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Tadin for Process and Equipment Optimization May 2003Tadin Tal Advanced Instruments Ltd. www.tadin.com 1 The Ultimate Semiconductor Process and Machine.

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Presentation on theme: "Tadin for Process and Equipment Optimization May 2003Tadin Tal Advanced Instruments Ltd. www.tadin.com 1 The Ultimate Semiconductor Process and Machine."— Presentation transcript:

1 Tadin for Process and Equipment Optimization May 2003Tadin Tal Advanced Instruments Ltd. 1 The Ultimate Semiconductor Process and Machine Enhancement Tool Specific TadiGuard MRC-Eclipse Information TadiGuard

2 Tadin for Process and Equipment Optimization May 2003Tadin Tal Advanced Instruments Ltd. 2 Typical TadiGuard Eclipse Real-time Alarms: Missing Index (No rotation, double–process) Skipped Index (Skipped station, no process) All stations: Pod Pressure (Throttle valves failure) All targets: Current, Voltage Base Pressure (Ion Gauges) Wafer handling Etch: Forward Power, Reflected Power, Bias Many more

3 Tadin for Process and Equipment Optimization May 2003Tadin Tal Advanced Instruments Ltd. 3 Next, see typical TadiGuard Eclipse analysis screens TadiGuard’s most prominent contribution is its real-time watchdog features that cuts scrap, rework, maintenance, tests, test wafers, material, calibration, etc. With overall reduced Cost Of Ownership

4 Tadin for Process and Equipment Optimization May 2003Tadin Tal Advanced Instruments Ltd. 4 Sput :1 typical Pod Pressure, Voltage, Current, Date, Time, Recipe, Lot#

5 Tadin for Process and Equipment Optimization May 2003Tadin Tal Advanced Instruments Ltd. 5 Sput :2 typical Pod Pressure, Voltage, Current, Date, Time, Recipe, Lot#

6 Tadin for Process and Equipment Optimization May 2003Tadin Tal Advanced Instruments Ltd. 6 Sput :3 typical Pod Pressure, Voltage, Current, Date, Time, Recipe, Lot#

7 Tadin for Process and Equipment Optimization May 2003Tadin Tal Advanced Instruments Ltd. 7 Sput 1 Voltage / Current / Pod Press overlay (waterfall)

8 Tadin for Process and Equipment Optimization May 2003Tadin Tal Advanced Instruments Ltd. 8 Sput 3 Voltage trend, SPC X-chart. Number of wafers: 9934

9 Tadin for Process and Equipment Optimization May 2003Tadin Tal Advanced Instruments Ltd. 9 Sput 1 Volts, Current, Pod-Pressure X-Y-Z Correlation

10 Tadin for Process and Equipment Optimization May 2003Tadin Tal Advanced Instruments Ltd. 10 Sput 1 Plasma Impedance calculated as V/I

11 Tadin for Process and Equipment Optimization May 2003Tadin Tal Advanced Instruments Ltd. 11 Sput 3 voltage trend: Note target changes at pre-set voltage level. Number of wafers: 9934

12 Tadin for Process and Equipment Optimization May 2003Tadin Tal Advanced Instruments Ltd. 12 Sput 1 Power, W, Lot#, Recipe over 12 Hours, 373 Wafers.

13 Tadin for Process and Equipment Optimization May 2003Tadin Tal Advanced Instruments Ltd. 13 Sput 1 Current trend, wafers

14 Tadin for Process and Equipment Optimization May 2003Tadin Tal Advanced Instruments Ltd. 14 Correlation graph of Sput1 #1 Volts Vs. Current (745 wafers).

15 Tadin for Process and Equipment Optimization May 2003Tadin Tal Advanced Instruments Ltd. 15 Sput 1 Current and Voltage long-term (3 months) trend, with target changes.

16 Tadin for Process and Equipment Optimization May 2003Tadin Tal Advanced Instruments Ltd. 16 Sput 2 Current and Voltage, Target change and 39 conditioning wafers

17 Tadin for Process and Equipment Optimization May 2003Tadin Tal Advanced Instruments Ltd. 17 Sputter machine performance and capacity measurements: Average wafers per hour.

18 Tadin for Process and Equipment Optimization May 2003Tadin Tal Advanced Instruments Ltd. 18 Sputter Etch chamber pump-down curve.

19 Tadin for Process and Equipment Optimization May 2003Tadin Tal Advanced Instruments Ltd. 19 Sputter Etch chamber measured pumping speed.


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