSI – Remeshing Enhancements Coupled fluid-solid (FSI) meshing capability enhanced to handle applications with large boundary/domain changes. This feature opens up a broader range of FSI market applications: Solid can undergo large deformation or complete rotations. E.g.. Pumps or stirrers. Detached solid object movement through fluid. Enhancements: Moving boundary problem is re-meshed when mesh becomes badly distorted or ALE mesh morphing scheme fails. Improved accuracy when the mesh is distorted by ALE mesh moving scheme Regenerates a new mesh from a selected element group. – All element based loads (e.g. FSI interface) are updated – Body loads on the interior nodes are updated Nodal values are interpolate from old mesh to new mesh Redesigned FLOTRAN result files, creates new rfl file for each remesh Animation is possible across multiple result files (anmres)

67 67 Multiphysics 8.0 Customer /30/04 FSI – Remeshing Enhancements New Commands: FLDATA39, REMESH, Label, Value ANMRES, Delay, Min, Max, Inc, Autocntrky, Freq, ’rfl’ Limitations: Must keep the same topology for surface (boundary) elements. Applicable to triangle (2D) and tetrahedral (3D) elements Example: Rigid body rotation, a flap valve in a tube:

68 68 Multiphysics 8.0 Customer /30/04 FSI – Remeshing Enhancements Cylinder passing through a channel:

69 69 Multiphysics 8.0 Customer /30/04 Topics Covered What is Multiphysics? Multiphysics Benefits Educational Products Market Applications – Market segments by Technology – Market Segments by Industry Multi Field (Coupled Physics) Capabilities Direct physics coupling Sequential physics coupling Multi-field Solver (New feature at release 8.0) Other New features Enhanced non-linear Piezoelectric & piezoresistive element. Fluid damping elements Cyclic Symmetry for Magnetostatics Low Frequency Electromagnetic Contact Coupled E-B Particle Tracing Re-meshing for FSI Selected Multi-Physics Examples Product Roadmap & Strategy – Transition to Workbench Environment Product Websites

70 70 Multiphysics 8.0 Customer /30/04 Selected Multiphysics Thermal-structural coupling Needed for any product subjected to changes in temperature! – Engines, gas turbines, heat exchangers – Electronic components, package solder joints – Cryogenic components and systems – Test & Measurement Equipment HeatTransfer SolidMechanics

71 71 Multiphysics 8.0 Customer /30/04 Thermal Structural Example BGA IC Package differential thermal expansion Image courtesy of MCR.

72 72 Multiphysics 8.0 Customer /30/04 Selected Multiphysics Thermal-Fluid Coupling (Conjugate heat transfer) – Heat is transferred between fluid and solid – Convection effects. – Forced flow. Applications: – Heat exchangers – Electronics device/enclosure temperature management HeatTransfer FluidMechanics

73 73 Multiphysics 8.0 Customer /30/04 Conjugate Heat Transfer Example Vertical heat sink

74 74 Multiphysics 8.0 Customer /30/04 Selected Multiphysics Electro- Thermal Coupling – Resistive (Joule) heating Electro-Thermal-Structural coupling – Resistive (Joule) heating resulting in thermal expansion Needed for many electronic power handling components and systems. – Current-carrying conductors, bus bars – Electric motors, generators, transformers – Electronic components and systems – Actuators HeatTransfer SolidMechanics Electricity

75 75 Multiphysics 8.0 Customer /30/04 Electro-Thermal-Structural Example Current DensityElectrical PowerThermal Stress Images courtesy of Atila Mertol, LSI Logic. Detail of Integrated Circuit via & aluminum trace

76 76 Multiphysics 8.0 Customer /30/04 Selected Multiphysics Electrostatic – Structural coupling – Piezoelectric effect Electrostatic-structural-Fluid Coupling – Electrostatic actuated structures incorporating effects of fluid damping. The entire MEMS Industry is based on these physics! – Resonators/Actuators – Electro-mechanical band pass filters – Inertial sensors (Accelerometers & gyroscopes) – Inkjet printer heads SolidMechanics FluidMechanics Electrostatic

