We think you have liked this presentation. If you wish to download it, please recommend it to your friends in any social system. Share buttons are a little bit lower. Thank you!
Presentation is loading. Please wait.
Published byMolly Overton
Modified over 2 years ago
3M Electronic Solutions Division © 3M 2011. All Rights Reserved. 3M™ Transport Products Introduction
2 3M Electronic Solutions Division SMT Industry Supply Chain Enduser is Key in Deciding Transport Media Format © 3M 2011. All Rights Reserved. Transport Media Semiconductor Package Manufacturer Circuit Board Manufacturer Electronic Products
3 3M Electronic Solutions Division Market Trend - 1 Size Density Performance Mfg. Infrastructure Compatibility Cost Packaging Drivers Size Speed Power Cost Common Building Blocks TSOP CBGA CERAMIC PGA DIP PLCC TBGA LMI- MCM FluxBGA Flip Chip Flip Chip TBGA SMD Electronic Product and Packaging Evolution Drivers QFP miniBGA © 3M 2011. All Rights Reserved.
4 3M Electronic Solutions Division Transport Market Segments © 3M 2011. All Rights Reserved.
5 3M Electronic Solutions Division Market Trend - 2 Small-Outline Discrete Package Trend Transistor/Diodes/Power/LED SOD 923 Same shape as SOD 523 (2 leads) but smaller by 30% overall. A=0.6, B=1.0, K=0.35mm Towards a Smaller PCBA Area SOT 490 SC 79 SCD 80 SC90 Glass diode Power devices MELF format SOT223 SOT89 SOD87 SC-74 SC59 SOD80C SOT143 SOT23 SOT363 SOT323 SOD110 SOD323 SC75SC89 SOD523 © 3M 2011. All Rights Reserved.
6 3M Electronic Solutions Division Market Trend - 3 Tape & Reel Machine, Pick & Place Machine Trend Product demand/ Equip demands : Easy insertion of units (Handler efficiency) Component correct location in pocket Dynamic stability during indexing/ pick-up (SMT P&P m/c yield loss) Static charge control (Chip stick jamming) ESD control (Chip failure due to EOS) Product demand/ Equip demands : Easy insertion of units (Handler efficiency) Component correct location in pocket Dynamic stability during indexing/ pick-up (SMT P&P m/c yield loss) Static charge control (Chip stick jamming) ESD control (Chip failure due to EOS) Challenges for T&R supplier: Small pocket forming capability More precise pocket and tighter dimensional tolerance Component stability during taping/de-taping Ultra small pocket hole to assist insertion Consistent and smooth peel performance Clean room compatible Challenges for T&R supplier: Small pocket forming capability More precise pocket and tighter dimensional tolerance Component stability during taping/de-taping Ultra small pocket hole to assist insertion Consistent and smooth peel performance Clean room compatible © 3M 2011. All Rights Reserved.
7 3M Electronic Solutions Division 3M™ Carrier Tape Products 3M™ Non-conductive Polycarbonate Carrier Tape2703 3M™ Static-Dissipative Polycarbonate Carrier Tape 2705 3M™ Conductive Polycarbonate Carrier Tape 3000 3M™ Conductive Precision Polycarbonate Carrier Tape 3000BD 3M™ Polycarbonate Ultra Precision Carrier Tape 3000UB & 3000UP Tolerance: +/- 0.1mm, +/-0.05mm, +/-0.03mm © 3M 2011. All Rights Reserved.
8 3M Electronic Solutions Division 3M™ Carrier Tape Products 4mm x 1 mm !! (Resistor) (1000 units/ meter) 8mm x 2mm (SOD 523) (500 units/ meter) 8mm x 1mm (1000 units/ meter) Size Carrier Tape 8mm x 4mm (SOT 23) (250 units/ meter) Size: 40 x 20 mm Units: 200 © 3M 2011. All Rights Reserved.
9 3M Electronic Solutions Division 3M™ Carrier Tape Products 3M Carrier Tape Deliver Formats Planetary Reel (22 inch diameter) Levelwind Reel 500 meter (13 inch diameter) Levelwind Reel 1000 meter (17 inch diameter) Levelwind Reel 2000 meter (22 inch diameter) Latest Taping machine Trend: Movable Carrier Station (modular) Future improvements Beyond 2000 meter/reel Recyclable plastic reel Bigger reel (longer length) helps reduce cost of ownership © 3M 2011. All Rights Reserved.
10 3M Electronic Solutions Division Why PC? -- What’s PC? © 3M 2011. All Rights Reserved.
11 3M Electronic Solutions Division Why PC? -- What’s PC? Tough Dimensionally stable High precision High thermal stability High scratch resistant Environmentally friendly (Recyclability) © 3M 2011. All Rights Reserved.
