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Welsh Centre for Printing and Coating Plastic electronics for Smart Packaging Dr. Davide Deganello Contact

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Presentation on theme: "Welsh Centre for Printing and Coating Plastic electronics for Smart Packaging Dr. Davide Deganello Contact"— Presentation transcript:

1 Welsh Centre for Printing and Coating Plastic electronics for Smart Packaging Dr. Davide Deganello Contact College of Engineering Bridging Borders, 26 th Sept 2013, Belfast

2 What is printing today? One of the World’s largest industries An advanced, precision volume manufacturing process

3 Industrial Graphic Printing Industrial printing presses: Web widths up to 4.5m, speeds up to 1000m/min

4 Printing challenges Graphic Printing Eye “compensates” Printed Electronics New level of accuracy / understanding required

5 Welsh Centre for Printing and Coating Fundamental research Graphics & Packaging Printed Electronics Medical & Biotechnology Solutions for Industry Centre of excellence for R&D in Industrial Printing Funded in 1994, based at Swansea University, UK

6 Comprehensive Facilities R2R, sheet fed and small scale printing Ink development and manufacture Analysis of materials and prints

7 WCPC Converting ideas into volume products WCPC : working with Industry

8 Packaging & Smart Packaging Packaging market Estimates: > 820B$ by 2016 Higher growth sectors: Healthcare, cosmetic, food (source:rexam) Source: Smithers Pira

9 Printing Packaging technology Flexography: Ink transfer through a raised imaged photopolymer plate

10 Packaging Current trends in Packaging: Premiumisation of every-day products Increased communication to the consumer Environmental considerations Cost reduction Smart Packaging

11 Smart packaging : Packaging moves from an “inert” to an active role Packaging monitors the product Product condition, lifespan, logistic, authenticity Packaging interacts with consumer: Increased flow of information, consumer confidence Cost must be feasible

12 Smart Packaging Current Smart Packaging: Some Examples

13 Smart Packaging: RFID Labels RFID Labels: Radio frequency identification labels Monitoring expensive/dangerous products Reduce logistic costs: Wall-Mart mandate (2006) Current limit to wide use: cost per RFID label ( 0.10 $) Fully printed RFID (PolyIC) Future: roll2roll inline integration From

14 Smart Packaging: Thermo-chromic Thermo-chromic labels: color-changing labels which respond to cumulative exposure to temperature. Monitor individual item handling Possible Issue: Subjectivity Food decay chromic sensors under development From

15 Electronics & Smart Packaging Smart Packaging: What is its next future?

16 Electronics & Smart Packaging Integration of Printed electronics into packaging: Next development of smart packaging New level of interaction between consumer and product Improved Security of the product A “revolution in packaging”

17 Electronics & Smart Packaging Electronic & Packaging integration: Example 1 Adaptive displays integrated in the packaging Courtesy of Faraday packaging

18 Electronics & Smart Packaging Electronic & Packaging integration: Example 2 Active monitoring: Display information Sensors Data logging Clear statement of quality: Objective Courtesy of Faraday packaging

19 Electronics & Smart Packaging Why Printed electronics instead than “silicon”? Printing is affordability, larger-area, flexible substrates But lower performance (micron-features not nano) Easy integration with current packaging production Electronic components to be printed Displays Sensors Power sources CPU ? Touch screens (available)

20 Display/Lighting Technologies Flexible OLEDs: Efficient lighting at low DC voltage Major research area Limit: Humidity & cost of vapour barriers General Electric Fast2Light : FP7 IP on large area OLEDs technologies R2R Flexo Printing for accurate conductive micro-networks 70±3 μm

21 Printed Electronics ACCUFLEX: A dvancing Flexo for Printed Electronics TSB Funded project Improved registration, uniformity Plate resistance to solvents Partners: Innovia Films Asahi Photoproducts UK (Ltd) Tectonic International Gwent Electronic materials Millenium lasers Timsons Ltd

22 Display/Lighting Technologies Electroluminescence Lighting: Commercial reality Flexible, thin, lasting... Continuous progress Current limit: High AC Voltage

23 Display/Lighting Technologies Novel solution: Printable micro silicon-LEDs Micro LED printed between 2 conductive layers Low DC voltage & lasting NthDegree patented technology

24 Display/Lighting Technologies Printed display: e-inks, bi-stable inks on flexible substrate Energy required only to change status Complex image, complex driver electronics From From

25 Active sensors R2R printed ZnNW sensors (P) Large area  high sensitivity Potassium sensing (P) (P): patented Printed sensors: Quantitative, affordable Humidity, temperature Gas and biological compounds Pharmaceutical market, Food market Integrated in packaging would allow a continuous monitoring throughout the chain From

26 Power Printed Batteries: flexible and thin Adapt to required shape/space Collaborative project with HDM Stuttgart &

27 Power Printed photovoltaic: flexible and thin, several manufacturers Efficiency vs. Lifespan Large area solar cells on steel cladding Partnership Swansea Uni, TATA

28 Printed micro-networks Packaging Applications of printed micro-networks on flexible films R2R printed see-through RFID R2R printed micro-heaters R2R Strain gauges Magnetic coils (energy transfer)

29 What about Intelligence? Creating devices require a control unit: CPU Printed CPU: CIKC forefront Complex construction (not easy integration) Limited performance vs silicon Lifespan issues micron-features not nano Integrating silicon with high speed Printing Basic chips are economic (<1 p) Issue : connecting silicon to plastic R2R Pick&Place machines

30 What about Intelligence? Fine lines <10um Not for mass-production Research in advanced microcircuits New equipment at WCPC: Aereosol printer

31 Improving security Counterfeiting: key issue for suppliers & manufacturers Not only high-end, pharmaceutical products Memory circuits for brand protection From

32 Improving security Antibodies for brand protection R2R Printing of antibodies on plastic developed for bio-sensing Issues solved: adhesion on plastic and lifespan (patent) Antibodies are invisible until specific reagent introduced Highly safe counterfeiting system

33 New technologies: 3D Bioplotter Creation of 3D bio-scaffolds (e.g. bones) through a computer controlled filament deposition of bio-polymers GRAPHENEX: Digital printing pristine graphene polymer inks Graphene RFID

34 3D Bioplotter And D Chocolate

35 Conclusions Introduction to WCPC Providing solutions for Industry How smart will be our packaging? New technologies/demonstrators are now reality Manufacturing integrations under development

36 Welsh Centre for Printing and Coating College of Engineering Thank You Dr. Davide Deganello

37 European Regional Development Fund Funded and supported by:- HEFCW Welsh Centre for Printing and Coating Canolfan Argraffu a Chaenu Cymru


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