Presentation is loading. Please wait.

Presentation is loading. Please wait.

Team #55 Reflow Oven Project Manager: Patrick Selzer (ME) Team Members: Michael Ladd (ME), Patrick Mooney (EE), Corey Seidel (EE)

Similar presentations


Presentation on theme: "Team #55 Reflow Oven Project Manager: Patrick Selzer (ME) Team Members: Michael Ladd (ME), Patrick Mooney (EE), Corey Seidel (EE)"— Presentation transcript:

1 Team #55 Reflow Oven Project Manager: Patrick Selzer (ME) Team Members: Michael Ladd (ME), Patrick Mooney (EE), Corey Seidel (EE)

2 Executive Summary Problem Statement  Small scale solder ovens sacrifice quality and precision for cost.

3 Executive Summary Deliverables

4 Executive Summary Team Responsibilities  Control System (CS)  User Interface (PM)  Heating System (PS/ML)  Cooling System (PS/ML)

5 Executive Summary Resources  $  Oven by Mar. 14 th  Profiles and Testing Data by Apr. 28th

6 Market Outlook Professional Models  Expensive  Precise performance data  Accurate temperature control  Higher reliability  Faster cycle times ModelCostCycle TimeUser InterfaceControl UnitSolder Area Heating Element T962A$ min B/W with function buttons Micro-processor300 x320 mmInfrared T962$ min LCD display with function buttons Micro-processor (Self- Contained) 180 x 235 mmInfrared T962C$ min LCD display with function buttons Micro-processor (Self- Contained) 400 x 600 mmInfrared AS-5060$850.00N/A B/W with function buttons Micro-processor460 x 275 mmInfrared 2011 D.A$ min B/W with function buttons Control Unit with EPROM 400 x 350 mmConvection BT300CP$ min B/W with function buttons PID control230 x 370 mmConvection 850$ min B/W with function buttons PID control340 x 430 mmConvection GF-B-HT$ min B/W with function buttons Micro-processor305 x305 mmConvection GF-C^2-HT$ minComputer out Outside Computer 305 x 305 mmConvection HHL3000$ minB/W with function buttons Micro-processor360 x 385 mmConvection

7 Market Outlook Do-It-Yourself (DIY) Ovens  Cheap  No performance data  Untested reliability  Higher cycle times Build After Oven Cost ($) AutomaticControl Temperature Uniformity Ease of Use Ease of Build Spectrum154.00YesGoodFairGoodFair Freetronics70.00NoPoor Very Good Instructables120.00YesGoodPoorGoodFair Die4laser148.00YesGoodPoorGood Mad-science85.00YesFairPoorGoodVery Good

8 Market Outlook Target Markets  Small Business  Reliable  High Performance  Tighter constraints  Low cost  Lower cycle times  Home Hobbyist  Versatile  Ease of use  Low cost

9 Specifications  User Interface  <$50 CPU  Digital Display  Profile Library  Control System  2% overshoot  Thermal Profile  Base profile of low ramp-up rate, low peak, high ramp-down rate  Calibrated with respect to solder, flux, oven

10

11 Block Diagram

12 Temperature Profiles  Profile Types  Ramp to Spike  Ramp, Soak, Spike  Low Void Profile  Eliminating Defects  Heating Rate 3°C/s  Cooling Rate of -4°C/s  Time above liquidus sec

13 Heating and Cooling Systems  Resistive heating element  Max oven temperature of 300°C  Internal Convection Fan  79 ft 3 /min  120 mm  Aluminum  External Vents  Solenoid controlled  In-line with convection fan.

14 Control System  Arduino  Temperature= User Input – Actual Temperature  Applies corrections to within 2%  Output pulse width modulated signal  MOSFET bridge  Act as solid state relay  High-current switching operation  Expandability  Modular to accommodate future expansion

15 User Interface  Arduino TFT digital display  Standard 4 buttons  Arrange buttons to proximity of text  Up to 12 buttons available  Stop button integrated

16

17 Action Item List (AIL) ActivityPersonAssignedDue Acquire OvenML1/131/20 Stock-oven ExperimentsAll1/202/3 Install vent and fanPS/ML1/272/10 Implement ControlCS2/102/24 Install User InterfacePM2/103/3 Synchronize subsystemsALL2/173/10 FEA heat flux analysisML/PS2/243/17 Solder TestingAll3/103/31 Compile Temp. ProfilesAll3/174/28 Perfect DeviceAll3/314/28 Document DesignAll4/75/5

18 Resources PartItemQuantityPriceCostTotal 1Black and Decker Toaster Oven1$ Arduino Duo1$43.00 $ Arduino TFT1$26.00 $ Solenoid2$7.00$14.00$ Computer Fan1$8.00 $ Wire-On Hand $ Buttons-On Hand $ Solder-On Hand $ Thermistor10$1.00$10.00$ Super Glue1$2.00 $ Metal Sheeting-On Hand 12Arduino Software On Hand 13Contingency1$57.00 $ Total:$200.00

19 Conclusion  Modify Standard Convection Oven  Arduino Board  External Vents  Internal Fan  User Interface  Objectives  Reach 300°C  Heating Rate 3°C/s  Cooling Rate of -4°C/s  Questions?


Download ppt "Team #55 Reflow Oven Project Manager: Patrick Selzer (ME) Team Members: Michael Ladd (ME), Patrick Mooney (EE), Corey Seidel (EE)"

Similar presentations


Ads by Google