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Quality Manufactory Page 1 Taguchi Method and SPC system in Semiconductor Manufacturing Chin-Yuan Chen 陳志遠 Quality Manufactory Advance Semiconductor Engineering.

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Presentation on theme: "Quality Manufactory Page 1 Taguchi Method and SPC system in Semiconductor Manufacturing Chin-Yuan Chen 陳志遠 Quality Manufactory Advance Semiconductor Engineering."— Presentation transcript:

1 Quality Manufactory Page 1 Taguchi Method and SPC system in Semiconductor Manufacturing Chin-Yuan Chen 陳志遠 Quality Manufactory Advance Semiconductor Engineering Manufacturing Company, Ltd April 30, 2010

2 Quality Manufactory Page 2 This presentation will cover the following topics, Taguchi Method Application in Assembly and Testing Site, SPC appliation system in Assembly process. Abstract: First, to present basic process introduction of semiconductor of assembly and testing. Taguchi Methodology and examples of assembly/test will be shown. To assist engineers to find root casue and enhance process capability, reduce variance, improve process capacity. Our company offer complete statistic training to new engineers. However, SPC methodology is most important tool for process control. To understand SPC concept, QC tools and OCAP(Out of Control Action Plan) become basic request of engineers. JMP software

3 Quality Manufactory Page 3 The statistical software in ASE

4 Quality Manufactory Page 4 The statistical software in ASE

5 Quality Manufactory Page 5 1.Assembly/Test brief introduction 2. Taguchi Method in test site - Enhance wrinkle bump yield 3. Taguchi Method in Assembly site - Gold Wire Diameter Reduction Evaluation 4. SPC in Assembly site Content:

6 Quality Manufactory Page 6 1. Assembly/Test brief introduction

7 Quality Manufactory Page 7 What common point they had? What common point they had?

8 Quality Manufactory Page 8

9 Quality Manufactory Page 9

10 Quality Manufactory Page 10

11 Quality Manufactory Page 11 Engineering Test Wafer Bumping/Probing Materials Assembly Final Test Module, Board Assembly & Test (DMS) Foundry Circuit Design ASE Vision:The Comprehensive Solution

12 Quality Manufactory Page 12 Brief Assembly Process 研磨 黏晶片 晶片切割缺點檢查 晶圓 ( 研磨後 ) 已切割 缺點檢查

13 Quality Manufactory Page 13 Brief Assembly Process 黏晶粒上銀膠 銲線

14 Quality Manufactory Page 14 Brief Assembly Process 銲線缺點檢驗 金線直徑 (20um) 約頭髮直徑 (40um) 的一半

15 Quality Manufactory Page 15 Brief Assembly Process 封膠植球 正印

16 Quality Manufactory Page 16 Brief Test Process 測試

17 Quality Manufactory Page 17 Brief Test Process TESTER TEST HEAD Loadboard Contact pushor Contactblade Dutsocket Interface Handler 晶圓 Wafer

18 Quality Manufactory Page Taguchi Method in test site

19 Quality Manufactory Page 19 Wrinkle bump issue Wrinkle bump Normal bump  Bump Status Check Low Yield

20 Quality Manufactory Page 20 Normal BumpWrinkle Bump Test Pin

21 Quality Manufactory Page 21 If you are engineer, then what will you improve? Normal BumpWrinkle Bump

22 Quality Manufactory Page 22 Good Contact Good Yield Hint

23 Quality Manufactory Page 23 Contact deeper (Enhance Over Drive) Normal BumpWrinkle Bump

24 Quality Manufactory Page 24  Taguchi Method

25 Quality Manufactory Page 25  Taguchi Method - Analysis To choose L9 Taguchi experiment matrix and consider two response(y) as above table.

26 Quality Manufactory Page 26  Taguchi Method- Analysis

27 Quality Manufactory Page Taguchi Method in Assembly site

28 Quality Manufactory Page 28 1.Customer want cost saving with device, and to reduce gold wire diameter. 2.Current diameter is 25um, customer request to reduce as 20 um. 3.Current composition is Au, customer need to replace by Au-Pb.  History

29 Quality Manufactory Page 29  Structure 652 golden wire

30 Quality Manufactory Page 30  Taguchi Matrix

31 Quality Manufactory Page 31  Taguchi Analysis Result On Desirability Functions The desirability functions are smooth piecewise functions that are crafted to fit the control points. The minimize and maximize functions are three-part piecewise smooth functions that have exponential tails and a cubic middle. The target function is a piecewise function that is a scale multiple of a normal density on either side of the target (with different curves on each side), which is also piecewise smooth and fit to the control points. These choices give the functions good behavior as the desirability values switch between the maximize, target, and minimize values. For completeness, we implemented the upside-down target also. JMP doesn't use the Derringer and Suich functional forms. Since they are not smooth, they do not always work well with JMP's optimization algorithm.

32 Quality Manufactory Page SPC in Assembly site

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36 Quality Manufactory Page 36 授權書 範例內容 (Enhance wrinkle bump yield, Gold Wire Diameter Reduction Evaluation) 的原作者之授權

37 Quality Manufactory Page 37 攜帶物品 八吋晶圓 ( 破片 ) 乙片 PBGA( 正印已處理過 ) 四顆 PBGA 空基版四條


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