77 77 Multiphysics 8.0 Customer /30/04 MEMS Micromirror Example

78 78 Multiphysics 8.0 Customer /30/04 Selected Multiphysics Electromagnetic-Thermal coupling – Eddy current losses (LF Emag) – Resistive & dielectric losses (HF Emag) Applications: – Required by those that want heat or those that want to minimize it! – Induction heating systems (LF Emag) Heat treating processes Pre-heating for metal forming operations – RF Microwave systems (HF Emag) Heaters Attenuators HeatTransfer Electro-magnetics

79 79 Multiphysics 8.0 Customer /30/04 Induction Heating Example –Solid model meshed –Current in coil –Induced current in plate –Resultant B-Field

80 80 Multiphysics 8.0 Customer /30/04 Induction Heating Example –Joule heating –Time averaged joule heating thermal load –Resultant temperature

81 81 Multiphysics 8.0 Customer /30/04 Selected Multiphysics Electromagnetic - Fluid coupling Applications – Magneto-Rheological (MR) devices Active structure vibration damping systems Automotive & biomedical actuators – Induction furnaces for stirring molten metals – MHD power systems, EHD pumps FluidMechanicsElectro-magnetics

82 82 Multiphysics 8.0 Customer /30/04 Electromagnetic - Fluid coupling Example A.C. Induction furnace: Electromagnetic field solution to compute Lorentz forces CFD analysis performed to determine stirring pattern within furnace core

83 83 Multiphysics 8.0 Customer /30/04 Selected Multiphysics Electromagnetic – Solid Coupling – Forces due to magnetic field move/interact with mechanical structures. – Magnetic force (linear systems) – Magnetic torque (rotary systems) Applications: – Actuators / Solenoids – Rotating machines Alternators Motors SolidMechanicsElectro-magnetics

84 84 Multiphysics 8.0 Customer /30/04 Moving Magnetic Probe Example 2D Axi-symmetric model using true moving object, sliding mesh boundary Animation of flux lines when V = 0.4 m/s

85 85 Multiphysics 8.0 Customer /30/04 Magnetic Levitation Example Flux lines and levitation coil currents:

86 86 Multiphysics 8.0 Customer /30/04 Rotating Machine Examples Images courtesy of CAD-FEM GmbH.

87 87 Multiphysics 8.0 Customer /30/04 Selected Multiphysics Thermal-Solid-Electromagnetic Coupling – Thermal-mechanical dimensional changes coupled into HF Emag or LF Emag analysis. Many applications require knowledge of the effects of temperature on electromagnetic performance. HeatTransfer SolidMechanics Electromagnetics

88 88 Multiphysics 8.0 Customer /30/04 Waveguide Bend Electric 20 o C WaveguideDisplacement from o C Waveguide Bend Electric 60 o C 20 o C : S 11 = , S 12 = o C : S 11 = , S 12 = Thermal-Solid-Electromagnetic Coupling Example Thermal Effects on microwave wave guide

89 89 Multiphysics 8.0 Customer /30/04 Selected MultiphysicsSolidMechanics Viscous Fluid Mechanics Coupled Fluid – Solid (Fluid Solid Interaction, FSI) – Fluid pressure deforms mechanical structure which in turn effects fluid flow. May also include heat transfer. Applications – Aero-elastic problems – Hydraulic / Pneumatic / Fuel systems – Fluid pumps – Biomedical Blood flow – elastic artery Heart valves

90 90 Multiphysics 8.0 Customer /30/04 FSI Example – Pressure Limiting Valve 0.25 mm Ø 2.4 mm Ø 4.0 mm Ø 4.5 mm Ø 10.0 mm 55º Pressure-limiting valves are used in anti-lock brake systems – Huge liability ramifications Per VDO, tiny geometric design changes cause wide variations in valve response and performance Without FSI VDO was guessing on new valve designs. FSI analysis significantly reduces overall time to market and improve reliability. Courtesy : Siemens VDO

