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Screening for Counterfeit Electronics Components Glenn Robertson Stephen Schoppe Process Sciences, Inc. Leander, Texas 512.259.7070www.process-sciences.com.

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Presentation on theme: "Screening for Counterfeit Electronics Components Glenn Robertson Stephen Schoppe Process Sciences, Inc. Leander, Texas 512.259.7070www.process-sciences.com."— Presentation transcript:

1 Screening for Counterfeit Electronics Components Glenn Robertson Stephen Schoppe Process Sciences, Inc. Leander, Texas 512.259.7070www.process-sciences.com

2 Outline Introduction Introduction Authentication Test Procedures Authentication Test Procedures Examples Examples Conclusion Conclusion

3 Introduction Nature and Scope of Problem Nature and Scope of Problem A growing (and high-profit) industryA growing (and high-profit) industry Related to -Related to - Globalization Globalization Product Cost Product Cost High Demand/Scarcity High Demand/Scarcity Obsolescence Obsolescence “Spotty” laws and enforcement “Spotty” laws and enforcement

4 Introduction Nature and Scope of Problem Nature and Scope of Problem Includes all types of products, such as:Includes all types of products, such as: Pharmaceuticals Pharmaceuticals Auto parts Auto parts Phones/batteries Phones/batteries Golf Clubs Golf Clubs Power Tools Power Tools Elevators Elevators Electronic components Electronic components And many more… And many more…

5 Introduction Nature and Scope of Problem Nature and Scope of Problem What are counterfeit electronics?What are counterfeit electronics? Misrepresented partsMisrepresented parts Wrong parts (altered P/N) Wrong parts (altered P/N) Wrong date code Wrong date code Consumer grade remarked as military grade Consumer grade remarked as military grade Reclaimed parts Reclaimed parts Manufacturing defects/surplus production Manufacturing defects/surplus production “Reverse Engineered” copies “Reverse Engineered” copies

6 Introduction Risk Reduction by Supply Chain Management Risk Reduction by Supply Chain Management Careful supply chain management will always be the first line of defenseCareful supply chain management will always be the first line of defense Purchase from franchised distributorsPurchase from franchised distributors Screening inspection (Authentication) for high-risk componentsScreening inspection (Authentication) for high-risk components Parts from “Grey Market” distributors Parts from “Grey Market” distributors High Value/Scarce High Value/Scarce Obsolete Obsolete

7 Introduction Authentication Procedure(s) Developed for Screening High-Risk Components Authentication Procedure(s) Developed for Screening High-Risk Components Non-DestructiveNon-Destructive DestructiveDestructive

8 Authentication Procedures

9 Non-Destructive Non-Destructive Component Database ComparisonComponent Database Comparison Visual TestingVisual Testing X-ray InspectionX-ray Inspection X-ray Fluorescence (Lead Finish, RoHS screen)X-ray Fluorescence (Lead Finish, RoHS screen) Electrical TestingElectrical Testing Destructive Destructive Chemical DecapsulationChemical Decapsulation Mechanical DeliddingMechanical Delidding

10 Information Sources Information Sources “Golden” Part“Golden” Part Manufacturers’ Data SheetsManufacturers’ Data Sheets OCMs OCMs Distributors Distributors Other sources (e.g., customer, PSI files) Other sources (e.g., customer, PSI files) Date Code historiesDate Code histories Company historiesCompany histories Chip suppliers Chip suppliers Mergers, name changes, plant closings/relocations Mergers, name changes, plant closings/relocations Prior screening history at PSIPrior screening history at PSI Component Information Database

11 Visual Testing Verify Correct P/N Verify Correct P/N Verify Date Code Against Database Verify Date Code Against Database Compare Font and Symbology Against “Golden” Part if Available Compare Font and Symbology Against “Golden” Part if Available

12 Visual Testing Inspect package for: Inspect package for: BlacktoppingBlacktopping Sanding ScratchesSanding Scratches Discrepancies in Surface TextureDiscrepancies in Surface Texture

13 Visual Testing Marking Permanency Test (MPT) Marking Permanency Test (MPT) Mineral Spirits (JEDEC Mineral Spirits (JEDEC JESD22-B107C) MEK, Acetone, Alcohol MEK, Acetone, Alcohol Degradation of Markings Degradation of Markings Change in Surface Texture Change in Surface Texture Partial Removal of Coating Partial Removal of Coating

