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Laird Technologies MMP April 2008. The Laird Group PLC Overview Founded in mid 1800’s Headquartered in London, UK Quoted on the London Stock Exchange.

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Presentation on theme: "Laird Technologies MMP April 2008. The Laird Group PLC Overview Founded in mid 1800’s Headquartered in London, UK Quoted on the London Stock Exchange."— Presentation transcript:

1 Laird Technologies MMP April 2008

2 The Laird Group PLC Overview Founded in mid 1800’s Headquartered in London, UK Quoted on the London Stock Exchange (symbol LARD) and a member of the FTSE 250 index Employer of 10,000+ people in North America, Europe and Asia 2006 revenue of approximately $1200 million

3 Laird Technologies Founded in mid 1990’s Headquartered in St. Louis, Missouri, USA Annual revenue almost $1B dollars Over 10,000 employees globally in engineering, manufacturing and sales Industry Business Units: –Handset –Automotive –Datacom –I&I –Consumer

4 Worldwide Locations 50 sites around the world 10,000 employees Not all sites are represented in this graphic. Some sites are close together

5 Magnes Family Tree

6 The Laird Technologies Mission “To be the leader in design and supply of customized performance-critical products for wireless and other advanced electronics applications.”

7 Revenue Distribution Revenue by Origin Revenue by Destination

8 Revenue Splits

9 global solutions: local support Technology leadership in all products offered Direct support for global and large OEM programs Broad market coverage Broad product line within business units Local manufacturing and engineering Low cost producer of high volume products Add complementary product lines Strategy

10 Core Competencies Bias for action – speed of response Global footprint Key customer access and relationships Broad product line to same customers Ability to bundle technology – “convergence products” RF design Identifying, buying, integrating niche segments of high margin, customized electronics components and systems

11 Serving a Diverse Range of Leading Global Companies

12 Topics Today MMP (Mobile Metal Products) Handset Products Technologies Manufacturing Sites Program Support Structure

13 MMP Mobile Metal Products –Board Level Shielding –Combo Products –Decorative / Visual Metals –MAP (Hinges)

14 Technical Characteristics Board Level Shielding Surface Mount Shield Options 2 Piece pre-assembled frame and cover (Tin Plate CRS not available as cover will reflow to frame) 2 Piece system surface mount frame with manually installed cover Multi-Compartmental Shields replace multiple single shields 1 Piece Surface Mount Shields –Formed and Drawn technologies 1 Piece Shield w/ Tear-Away Feature (EZ Peel / Pop-Top) Surface Mount Clips with BLS and MIP shield (EcE and TPE types)

15 Materials used for BLS Tin Plated Cold Rolled Steel (CRS) – Cheapest option Nickel Silver Stainless Steel Tin Plated Tin Plate Phos bronze ALL materials used are RoHs compliant

16 Cellular Handsets Board Interface contacts Shielding of various functions

17 EMI Product Portfolio Surface Mount Contact (SMC) – Standard or Custom Designs Standard Contacts Packaged in Tape and Reel for Automatic Placement on SMT Lines FEA of Design Custom Contacts Packaged in Tape and Reel for Automatic Placement on SMT Lines Custom Contacts

18 Match system productivity to program size Implement Technologies that maximize yields In-line and In-Die secondary operations Technologies to reduce material usages Real-time Quality Assurance and Quality Control Match tool life to program size (15m to 100m) BLS Manufacturing Technology Objectives -Deliver High Quality Parts at the Lowest Cost

19 System Approach Feeder Press Washer Labeling Inspection Packaging Other automated operations Laser welding Tapping Pin insertion Assembly

20 In-die and In-Line Assembly In-die Assy pieces/min. High die Cost Carbide technology 8-12 week tool lead-time >98% yield >50m die life In-line Assy pieces/min. Low die cost Modular 4 week tool lead-time >96% yield >15m die life

