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Department of Electrical and Computer Engineering SDP team Yngvesson Ioan Tihenea Tomas Broka Dmitriy Stupak Sergey Derivolkov IR CARBON NANO- TUBE TRANCIEVER.

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Presentation on theme: "Department of Electrical and Computer Engineering SDP team Yngvesson Ioan Tihenea Tomas Broka Dmitriy Stupak Sergey Derivolkov IR CARBON NANO- TUBE TRANCIEVER."— Presentation transcript:

1 Department of Electrical and Computer Engineering SDP team Yngvesson Ioan Tihenea Tomas Broka Dmitriy Stupak Sergey Derivolkov IR CARBON NANO- TUBE TRANCIEVER

2 Department of Electrical and Computer Engineering Outline  Recap Design Overview  System Overview  Signal Processing Block (Transmitter End)  Transceiver  Signal Processing Block (Receiver End)  Suspension Method  Fabrication Techniques Used  Current Status and Group Breakup  Questions

3 Department of Electrical and Computer Engineering Recap Design Overview For our Senior Design Project we are working on creating a communication system that has two computer interface terminals, some signal processing at each end and an Infrared communication channel (transceiver) in the center. The key component to our SDP project is a Single Walled Carbon Nanotube (SWNT) thin film detector detecting IR radiation which changes the resistivity across it; this will be interpreted in binary values.

4 Department of Electrical and Computer Engineering Outline  Recap Design Overview  System Overview  Signal Processing Block (Transmitter End)  Transceiver  Signal Processing Block (Receiver End)  Suspension Method  Fabrication Techniques Used  Current Status and Group Breakup  Questions

5 Department of Electrical and Computer Engineering System Overview

6 Department of Electrical and Computer Engineering Outline  Recap Design Overview  System Overview  Signal Processing Block (Transmitter End)  Transceiver  Signal Processing Block (Receiver End)  Suspension Method  Fabrication Techniques Used  Current Status and Group Breakup  Questions

7 Department of Electrical and Computer Engineering Signal Processing Block (Transmitter End)  Microcontroller  IR LED and Circuitry  Silicon Laboratories  SiLabs C8051F340  USBXpress

8 Department of Electrical and Computer Engineering Outline  Recap Design Overview  System Overview  Signal Processing Block (Transmitter End)  Transceiver  Signal Processing Block (Receiver End)  Suspension Method  Fabrication Techniques Used  Current Status and Group Breakup  Questions

9 Department of Electrical and Computer Engineering Transceiver

10 Department of Electrical and Computer Engineering Outline  Recap Design Overview  System Overview  Signal Processing Block (Transmitter End)  Transceiver  Signal Processing Block (Receiver End)  Suspension Method  Fabrication Techniques Used  Current Status and Group Breakup  Questions

11 Department of Electrical and Computer Engineering Signal Processing Block (Receiver End)  Amplifier and Comparator  Circuitry for clean pulses  Microcontroller

12 Department of Electrical and Computer Engineering Outline  Recap Design Overview  System Overview  Signal Processing Block (Transmitter End)  Transceiver  Signal Processing Block (Receiver End)  Suspension Method  Fabrication Techniques Used  Current Status and Group Breakup  Questions

13 Department of Electrical and Computer Engineering Suspension Method  Fabrication of Supporting Washer  Electrical Contacts  Connecting SWCN Film to Supporting Washer

14 Department of Electrical and Computer Engineering Outline  Recap Design Overview  System Overview  Signal Processing Block (Transmitter End)  Transceiver  Signal Processing Block (Receiver End)  Suspension Method  Fabrication Techniques Used  Current Status and Group Breakup  Questions

15 Department of Electrical and Computer Engineering Fabrication Techniques Used  Plasma etching premade film Film was placed in oxygen plasma to etch down to required thickness.  Vacuum filtration method Pour CNT solution onto membrane and vacuum non- CNT liquid out. Then dissolve membrane.  Dry drop method Place electrical contacts on glass slides and putting drops of the CNT solution between them.

16 Department of Electrical and Computer Engineering SEM Image

17 Department of Electrical and Computer Engineering Outline  Recap Design Overview  System Overview  Signal Processing Block (Transmitter End)  Transceiver  Signal Processing Block (Receiver End)  Suspension Method  Fabrication Techniques Used  Current Status and Group Breakup  Questions

18 Department of Electrical and Computer Engineering Group Breakup Sergey Derivolkov, EE:  Designed the system overview and helped provide more efficient procedures for the fabrication. Also used SEM to take pictures of the NanoComp film and measured the thickness. Dmitriy Stupak, EE:  Designed the circuitry to test the film resistivity and the effects of IR radiation. He also joined Ioan during plasma etching procedure and used Profilometer to measure the thickness of the etched film. Tomas Broka, CSE:  Worked on fabrication procedure for the first couple films. Tomas also set up the website of the team and he is in charge of ordering components, equipment, and keeps contacts up to date through s and through the website. Also he worked with SEM to take images. Ioan Tihenea, EE:  Worked on plasma etching procedure for the film offered by NanoComp. He used Atomic Force Microscope (AFM) to take images of the films surface. He also was involved as well as Tomas in the fabrication.

19 Department of Electrical and Computer Engineering Outline  Recap Design Overview  System Overview  Signal Processing Block (Transmitter End)  Transceiver  Signal Processing Block (Receiver End)  Suspension Method  Fabrication Techniques Used  Current Status and Group Breakup  Questions

20 Department of Electrical and Computer Engineering Questions ?

21 Department of Electrical and Computer Engineering SiLabs C8051F340 Microcontroller 48 MIPS 8051 CPU 64 kB Flash memory 4352 B RAM USB 2.0 Integrated transceiver Integrated clock recovery 4 kB buffer RAM Full (12 Mbps), or low-speed operation Control endpoint plus six bi-directional endpoint pipes 10-bit, 200 ksps ADC Two asynchronous comparators Voltage reference Temperature sensor 40 Digital I/O


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