14 Visual Testing Inspect Lead Condition Inspect Lead Condition Surface AppearanceSurface Appearance Check Straightness and CoplanarityCheck Straightness and Coplanarity Evaluate SolderabilityEvaluate Solderability

15 X-ray Inspection Chip size/count Chip size/count Wire bond count/pitch Wire bond count/pitch Flip chip bump count/pitch Flip chip bump count/pitch No need to open package No need to open package

16 X-ray Inspection

17 XRF Testing Provides rapid semi-quantitative elemental analysis Provides rapid semi-quantitative elemental analysis Typically used for: Typically used for: RoHS compliance screeningRoHS compliance screening Verify lead finishVerify lead finish Verify Pb presence where requiredVerify Pb presence where required

18 Electrical Testing Curve Tracer Curve Tracer Used primarily for discretes Used primarily for discretes Generates a characteristic curve for DUT Generates a characteristic curve for DUT Plots voltage or current response vs. voltage or current stimulus Plots voltage or current response vs. voltage or current stimulus Detects shorts, opens, high leakage current Detects shorts, opens, high leakage current

19 Chemical Decapsulation Used on epoxy packages Used on epoxy packages Acid etching most common Acid etching most common

20 Mechanical Delidding Metal or ceramic packages Metal or ceramic packages Diamond saw or Dremel Diamond saw or Dremel Lid pry-off Lid pry-off

21 Verification Examples

22 Lambda Discrete TO Transistor 1 “Gold” part, 2 to be tested 1 “Gold” part, 2 to be tested Passed visual inspection and MPT Passed visual inspection and MPT Si Chip Visible by X-ray Inspection Si Chip Visible by X-ray Inspection Bond wires not visible Bond wires not visible

23 Lambda Discrete TO Transistor Screening by Curve Tracer Screening by Curve Tracer One Faulty Component Quickly IdentifiedOne Faulty Component Quickly Identified Base to EmitterEmitter to Collector

24 Lambda Discrete TO Transistor De-lidding Results De-lidding Results No P/N or other markings on chipsNo P/N or other markings on chips Similar surface color and circuit artworkSimilar surface color and circuit artwork Conclusion: both samples genuine, with one electrical failureConclusion: both samples genuine, with one electrical failure

25 Altera Ceramic DIP Two Packages to be tested Two Packages to be tested Visual Inspection Visual Inspection No evidence of tamperingNo evidence of tampering Markings passed permanency testMarkings passed permanency test

26 Altera Ceramic DIP Delidding to Examine Silicon Chip Delidding to Examine Silicon Chip Surface of chips virtually identicalSurface of chips virtually identical Close inspection shows “WaferScale” on chip 1 vs. “D” on chip 2Close inspection shows “WaferScale” on chip 1 vs. “D” on chip 2 Probably from different fab lines or different revisionsProbably from different fab lines or different revisions Chip 1 Close upChip 2 Close upFull Chip

27 Maxim 8-Pin DIP One package to be tested One package to be tested Visual Inspection Visual Inspection Markings Passed Permanency TestingMarkings Passed Permanency Testing Non-uniform Leads, Evidence of Re-tinningNon-uniform Leads, Evidence of Re-tinning

28 Maxim 8-Pin DIP Decapping Results Decapping Results Manufacturer Logo, Date Code, P/N IdentifiedManufacturer Logo, Date Code, P/N Identified chip date code = 1990, and chip ID = “1016”chip date code = 1990, and chip ID = “1016” Corresponds to earlier Linear Tech P/N LT1016Corresponds to earlier Linear Tech P/N LT1016 Component surface has been remarked to a MAX913, which is Maxim’s improved replacement for Linear Tech’s LT1016Component surface has been remarked to a MAX913, which is Maxim’s improved replacement for Linear Tech’s LT1016

29 Philips 68 Pin PLCC Two Packages to be Tested Two Packages to be Tested Visual Inspection Visual Inspection Same markings on each componentSame markings on each component Surface texture removed by solventSurface texture removed by solvent Parts were black-topped and remarkedParts were black-topped and remarked Component Top As-Received Component Top After Solvent Resistance Test

