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CHALLENGING NEW TECHNOLOGIES Lead free SOLUTIONS you can TRUST ® Prevents EROSION of the soldering iron bit, reduces bit consumption and exhibits excellent.

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Presentation on theme: "CHALLENGING NEW TECHNOLOGIES Lead free SOLUTIONS you can TRUST ® Prevents EROSION of the soldering iron bit, reduces bit consumption and exhibits excellent."— Presentation transcript:

1 CHALLENGING NEW TECHNOLOGIES Lead free SOLUTIONS you can TRUST ® Prevents EROSION of the soldering iron bit, reduces bit consumption and exhibits excellent thermal fatigue. No-clean Flux Cored Wire Solder S03X7Ca-56M (SnAg0.3Cu0.7Co0.3+α)

2 May 10, 2003 CHALLENGING NEW TECHNOLOGIES Development Objectives  Greatly EXTENDS the LIFE of the solder iron bit.  Very FAST and COMPLETE wetting.  MINIMISE solder/flux SPATTERING.  Compatible with various solder alloys.  NO TAILING or SPIKING and CLEAN TAKE AWAY of soldering iron

3 May 10, 2003 CHALLENGING NEW TECHNOLOGIES Iron bit OriginalAfter 30,000 shots Conditions -Soldering robot: Japan Unix - Iron bit temperature: 390ºC - Solder feed speed: 10mm/sec. - Wire diameter:0.8mnm approx. 500 min. Fe Cu

4 May 10, 2003 CHALLENGING NEW TECHNOLOGIES Anti-Erosion Property (Cu) Erosion Test Set two copper plates of 10 x 120x1mm on the stirring paddles of a mixer. Dip 20mm from the tip into the solder bath of 255  C. Stir at 30rpm for 30 minutes. Measure a decrease in weight of the copper plates and represent the figures as the quantities of copper erosion. * Complete erosion of the dipped part is 3g. Copper piece Stirrer= 1mm (10x120x1mmx2pcs.) (30 rpm x 30mm 20mm Dipping depth Solder pot temp.

5 CHALLENGING NEW TECHNOLOGIES Anti-Erosion Property (Fe) Erosion Test Set an iron plate of 25 x 70x2mm on the stirring paddles of a mixer. Dip 15mm from the tip into the solder bath of 450  C. Stir at 30rpm for 60 minutes. Measure a decrease in weight of the copper plates and represent the figures as the quantities of copper erosion. Copper piece Stirrer=1mm (10x120x1mmx2pcs. ) 70mm dia. 15mm Dipping depth Solder pot

6 CHALLENGING NEW TECHNOLOGIES Mechanism of Fe anti-erosion SnCo layer SnCoFe layer SnFe layer Cobalt melts into the metallic compounds, SnCu or SnFe, to be formed at the interface of the solder and Iron coating of the soldering tip, and restricts the diffusion of Iron into the solder. SnCuCo+α Iron plating

7 CHALLENGING NEW TECHNOLOGIES Mechanism of Fe anti-erosion Anti-erosion property against Fe + Cu Cu Fe plating Extension of iron bit life

8 CHALLENGING NEW TECHNOLOGIES Mechanism of Fe anti-erosion Number of shots (times) Fe erosion thickness (micron) Iron bit life limit S03X7Ca-56M Sn40Pb S03X7Ca-56M Erosion: 70μm Sn40Pb Erosion: 60μm SAC305 Erosion: 240μm At 20,000th shot

9 Solder fillet Pad ( Ф3.0 ) Creep strength test (Load 3kg x 150ºC) Creep rupture time (hour) S03X7C-56MSn0.7CuSn0.7Cu0.3AgSn63Pb37 Weight May 10, 2003 CHALLENGING NEW TECHNOLOGIES Creep Strength Conditions - Through hole: 1.1mm dia. - Pad:3.0mm dia.x18μmt - Lead wire:1.0mm dia. Cu wire - Load:3kg - Ambient temp.:150ºC

10 CHALLENGING NEW TECHNOLOGIES Specifications


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