1 SUPERIOR FLUX & MFG. ELECTRONICS PRODUCTS Superior Flux & Mfg. Co. founded in 1932.1949 introduced Superior Supersafe® No. 30, first Battelle formula flux.1995 introduced SyberGelTM and SyberLiquidTM for repair/rework and hand-soldering.
3 SOLDER PASTE 3000 Series Conventional No-Clean 4000 Series Synthetic, Low-Residue No-Clean8000 Series Water-Soluble9000 Series Rosin Mildly Activated (RMA)Solders: 63Sn/37Pb62Sn/36Pb/2AgLead-Free
4 3000 SERIES NO-CLEAN SOLDER PASTE Classification: IPC ANSI-J-STD 004, Type ROL0Meets and exceeds Bellcore standards.Pin-testable post-solder joints.Translucent residue.Capable of printing 12 mil pitch.
5 4000 SERIES SYNTHETIC NO-CLEAN SOLDER PASTE Classification: IPC ANSI J-STD-004,Type REL0.Meets and exceeds Bellcore standards.Translucent, protective post-solder residue.Pin-testable post-solder joints. General residue levels of 2.5 – 3.3%. In proper conditions, can be as low as 1.1%.Capable of printing 12 mil pitch.
6 8000 SERIES WATER-SOLUBLE SOLDER PASTE Passes BellcorePasses IPCResidues are truly water-soluble.Post-reflow residues can be left on boards for extended time and NOT reduce SIR values.Post-solder residues do not foam in aqueous cleaning systems.Capable of printing 12 mil pitch.
7 9000 SERIES RMA SOLDER PASTE Exceptional reflow profiling characteristics.Capable of printing 16 mil pitch.Superior wetting characteristics.Residues can be aqueous cleaned using SyberKleen 2000 Saponifier.
8 RECOMMENDED REFLOW PROFILE: 63Sn/37Pb and 62Sn/36Pb/2Ag
11 WHAT SETS SUPERIOR SOLDER PASTES APART? All are non-halide.All have a minimum 12 hour open-time between printing, placement, and reflow.All are formulated for high-speed dispensing.All No-Clean and RMA pastes can be aqueous cleaned in Superior SyberKleen 2000 Saponifier .NO slumping.NO tomb-stoning when stencil and reflow profile are properly set.NO white residues on PCBs.
12 WHAT SETS SUPERIOR SOLDER PASTES APART? (cont.) Consistent rheology, thixotropy, and viscosity from lot-to-lot.Consistent, clear, pin-testable residues with all No-Cleans.Consistent metal-load due to no pre-thinning or post-thinning manufacturing process.4000 Series Synthetic No-Clean residues act as protective barrier against humidity and outside elements.8000 Series Water-Soluble residues can be washed any time after reflow. SIR values remain the same when PCBs are cleaned three (3) minutes or three (3) days after reflow.
13 SOLDER PASTE STORAGE Shelf life for all solder pastes extended with freezer-storage first formulations.Freezer Storage (0ºC and below): months.Refrigerator Storage (1-12ºC): months.Room temperature storage (18-23ºC): 3 months.
14 TACKY FLUXES 4000 Synthetic No-Clean 3000 Conventional No-Clean 8000 Water-Soluble9500 High TemperatureApplications:BGA Attachment and RepairCustom manufacturing applicationsDispensable applicationsPreform soldering
19 ROSIN FLUXES Type R: No. 97 Type RMA: No. 99 Type RA: No.100 Hi-Temp RA: No. 100HTSolids content variations are availablefor all fluxes.
20 ADDITIONAL PCB ASSEMBLY PROCESS PRODUCTS SyberGelTM and SyberLiquidTMHand solder, repair and rework gel or liquid that act as flux and cleaner.Superior SyberKleen 2000 SaponifierRosin residue removal in aqueous cleaning systems.Superior DescalerA descaling solution for removing residual build-up that is standard for in-line and batch aqueous cleaners.Superior Dross ReducerPowder for dross and oxidation removal from solder bath to extend solder life.
21 COMPONENT TINNING PRECLEANERS & FLUXES Lead tinning for semiconductor, component, and fuse leads.Fluxes formulated for Tin/Lead, Lead-Free, and fusible alloys.Base Metals:CopperNickelAlloy 42Alloy 51KovarOther specialty alloys
22 SEMICONDUCTOR AND COMPONENT LEAD PRE-CLEANERS Copper Pre-CleanerVOC-Free, non-hazardous, OA formulation.Light, pink color that changes if pH exceeds a 3.5 reading.Nickel Pre-CleanerA high activity nickel cleaner that contains no sulfuric acid.
23 DIFFERENT FLUXES FOR DIFFERENT APPLICATIONS VOC-FREE, HALIDENo. 30, No. 30DS, No. 40MM4, No. 43ALCOHOL-BASED HALIDENo. 45, No. 48, No. 48SVOC-FREE, NON-HALIDE430 SeriesALCOHOL-BASED, NON-HALIDENo. 435, No :1, No. 91
24 WIRE TINNING FLUXESNo-Clean: Small gage (14-22) automatic or manual cut/strip/tin operations.VOC-Free: No. 425Alcohol-based: No. 325, No. 334.Water-soluble: Large gage (2-12) wires; Copper and brass crimped terminal wires.VOC-Free: No. 30Alcohol-based: No. 45Applications:Automotive, Industrial, and Appliances.