30 Philips 68 Pin PLCC Decapping Results Decapping Results Same marking on both chipsSame marking on both chips Corresponds with portion of external markingCorresponds with portion of external marking Purpose of remarking possibly to alter date code or P/N variantPurpose of remarking possibly to alter date code or P/N variant

31 Xicor 8-Pin DIP Two Packages to be Tested Two Packages to be Tested Visual Inspection Visual Inspection All markings removed by MPTAll markings removed by MPT Textured surface also removedTextured surface also removed Component Top As Received Component Top After MPT Solvent Test

32 Xicor 8-Pin DIP Decapping Results Decapping Results Same marking on both chipsSame marking on both chips Corresponds with external P/NCorresponds with external P/N Purpose of remarking possibly to alter date code or P/N variantPurpose of remarking possibly to alter date code or P/N variant Overall Photo of Chip Chip Markings Close-Up

33 Samsung 48-pin TSOP Two Packages to be Tested Two Packages to be Tested 64M x 8 Bit NAND Flash Memory 64M x 8 Bit NAND Flash Memory Visual Inspection Visual Inspection Laser-markedLaser-marked No Evidence of TamperingNo Evidence of Tampering Component Top As Received

34 Samsung 48-pin TSOP Decapping Results Decapping Results Same marking on both chipsSame marking on both chips P/N K9F5608U0A (as marked on chip) corresponds to 32M x 8 Bit NAND flash MemoryP/N K9F5608U0A (as marked on chip) corresponds to 32M x 8 Bit NAND flash Memory Components have been remarked as 64M NANDComponents have been remarked as 64M NAND Overall Photo of Chip Chip Markings Close-Up

35 Actel Ceramic PGA One Package to be Tested One Package to be Tested Passed MPT, No Signs of Tampering Passed MPT, No Signs of Tampering Top component markings Bottom component markings

36 Actel Ceramic PGA Alphanumeric and Mfg Logo Located on Chip Surface Alphanumeric and Mfg Logo Located on Chip Surface “21225” on chip matches package marking“21225” on chip matches package marking Many Actel chips produced by TI in 80sMany Actel chips produced by TI in 80s Actel acquired operations from TI in 1995Actel acquired operations from TI in 1995 No indication of counterfeitNo indication of counterfeit Chip Surface Top Edge Close-UpUpper Right Corner Close-Up

37 Micro Power Systems 48-pin SOIC Four Packages to be Tested Four Packages to be Tested Two each of date codes 9812 and 9751Two each of date codes 9812 and 9751 Passed MPT, No Signs of Tampering Passed MPT, No Signs of Tampering Date 9812 Top Markings Date 9812 Bottom Markings Date 9751 Top Markings Date 9751 Bottom Markings

38 Micro Power Systems 48-pin SOIC X-ray Inspection Results X-ray Inspection Results Lead frames identicalLead frames identical All bond wires intactAll bond wires intact X-ray Image - 9812 date code X-ray Image - 9751 date code

39 Micro Power Systems 48-pin SOIC Decapping Results Decapping Results Identical markings on all componentsIdentical markings on all components Chip Surface – Upper Right CornerChip Surface– Lower Right Corner

40 Micro Power Systems 48-pin SOIC Decapping Results Close-up Decapping Results Close-up Marked with Exar LogoMarked with Exar Logo Date Code 1996Date Code 1996 Exar acquired Micro Power Systems (M Logo) in 1994Exar acquired Micro Power Systems (M Logo) in 1994 Markings consistent with authentic partsMarkings consistent with authentic parts Markings Close-up – Lower Right Corner

41 Motorola Microwave Transistor 1 “Gold” part, 2 to be tested 1 “Gold” part, 2 to be tested Packages and markings identical Packages and markings identical

42 Motorola Microwave Transistor De-lidded Part Results De-lidded Part Results Package 3 chip has “MOT” and logoPackage 3 chip has “MOT” and logo Packages 1 and 2 are counterfeitPackages 1 and 2 are counterfeit Package 2 Package 1 Package 3

43 Conclusions Component Verification is Essential to Supply Chain Management Component Verification is Essential to Supply Chain Management Many Non-Destructive and Destructive Tests Available Many Non-Destructive and Destructive Tests Available Balance Verification Plan Against Assessment of Risk Balance Verification Plan Against Assessment of Risk

44 Thank You! Glenn Robertson glennr@process-sciences.com Stephen Schoppe sms@process-sciences.com


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