91 91 Multiphysics 8.0 Customer /30/04 FSI Example – Pressure Limiting Valve Mesh detail & dissimilar mesh for solid & fluid Courtesy : Siemens VDO

92 92 Multiphysics 8.0 Customer /30/04 FSI Example – Results Courtesy : Siemens VDO

93 93 Multiphysics 8.0 Customer /30/04 FSI Example – Results Courtesy : Siemens VDO Ball displacement time history, f  875 Hz

94 94 Multiphysics 8.0 Customer /30/04 Selected Multiphysics Inviscid fluid-structural coupling (FSI) – Longitudinal pressure wave travels through fluid causing displacement of solid structure. Applications (Primarily acoustics): – Loudspeaker design – Microphone – Sonar / ultrasonics Inviscid Fluid Mechanics SolidMechanics

95 95 Multiphysics 8.0 Customer /30/04 Acoustics Example Response of axisymmetric disc in tube to plane wave.

96 96 Multiphysics 8.0 Customer /30/04 Topics Covered What is Multiphysics? Multiphysics Benefits Educational Products Market Applications – Market segments by Technology – Market Segments by Industry Multi Field (Coupled Physics) Capabilities Direct physics coupling Sequential physics coupling Multi-field Solver (New feature at release 8.0) Other New features Enhanced non-linear Piezoelectric & piezoresistive element. Fluid damping elements Cyclic Symmetry for Magnetostatics Low Frequency Electromagnetic Contact Coupled E-B Particle Tracing Re-meshing for FSI Selected Multi-Physics Examples Product Roadmap & Strategy – Transition to Workbench Environment Product Websites

97 97 Multiphysics 8.0 Customer /30/04 Product Roadmap - Overview Target markets: Actuator and Sensors Low Frequency (Actuators and electric machines) MEMS High Frequency (RF) devices Biomedical - FSI Short/Medium Term (< 2 years): – Release 8.1/9.0 ROM140 (Damping counterpart to ROM144) Publish ROM database format & provide additional ports on ROM144 for drive variable LinkCAD for ANSYS Process Emulator module CFX ANSYS integration Longer Term (2 - 3 years): – Products and technology migrated to ANSYS Workbench Environment. – CFX will take FLOTRAN’s place in the ANSYS Workbench Environment. – MEMS coupled analysis capability in Workbench Environment.

98 98 Multiphysics 8.0 Customer /30/04 Roadmap – Transition to Workbench Objective is to migrate ALL physics technology to Workbench We will not to develop standalone physics products….Products and physics will instead be more modular and controlled through licensing. Strategy is to migrate and expose technology into the ANSYS Workbench Environment creating a general purpose product applicable to a broad range of markets. Order of physics exposure is: – LF Emag – CFD (CFX technology) – HF Emag – Advanced Physics

99 99 Multiphysics 8.0 Customer /30/04 Topics Covered What is Multiphysics? Multiphysics Benefits Educational Products Market Applications – Market segments by Technology – Market Segments by Industry Multi Field (Coupled Physics) Capabilities Direct physics coupling Sequential physics coupling Multi-field Solver (New feature at release 8.0) Other New features Enhanced non-linear Piezoelectric & piezoresistive element. Fluid damping elements Cyclic Symmetry for Magnetostatics Low Frequency Electromagnetic Contact Coupled E-B Particle Tracing Re-meshing for FSI Selected Multi-Physics Examples Product Roadmap & Strategy – Transition to Workbench Environment Product Websites

100 10 0 Multiphysics 8.0 Customer /30/04 Product Websites

101 10 1 Multiphysics 8.0 Customer /30/04 Product Websites – FSI & MEMS

102 10 2 Multiphysics 8.0 Customer /30/04 The End! Acknowledgements: – Dale Ostergaard – Barry Christenson – Deepak Ganjoo – Ray Browell – Bill Bulat – Achuth Rao – Stephen Scampoli – Daniel Shaw – Mark Troscinski – Miklos Gyimesi – CAD-FEM GmbH


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