21 100% Automated Co-planarity Inspection PEG AOI

22 Combo Products LT has the internal ability to produce complex metal stampings and insert molded parts. Molding can be TPE or EcE Combo (MCS) Drawn Frames with Molding [TPE or Conductive Silicone] Simulation of Draw Forming Drawn Part Molded Part

23 Location Capabilities

24 San Jose, CA (Business Development) Chicago, IL. (Business Development) Stockholm, Sweden (Business Development) Liberec, Czech Republic (Manufacturing) Tianjin, China (Manufacturing BLS and Combo) Shanghai, China (Business Development, Manufacturing) Chennai, India (BLS Manufacturing) Shenzhen, China (Business Development, Manufacturing Decorative Metals) Reynosa, Mexico

25 DECORATIVE METALS

26 What is a decorative metal? Exterior metals to a customer application. Typically has a class 1 finish. May be plated, colored, etch, etc. Provides ASTHETIC appeal to end customer product Can also be an enclosure for the application

27 Areas of Technology Development Metal Bases SS stamping/drawing Al stamping/drawing Electroforming Ti stamping/drawing Die casting Extrusions Decorative Finishing Technologies Laser decoration Electro-polish Anodizing Diamond cutting Plasma Vapor Deposition of metals and finishes Electro-deposition Chrome, Gold, other platings Painting Ni/Cr free coatings ALL Possible either internal or through supply

28 Core Tech. Stainless Steel Aluminum Titanium Mg Die-cast Laser decoration Electro deposition PVD MAM Polishing Anodizing Electro-polish Key LT- Current LT - Vendor LT- Planned 2008 Painting Core Decoration Tech. Mesh forming Diamond cutting Hairline brush Simple Decoration Gold plating Chrome plating Photo Etch Silver plating Laser welding Teflon coating Visual Metals Sand Blast PVD Painting Anodizing Painting

29 Visual Metal & Hinge Market Roadmap 1H08 Handset Network Infrastructure Digital Imaging 2H08 Computing Platforms 1H092H10

30 New Clean Room Layout for Decorative Metals (LT- Shenzhen) Painting Line 1

31 Process: Al 6061, stamping, polishing, anodizing, bright surface cutting.

32 Process: SUS304 BA, stamping, electro polishing, selective Hairline.

33 Process: SUS304 BA, stamping, polishing, Hairline, PVD, Laser marking.

34 Process: SUS304 BA, stamping, electro polishing, selective Hairline.

35 Process: SUS304 BA, stamping, 3 coatings, soft touch.

36 Decorative Metals Laser Coloring on Stainless Steel

37 Decorative Metals Complex Forming Electro Polishing

38 Additional “colors” Process: Sus304 BA, stamping, polishing, PVD (Black, Silver, golden)

39 Decorative Metals LCD Flip Retainer Part is: –Stamped from stainless steel –Electro polished –Selectively colored electro coated (selectivity allows for surface conductivity of grounding finger). back side

40 Mg die casting + Passivation + Cu plating + Powder coating

41 Mg die casting + Passivation + Cu plating + bright Cr plating + PVD

42 Mg die casting + Passivation + Cu plating + dull Cr plating + PVD

43 Speaker mesh Wire mesh plus Chrome plating

44 Photo Etching, secondary forming, electro polishing Speaker Details

45 Speaker mesh Wire mesh plus Chrome plating

46 SIM Tray Stamping + ED coating + laser etching

47 Camera Bezel Process: SUS316L,stamping, Photo Etching, stamping, electro polishing, Etch.

48 Display Bezel Process: Sus304 BA, stamping, polishing, PVD (Black), Laser.

49 MAP (Hinges)

50 MAP Mechanical Actuated Products –Hinges provides handheld devices the ability to fold, rotate or slide to allow access to screens or keypads. These capabilities are key aspects to allow these devices to become smaller now and in the future MAP comes from 2007 Acquisition of M2Sys, a Korean company.

51 Locations

52 R&D Hinges

53 R&D

54 Questions


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