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SUPERIOR FLUX & MFG. ELECTRONICS PRODUCTS  Superior Flux & Mfg. Co. founded in 1932.  1949 introduced Superior Supersafe ® No. 30, first Battelle formula.

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Presentation on theme: "SUPERIOR FLUX & MFG. ELECTRONICS PRODUCTS  Superior Flux & Mfg. Co. founded in 1932.  1949 introduced Superior Supersafe ® No. 30, first Battelle formula."— Presentation transcript:

1 SUPERIOR FLUX & MFG. ELECTRONICS PRODUCTS  Superior Flux & Mfg. Co. founded in  1949 introduced Superior Supersafe ® No. 30, first Battelle formula flux.  1995 introduced SyberGel TM and SyberLiquid TM for repair/rework and hand-soldering.

2 PRODUCT LINE  Solder Pastes  Tacky Fluxes  Wave Solder Fluxes  Component Tinning Fluxes  Wire Tinning Fluxes  Hand Solder Fluxes  Copper and Nickel Pre-Cleaners  Saponifier  Descaler  Dross Reduction Powder

3 SOLDER PASTE  3000 Series Conventional No-Clean  4000 Series Synthetic, Low-Residue No- Clean  8000 Series Water-Soluble  9000 Series Rosin Mildly Activated (RMA)  Solders: 63Sn/37Pb 62Sn/36Pb/2Ag Lead-Free

4 3000 SERIES NO-CLEAN SOLDER PASTE  Classification: IPC ANSI-J-STD 004, Type ROL0  Meets and exceeds Bellcore standards.  Pin-testable post-solder joints.  Translucent residue.  Capable of printing 12 mil pitch.

5 4000 SERIES SYNTHETIC NO-CLEAN SOLDER PASTE  Classification: IPC ANSI J-STD-004, Type REL0.  Meets and exceeds Bellcore standards.  Translucent, protective post-solder residue.  Pin-testable post-solder joints. General residue levels of 2.5 – 3.3%. In proper conditions, can be as low as 1.1%.  Capable of printing 12 mil pitch.

6 8000 SERIES WATER- SOLUBLE SOLDER PASTE  Passes Bellcore  Passes IPC  Residues are truly water-soluble.  Post-reflow residues can be left on boards for extended time and NOT reduce SIR values.  Post-solder residues do not foam in aqueous cleaning systems.  Capable of printing 12 mil pitch.

7 9000 SERIES RMA SOLDER PASTE  Exceptional reflow profiling characteristics.  Capable of printing 16 mil pitch.  Superior wetting characteristics.  Residues can be aqueous cleaned using SyberKleen 2000 Saponifier.

8 RECOMMENDED REFLOW PROFILE: 63Sn/37Pb and 62Sn/36Pb/2Ag

9 REFLOW PROFILE FOR LEAD-Free

10 APPLICATION METHODS  Screen printing  Cartridge printing  Dispensing

11 WHAT SETS SUPERIOR SOLDER PASTES APART? 1. All are non-halide. 2. All have a minimum 12 hour open-time between printing, placement, and reflow. 3. All are formulated for high-speed dispensing. 4. All No-Clean and RMA pastes can be aqueous cleaned in Superior SyberKleen 2000 Saponifier. 5. NO slumping. 6. NO tomb-stoning when stencil and reflow profile are properly set. 7. NO white residues on PCBs.

12 WHAT SETS SUPERIOR SOLDER PASTES APART? (cont.) 8. Consistent rheology, thixotropy, and viscosity from lot-to-lot. 9. Consistent, clear, pin-testable residues with all No-Cleans. 10. Consistent metal-load due to no pre-thinning or post-thinning manufacturing process Series Synthetic No-Clean residues act as protective barrier against humidity and outside elements Series Water-Soluble residues can be washed any time after reflow. SIR values remain the same when PCBs are cleaned three (3) minutes or three (3) days after reflow.

13 SOLDER PASTE STORAGE Shelf life for all solder pastes extended with freezer-storage first formulations. Freezer Storage (0ºC and below): 9-12 months. Refrigerator Storage (1-12ºC): 3-9 months. Room temperature storage (18-23ºC): 3 months.

14 TACKY FLUXES  4000 Synthetic No-Clean  3000 Conventional No-Clean  8000 Water-Soluble  9500 High Temperature Applications:  BGA Attachment and Repair  Custom manufacturing applications  Dispensable applications  Preform soldering

15 WAVE SOLDERING FLUXES Flux-types  No-Clean  Water-Soluble  RMA Flux-base  VOC-FREE  Alcohol-based Applications  63Sn/37Pb, LEAD-Free.

16 WAVE SOLDERING FLUX APPLICATION METHODS  Spray  Foam  Drag  Wave

17 NO-CLEAN WAVE SOLDERING FLUXES VOC-Free:  No. 420 (Spray or Foam)  No. 425 Alcohol-based  No. 312  No. 315  No. 340  RFE 14Y3N All No-Clean fluxes classified as: IPC ANSI J-STD 004 Type ORL0

18 WATER-SOLUBLE WAVE SOLDER FLUXES  Alcohol-based  No. 84  RFE C  VOC-Free  No. 32 All Water-Soluble fluxes classified as: IPC ANSI J-STD 004 Type ORM1

19 ROSIN FLUXES  Type R: No. 97  Type RMA: No. 99  Type RA: No.100  Hi-Temp RA: No. 100HT Solids content variations are available for all fluxes.

20 ADDITIONAL PCB ASSEMBLY PROCESS PRODUCTS  SyberGel TM and SyberLiquid TM  Hand solder, repair and rework gel or liquid that act as flux and cleaner.  Superior SyberKleen 2000 Saponifier  Rosin residue removal in aqueous cleaning systems.  Superior Descaler  A descaling solution for removing residual build-up that is standard for in-line and batch aqueous cleaners.  Superior Dross Reducer  Powder for dross and oxidation removal from solder bath to extend solder life.

21 COMPONENT TINNING PRECLEANERS & FLUXES  Lead tinning for semiconductor, component, and fuse leads.  Fluxes formulated for Tin/Lead, Lead-Free, and fusible alloys.  Base Metals:  Copper  Nickel  Alloy 42  Alloy 51  Kovar  Other specialty alloys

22 SEMICONDUCTOR AND COMPONENT LEAD PRE-CLEANERS  Copper Pre-Cleaner  VOC-Free, non-hazardous, OA formulation.  Light, pink color that changes if pH exceeds a 3.5 reading.  Nickel Pre-Cleaner  A high activity nickel cleaner that contains no sulfuric acid.

23 DIFFERENT FLUXES FOR DIFFERENT APPLICATIONS  VOC-FREE, HALIDE  No. 30, No. 30DS, No. 40MM4, No. 43  ALCOHOL-BASED HALIDE  No. 45, No. 48, No. 48S  VOC-FREE, NON-HALIDE  430 Series  ALCOHOL-BASED, NON-HALIDE  No. 435, No :1, No. 91

24 WIRE TINNING FLUXES  No-Clean: Small gage (14-22) automatic or manual cut/strip/tin operations.  VOC-Free: No. 425  Alcohol-based: No. 325, No  Water-soluble: Large gage (2-12) wires; Copper and brass crimped terminal wires.  VOC-Free: No. 30  Alcohol-based: No. 45 Applications: Automotive, Industrial, and Appliances.


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