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MonolithIC 3D  Inc. Patents Pending 1 Monolithic 3D-IC Re-Inventing Wafer Scale Integration The Cubic IC System ~ 100X Advantage.

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Presentation on theme: "MonolithIC 3D  Inc. Patents Pending 1 Monolithic 3D-IC Re-Inventing Wafer Scale Integration The Cubic IC System ~ 100X Advantage."— Presentation transcript:

1 MonolithIC 3D  Inc. Patents Pending 1 Monolithic 3D-IC Re-Inventing Wafer Scale Integration The Cubic IC System ~ 100X Advantage

2 3D Brain vs. 2D IC (1:3,000) Jack Sun, vice president of R&D and chief technology officer at TSMC, said “to solve challenges associated with power constraint, the chip industry must "get some inspiration from the amazing human brain.” Sun said “the human brain has about 100 billion neural cells, equivalent to about 1 trillion IC transistors, yet draws only about 20 watts of power. By contrast, an advanced IC with 3 billion logic cells draws about 200 watts of power,” Panel debates keeping up with 'Gene's Law' Dylan McGrath 2/21/ :01 PM EST

3 Monolithic 3D to Enable Redundancy/Repair “Wafer” scale integration (Folded in 3D for Shorter Interconnect) Ultra High complexity with Ultra High Yield, Leveraging 3D Repair/Redundancy + Transient Error Detection and Isolation

4 Possible “Wafer” Scale 3D Integration Advantage  ~10X Advantage of 3D WSI vs. Board Level  ~10X Advantage of 3D WSI vs. Rack Level  ~10X Advantage of 3D WSI vs. Server Farm Level Overall, ~1000x advantage possible, all due to shorter wires... Instead of placing chips on different packages, boards and racks, we integrate on the same stacked chip

5 Cost of Defect Charles Chiang, Jami Kawa Design for Manufacturability and Yield for Nano-Scale CMOS ISBN

6 Repair  Monolithic 3D wafer where:  All primary output are also wired to top layer  All F/F input are switchable to be fed from top layer  Full test in the fab – preferably contact less  Reconstruction of any failed logic-cone at the top layer by Direct Write eBeam  Switch F/F input to be fed from the top layer

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8 Redundancy  Monolithic 3D wafer where:  Each layer is overlaid with identical layer  All primary output are exchangeable with the upper layer  All F/F input are switchable to be fed from upper layer  Self test  In the fab – preferably contact less  In the field  Replace any failed section with the one overlaid it.

9 A Novel Redundancy Scheme for Logic, Analog, …  Swap at logic cone granularity.  Redundant logic cone/block directly above, so no performance penalty.  Negligible design effort, since redundant layer is exact copy.

10 Redundancy

11 Transient Error Detector  Use the redundancy to detect transient error  Transient error could caused enormous problem – “Toyota run- away” and could not be detected by current BIST  Compare the output of the two corresponding F/F and latch the error

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