12 3M Electronic Solutions Division Why PC? – Typical Data PolycarbonatePolystyrenePETGPVC Shrinkage (60C/85%RH) 0.5%>1.0% Max Usage Temp125°C 80°C65°C 65°C Tensile Strength @ Yield9.5E3 psi7.0E3 psi7.0E3 psi9.0E3 psi Heat Deflection Temp 135 °C100°C 80°C 90°C IZOD Impact Resistance 16<142 Recyclability YesYesYesNo © 3M 2011. All Rights Reserved.
13 3M Electronic Solutions Division Customer Requirements for Carrier Tape Dimensionally accurate and stable Capable of protecting fragile leads on components Cost © 3M 2011. All Rights Reserved. EIA-481-D Standard Dimensions
14 3M Electronic Solutions Division 3M™ Cover Tape Roadmap HAA Cover Tape 2672 NC 2675 SD 2678 SD PSA Cover Tape 2656 NC 2666 SD 1994 PSA Cover Tape 2658 HS -NC 2668 HS - SD 2000 Universal Cover Tape 2688A – SD HAA Cover Tape 2671A - SD 20061980’s NC = Non Conductive SD = Static Dissipative HS = High Shear HAA = Heat Activated Adhesive PSA = Pressure Sensitive Adhesive © 3M 2011. All Rights Reserved.
15 3M Electronic Solutions Division 3M™ Cover Tape Products HAA -- Heat Activated Adhesive 3M™ Non-Conductive Cover Tape 2672 3M™ Static Dissipative Cover Tape 2675 3M™ Static Dissipative (High Transparency) Cover Tape 2678 3M™ Static Dissipative Cover Tape 2671A PSA -- Pressure Sensitive Adhesive 3M™ Non-Conductive Cover Tape 2656 3M™ Static Dissipative Cover Tape 2666 3M™ Non-Conductive (High shear type) Cover Tape 2658 3M™ Static Dissipative (High shear type) Cover Tape 2668 UCT – Universal Cover Tape 3M™ Static Dissipative Cover Tape 2688A © 3M 2011. All Rights Reserved.
16 3M Electronic Solutions Division Backing: Plastic Film Tie-layer Adhesive © 3M 2011. All Rights Reserved. 3M™ Heat Activated Adhesive (HAA) Cover Tape Construction
17 3M Electronic Solutions Division Backing: Plastic Film Primer Adhesive Static-Dissipative/Non-Conductive layer Blocker: Plastic Film © 3M 2011. All Rights Reserved. 3M™ Pressure Sensitive Adhesive (PSA) Cover Tape Construction
18 3M Electronic Solutions Division 3M™ Universal Cover Tape (UCT) Construction Plastic Film PSA Adhesive Static Dissipative Coating Peel Initiation Feature
19 3M Electronic Solutions Division Sealing Requirement Cover Tape Sealing Area Cover Tape Alignment (must not cover hole, must not exceed edge) EIA-481-D 10-100 grams for 8 mm carrier size. 10-130 grams for 12mm and above carrier sizes. Test speed: 300 mm/min. © 3M 2011. All Rights Reserved.
20 3M Electronic Solutions Division Peel Force Comparison TIME UCL 65 GM 30 GM EIA LCL 100GM 10GM TIME UCL LCL EIA 65 GM 30 GM 10GM 100GM EIA © 3M 2011. All Rights Reserved.
21 3M Electronic Solutions Division Customer Requirements for Cover Tape Smooth and consistent removal force, tight range. Removal force within EIA standard. No unsealing during transit. ESD protection No adhesive or debris buildup on feeder. No tape break during detaping. © 3M 2011. All Rights Reserved.
22 3M Electronic Solutions Division © 3M 2011. All Rights Reserved. All statements, technical information, and recommendations All statements, technical information, and recommendations related to 3M’s products are based on information believed to be reliable, but the accuracy or completeness is not guaranteed. Before using this product, you must evaluate it and determine if it is suitable for your intended application. You assume all risks and liability associated with such use. Any statements related to the product which are not contained in 3M’s current publications, or any contrary statements contained on your purchase order shall have no force or effect unless expressly agreed upon, in writing, by an authorized officer of 3M. Important Notice This product will be free from defects in material and manufacture at the time of purchase. 3M MAKES NO OTHER WARRANTIES INCLUDING, BUT NOT LIMITED TO, ANY IMPLIED WARRANTY OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. If this product is defective within the warranty period stated above, your exclusive remedy shall be, at 3M’s option, to replace or repair the 3M product or refund the purchase price of the 3M product. Except where prohibited by law, 3M will not be liable for any indirect, special, incidental or consequential loss or damage arising from this 3M product, regardless of the legal theory asserted. Warranty; Limited Remedy; Limited Liability.
23 3M Electronic Solutions Division Thank You © 3M 2011. All Rights Reserved.
1 NIC Components Corp. New – Expanded Products October New High Frequency Products (Slide 2) - New Low ESR Capacitor Products (Slides 3 ~ 5) also.
HIGH DENSITY DESIGN COMPONENT SOLUTIONS. Technology Challenges Market Drivers: Make it smaller Make it operate faster Make it more efficient Make.
