2 Executive SummaryThe Defense and Aerospace electronics industry is aggressively moving to smaller and smaller devices.These miniaturized packages are more highly functioning and generate more heat.As a result thermal management has become more of a challenge for designers.Typical approaches such as thermal greases and phase-change materials in pad formats may provide adequate thermal management capability, however, they are not process friendly solutions and do not adequately address today’s through-put requirements.A new class of printable phase change formulations provide excellent thermal management and resolve many of the process limitations of grease and pads.April 13, 2017Title and author of presentation
3 Loctite PSX-D and PSX-P Product Overview Dispensable and /or printable phase change thermal interface materials for high power semiconductors and other applications as a pre-applied TIM2 solutionDries to a solid phase change coating at room temperature and can be accelerated with heatAvailable in fast, medium and extended dry formulationsPhase change temperature of 45CHigh thermal conductivity (3.4 W/m-K)Low thermal resistance (small particle size can yield thin bond-line)Silicone freeEasy to re-workRoHS compliantExcellent long term reliability (no pump-out)April 13, 2017Title and author of presentation
4 Loctite PSX-D and PSX-P Product Benefits Offers flexibility with pattern and thickness vs. a film materialImproved long-term reliability because elimination of “pump-out”Reduce part number complexity associated with pre-formsEnables manufacturers of advanced electronic systems to offer their products with a robust pre-applied TIM2 allowing them to differentiate from their competitionIncreases semiconductor design ratings by including this advanced TIM2 material in the specificationsNo new capital expenditure is normally required, as PSX-D and PSX-P are adaptable to current equipment systemsEliminates expensive TIM evaluation by the semiconductor end usersApril 13, 2017Title and author of presentation
5 Loctite PSX-D and PSX-P Why Loctite PSX-D and PSX-P? Compared to other TIM products in the market, PSX-D and PSX-P is available in multiple dry time formulations vs. the competitive products only available in ultra fast dry formulationsPSX-P is optimized for automated stencil printing, while other similar products in the market are optimized for manual screen printing onlyImproved long-term thermal reliability because of the elimination of “pump-out”Henkel offers technical support for our Loctite TIM products globallyApril 13, 2017Title and author of presentation
6 Loctite PSX-D and PSX-P Applications: Pre-applied solutions for high through-put and thermal reliability requirementsPower IC (as a pre-applied solution)Power Modules – IGBT’s and DC/DC converters (as a pre-applied solution)Heatsinks(as a pre-applied solution)HB LED ApplicationsApril 13, 2017Title and author of presentation
7 ConclusionHenkel Loctite PSX-D and PSX-P are a new class of printable phase change formulations.These printable phase change materials provide excellent thermal management and resolve many of the process limitations of grease and padsSpecifically, as printable phase change materials, Loctite PSX-D and Loctite PSX-P provide improved throughput, lower overall manufacturing costs and provide the engineer with process versatility.As Aerospace and Defense companies designing advanced electronic systems continue the move to miniaturization, printable phase change materials simplify the manufacturing processes delivering real savings.Loctite PSX-D and PSX-P printable thermal phase change materials deliver excellent thermal management and provide the Aerospace and Defense Designers and Engineers with working process solutionsApril 13, 2017Title and author of presentation
8 Loctite PSX-D and PSX-P Contact InformationFor further information on Loctite PSX-D, PSX-P and any of the other Loctite Phase Change Thermal Interface Materials, Please contact the Henkel Electronics Customer and Product Support Team at (888)You can also visit us atApril 13, 2017Title and author of presentation
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