Forecast On Vinyl Flooring Market: Global Industry Analysis and Trends till 2025 by Future Market Insights
The Role of Packaging in Microelectronics
Digital Electronics Component Identification. 2 This presentation will… Introduce common components used in electronics. Define a resistor and present.
Integrated Circuits (ICs)
PACKAGE FABRICATION TECHNOLOGY Submitted By: Prashant singh.
Chapter 4 Components for Electronic Systems
Research report explores the Sodium Sulfur Batteries Market for the forecast period by FMI
Conductors and Insulators
Component Identification: Digital Introduction to Logic Gates and Integrated Circuits © 2014 Project Lead The Way, Inc.Digital Electronics.
1/17 PASSIVE ELECTRONIC COMPONENTS AND CIRCUITS Lecture 1 Introduction.
Ragan Technologies, Inc. Presents - Zero Shrink Technology - ZST™ Process for Embedding Fired Multi-Layer Capacitors in LTCC Packages.
Integrated Circuits. Objectives –At the completion of this unit, the student should be able to: Explain the importance of integrated circuits. Identify.
Thermal Design And Analysis of High Power Electronic Boards J. Collado CHT, April 13, 2000.
McGraw-Hill © 2008 The McGraw-Hill Companies Inc. All rights reserved. Electronics Principles & Applications Seventh Edition Chapter 1 Introduction (student.
Electricity & Magnetism Word Challenge. Some computer chips are made of a substance that conducts electric current better than an insulator but not as.
Pure Tungsten As a high performance materials, Pure Tungsten has high melting temperature, high density, low vapor pressure, low thermal expansion combined.
Supporting the Electronic Manufacturing Services market CONFIDENTIAL: All contents copyright of Illinois Tool Works, Inc. (ITW). The ITW Photonics Group,
Light Emitting Diodes (LEDs) By: Love Lor “There are numerous sources used for lighting. The ideal light source is definitely one that has lower costs.
Presented at MCC/EIA/SEMATECH KGD Industry Workshop September 19, 1997
DAELIM PLAVIS Parts for SEMICONDUCTOR Vacuum Pick-up Tools ; To stable pick-up chips during packaging process. PLAVIS vacuum collets meet needs for processing.
Key Trends High frequency serial interface data rate is scaling significantly faster than tester capability to test them High frequency (analog and digital)
History of Integrated Circuits In 1961 the first commercially available integrated circuits came from the Fairchild Semiconductor Corporation. The.
CARBON NANOTUBES (A SOLUTION FOR IC INTERCONNECT) By G. Abhilash 10H61D5720.
Output Stages and Power Amplifiers Classification of Output Stages Class A,B & AB Biasing AB Power BJT.
How engineers in 1954 expected a computer to look like in 2004.
Electronic Pack….. Chapter 4 Components for Electronic Systems Slide 1 Chapter 4 Components for Electronic Systems Description of geometrical, thermal.
Loctite PSX-D and PSX-P Thermal Interface Materials
Electronic Components Circuit/Schematic Symbols. RESISTOR Resistors restrict the flow of electric current, for example a resistor is placed in series.
1-1 © 2013 The McGraw-Hill Companies, Inc. All rights reserved. McGraw-Hill Electronics Principles & Applications Eighth Edition Chapter 1 Introduction.
Principles & Applications
IC packaging and Input - output signals
TECHNICAL SEMINAR ON TECHNOLOGIES AND DESIGNS FOR ELECTRONIC NANOCOMPUTERS PRESENTED BY : BIJAY KUMAR XESS ADMN NO : 4 I&E/2K.
1 DATA I/O CONFIDENTIAL Reliability and Quality in Mission Critical Programming Data I/O Corporation One bent component lead in a mission- critical electronics.
DISTRIBUTED CRYOGENIC COOLING WITH MINIATURIZED FLUID CIRCUITS Steffen Grohmann, ETT/TT RD39 Collaboration ST Workshop 2003 CERN, April 01-03, 2003.
© International Rectifier DirectFET MOSFETs Double Current Density In High Current DC-DC Converters With Double Sided Cooling.
Precision ERS capabilities presentation 2016 Precision ERS capabilities presentation 2016 Repair Solutions for a Legacy Network.
Technical Writing Iman ElMahallawi, BUE Introduction to Technical Writing 1 st Year Engineering Students Development of Paragraphs.
ADVANCED HIGH DENSITY INTERCONNECT MATERIALS AND TECHNIQUES DIVYA CHALLA.
Global Surface Mount Technology Market Share, Global Trends, Analysis, Research, Report, Opportunities, Segmentation and.
Passive Components: Capacitors & Resistors
Electronics Cooling MPE 635 Mechanical Power Engineering Dept.
Intro to Logic Gates & Datasheets
Electronics Cooling Mechanical Power Engineering Dept.
Wafer Level Packaging: A Foundry Perspective
A Comparison of Varistors and Diodes
| 1 © 2013 Universal Lighting Technologies ULT Marketing LED Product Capabilities.
© 2017 SlidePlayer.com Inc. All rights reserved.